High-voltage lateral GaN-on-silicon Schottky diode

• US 10,651,317 B2
• Filed: 07/29/2016
• Issued: 05/12/2020
• Est. Priority Date: 04/15/2016
• Status: Active Grant

• Current Assignee: MACOM Technology Solutions Holdings, Inc.
• Original Assignee: MACOM Technology Solutions Holdings, Inc.
• Inventors: Kaleta, Anthony, Carlson, Douglas, Boles, Timothy E.
• Primary Examiner(s): Hu, Shouxiang
• Application Number:
  US15/223,455
• Publication Number:
  US 20170301798A1
• Time in Patent Office: 1,383 Days
• Field of Search: 257487, 257192, 257615, 257200, 257471
• CPC Class Codes: H01L 21/761 PN junctions
• CPC Class Codes: H01L 29/0646 PN junctions
• CPC Class Codes: H01L 29/0649 Dielectric regions, e.g. SiO2 regions, air gaps
• CPC Class Codes: H01L 29/2003 Nitride compounds
• CPC Class Codes: H01L 29/205 in different semiconductor regions , e.g. heterojunctions
• CPC Class Codes: H01L 29/402 Field plates
• CPC Class Codes: H01L 29/404 Multiple field plate structures
• CPC Class Codes: H01L 29/47 Schottky barrier electrodes H01L29/435 takes precedence
• CPC Class Codes: H01L 29/66143 Schottky diodes
• CPC Class Codes: H01L 29/66212 Schottky diodes
• CPC Class Codes: H01L 29/7786 with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
• CPC Class Codes: H01L 29/861 Diodes
• CPC Class Codes: H01L 29/872 Schottky diodes
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

High-voltage, gallium-nitride Schottky diodes are described that are capable of withstanding reverse-bias voltages of up to and in excess of 2000 V with reverse current leakage as low as 0.4 microamp/millimeter. A Schottky diode may comprise a lateral geometry having an anode located between two cathodes, where the anode-to-cathode spacing can be less than about 20 microns. A diode may include at least one field plate connected to the anode that extends above and beyond the anode towards the cathodes.

Claims

1. A Schottky diode comprising:

a gallium-nitride conduction layer;

a buffer layer formed between the gallium-nitride conduction layer and a substrate, wherein a combined thickness of the buffer layer and gallium-nitride conduction layer is at least 4.5 microns;

a barrier layer formed adjacent to the gallium-nitride conduction layer;

a first cathode and a second cathode spaced apart and in electrical contact with the conduction layer;

an anode formed adjacent to the barrier layer between the first cathode and the second cathode, wherein the barrier layer extends under the anode between the anode and the gallium-nitride conduction layer; and

at least one anode-connected field plate electrically connected to the anode and extending on opposite edges beyond the anode toward the first cathode and the second cathode, wherein outer edges of any one of the at least one anode-connected field plate are spaced at least 3 microns from the first cathode and the second cathode and the Schottky diode is capable of withstanding a reverse bias voltage as much as 1000 volts, wherein the at least one anode-connected field plate comprises a first field plate contacting the anode and a second field plate above the first field plate and contacting the first field plate only at non-outer edge portions,

wherein the at least one anode-connected filed plate comprises a first field plate contacting the anode and a second field plate above and contacting the first field plate only at non-outer-edge portions thereof.

2. The Schottky diode of claim 1 capable of withstanding a reverse bias voltage as much as 1200 volts.

3. The Schottky diode of claim 1, wherein the substrate comprises silicon.

4. The Schottky diode of claim 1, wherein the barrier layer comprises aluminum gallium nitride.

5. The Schottky diode of claim 1, further comprising a gallium-nitride cap layer formed over the barrier layer.

6. The Schottky diode of claim 1, further comprising electrical isolation regions formed adjacent to the first cathode and the second cathode, wherein the electrical isolation regions comprise damaged crystalline semiconductor that includes one or more of the following implanted ion species:

nitrogen, phosphorous, boron, and argon.

7. The Schottky diode of claim 1, further comprising at least one additional anode spaced laterally from the first or second cathode and electrically connected to the anode.

8. The Schottky diode of claim 1, wherein a distance between an edge of the first or second cathode and an edge of the anode is less than 20 microns.

9. The Schottky diode of claim 1, wherein a distance between an edge of the first or second cathode and an edge of the anode is less than 15 microns.

10. The Schottky diode of claim 1 wherein

the first field plate electrically connected to the anode and extends on opposite edges beyond the anode toward the first cathode and the second cathode by a first distance;

and

the second field plate extends on opposite edges beyond the first field plate toward the first cathode and the second cathode by a second distance.

11. The Schottky diode of claim 10, wherein the second distance is less than the first distance.

12. The Schottky diode of claim 10, further comprising:

a first insulating dielectric layer between at least a portion of the barrier layer and at least a portion of the first anode-connected field plate; and

a second insulating dielectric layer separating at least a portion of the first anode-connected field plate and at least a portion of the second anode-connected field plate.

13. The Schottky diode of claim 12, wherein a thickness of the first insulating dielectric layer is between approximately 30 nm and approximately 100 nm, and a thickness of the second insulating dielectric layer is between approximately 300 nm and approximately 600 nm.

14. The Schottky diode of claim 10, wherein a distance between an outer edge of the second field plate and an outer edge of the first field plate is between approximately 1 micron and approximately 4 microns.

15. The Schottky diode of claim 10, wherein an outer edge of the anode, an outer edge of the first field plate, and an outer edge of the second field plate lie approximately along a curve bending away from the barrier layer.

16. The Schottky diode of claim 10, wherein the anode, first cathode, second cathode, and first field plate are formed of a same material.

17. The Schottky diode of claim 10, wherein the at least one anode-connected field plate further comprises a third field plate electrically connected to the second field plate and extending on opposite edges beyond the second field plate toward the first cathode and the second cathode by a third distance.

18. The Schottky diode of claim 17, capable of withstanding a reverse bias voltage as much as 1500 volts.

19. The Schottky diode of claim 17, capable of withstanding a reverse bias voltage as much as 2000 volts.

20. The Schottky diode of claim 17, wherein the third distance is less than the second distance.

21. The Schottky diode of claim 17, wherein an outer edge of the anode, an outer edge of the first field plate, an outer edge of the second field plate, and an outer edge of the third field plate lie approximately along a curve bending away from the barrier layer.

22. The Schottky diode of claim 17, wherein a distance between the first or second cathode and an edge of the anode is between approximately 10 microns and approximately 20 microns.

23. The Schottky diode of claim 1, included in a power converter.

24. A Schottky diode comprising:

a gallium-nitride conduction layer;

a buffer layer formed between the gallium-nitride conduction layer and a substrate;

a barrier layer formed adjacent to the gallium-nitride conduction layer;

a first cathode and a second cathode spaced apart and in electrical contact with the conduction layer;

an anode formed adjacent to the barrier layer and laterally spaced between the first cathode and the second cathode; and

a plurality of anode-connected field plates electrically connected to the anode and extending on opposite edges beyond the anode toward the first cathode and the second cathode, wherein an outer edge of a first anode-connected field plate adjacent to the anode does not contact an adjacent second anode-connected field plate and wherein the Schottky diode is capable of withstanding a reverse bias voltage as much as 1000 volts, wherein an edge of the anode is spaced no more than 10 microns from an edge of the first cathode, and wherein the first and second anode-connected field plates contact each other at their center portions.