Redirection of electromagnetic signals using substrate structures
First Claim
Patent Images
1. A system comprising:
- a substrate assembly of a printed circuit board (PCB), the substrate assembly comprising;
a first conductive layer including an aperture,a second conductive layer parallel to, spaced from, and opposite the first conductive layer,a dielectric layer extending between the first and second conductive layers, anda plurality of electrically conductive components connected to and extending between the first and second conductive layers, the conductive components being spaced apart and distributed in the dielectric layer, the conductive components in combination with the first and second conductive layers together defining a waveguide extending through a portion of the dielectric layer; and
a transducer to convert an electrical signal into extremely high frequency (EHF) radiation and to transmit the EHF radiation through a first end of the waveguide aligned with the aperture towards a second end of the waveguide, the transducer positioned outside the aperture and being a part of an integrated circuit (IC) package, the IC package mounted on an area of the PCB not overlapping with the waveguide.
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Abstract
A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.
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Citations
20 Claims
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1. A system comprising:
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a substrate assembly of a printed circuit board (PCB), the substrate assembly comprising; a first conductive layer including an aperture, a second conductive layer parallel to, spaced from, and opposite the first conductive layer, a dielectric layer extending between the first and second conductive layers, and a plurality of electrically conductive components connected to and extending between the first and second conductive layers, the conductive components being spaced apart and distributed in the dielectric layer, the conductive components in combination with the first and second conductive layers together defining a waveguide extending through a portion of the dielectric layer; and a transducer to convert an electrical signal into extremely high frequency (EHF) radiation and to transmit the EHF radiation through a first end of the waveguide aligned with the aperture towards a second end of the waveguide, the transducer positioned outside the aperture and being a part of an integrated circuit (IC) package, the IC package mounted on an area of the PCB not overlapping with the waveguide. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system comprising:
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a printed circuit board (PCB) comprising; a first conductive layer including an aperture, a second conductive layer parallel to, spaced from, and opposite the first conductive layer, a dielectric layer extending between the first and second conductive layers, and a plurality of electrically conductive components connected to and extending between the first and second conductive layers, the conductive components being spaced apart and distributed in the dielectric layer, the conductive components in combination with the first and second conductive layers together defining a waveguide extending through a portion of the dielectric layer; and an integrated circuit (IC) package mounted on an area of the PCB not overlapping with the waveguide, the IC package including a transducer positioned outside the aperture configured to convert an electrical signal into extremely high frequency (EHF) radiation and to transmit the EHF radiation through a first end of the waveguide aligned with the aperture towards a second end of the waveguide. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification