Redirection of electromagnetic signals using substrate structures

• US 10,651,559 B2
• Filed: 01/06/2017
• Issued: 05/12/2020
• Est. Priority Date: 03/28/2012
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: Sovero, Emilio, McCormack, Gary D.
• Primary Examiner(s): Tran, Hai V
• Assistant Examiner(s): Bouizza, Michael M
• Application Number:
  US15/400,762
• Publication Number:
  US 20170117636A1
• Time in Patent Office: 1,222 Days
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01P 3/006 Conductor backed coplanar waveguides
• CPC Class Codes: H01P 3/121 integrated in a substrate
• CPC Class Codes: H01Q 1/24 with receiving set
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 13/103 with variable reactance for tuning the antenna tuning resonant circuits H03J
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/0919 Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2201/2036 : Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Abstract

A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.

Claims

1. A system comprising:

a substrate assembly of a printed circuit board (PCB), the substrate assembly comprising;

a first conductive layer including an aperture,

a second conductive layer parallel to, spaced from, and opposite the first conductive layer,

a dielectric layer extending between the first and second conductive layers, and

a plurality of electrically conductive components connected to and extending between the first and second conductive layers, the conductive components being spaced apart and distributed in the dielectric layer, the conductive components in combination with the first and second conductive layers together defining a waveguide extending through a portion of the dielectric layer; and

a transducer to convert an electrical signal into extremely high frequency (EHF) radiation and to transmit the EHF radiation through a first end of the waveguide aligned with the aperture towards a second end of the waveguide, the transducer positioned outside the aperture and being a part of an integrated circuit (IC) package, the IC package mounted on an area of the PCB not overlapping with the waveguide.

2. The system of claim 1, wherein the plurality of conductive components includes a plurality of conductive vias disposed at intervals along at least a portion of one side of the waveguide.

3. The system of claim 2, wherein the vias also extend across the opposite sides of the waveguide and define a third side of the waveguide along an edge of the aperture opposite the second end of the waveguide, to form a corner in the waveguide with the first or second side, with the aperture being disposed on a side of the waveguide formed by the first conductive layer.

4. The system of claim 2, wherein the plurality of conductive components further includes a plurality of spaced apart conductive layers disposed between and parallel with the first and second conductive layers, with each pair of adjacent conductive layers separated by a corresponding portion of the dielectric layer, the plurality of conductive layers having respective apertures having edges defining the waveguide, the plurality of conductive vias extending through the plurality of conductive layers along the edges of the respective apertures of the plurality of conductive layers.

5. The system of claim 2, wherein the plurality of conductive vias includes a first plurality of conductive vias disposed at intervals along a first side of the waveguide and a second plurality of conductive vias disposed at intervals along a second side of the waveguide, the first and second sides corresponding to opposite sides of the waveguide.

6. The system of claim 5, wherein the aperture is aligned with and in communication with the waveguide.

7. The system of claim 5, wherein the IC package is configured to emit the EHF radiation having a frequency range, and wherein a width of the waveguide between the first and second sides is at least half of a wavelength of a lowest frequency EHF signal that the waveguide is designed to operate.

8. The system of claim 1, wherein the transducer is an antenna, and the system further includes the IC package.

9. The system of claim 1, wherein the plurality of conductive components includes a plurality of spaced apart conductive layers disposed between and parallel with the first and second conductive layers, with each pair of adjacent conductive layers separated by a corresponding portion of the dielectric layer, the plurality of conductive layers having respective apertures having edges defining the waveguide.

10. The system of claim 1, further comprising a second transducer disposed in spaced relationship to the aperture of the first conductive layer and adjacent to an opening corresponding to the second end of the waveguide.

11. The system of claim 1, wherein the waveguide corresponds to a space within the dielectric layer defined by the plurality of electrically conductive components.

12. The system of claim 1, further comprising a second transducer configured to receive the electromagnetic radiation disposed adjacent to the second end of the waveguide.

13. A system comprising:

a printed circuit board (PCB) comprising;

a first conductive layer including an aperture,

a second conductive layer parallel to, spaced from, and opposite the first conductive layer,

a dielectric layer extending between the first and second conductive layers, and

a plurality of electrically conductive components connected to and extending between the first and second conductive layers, the conductive components being spaced apart and distributed in the dielectric layer, the conductive components in combination with the first and second conductive layers together defining a waveguide extending through a portion of the dielectric layer; and

an integrated circuit (IC) package mounted on an area of the PCB not overlapping with the waveguide, the IC package including a transducer positioned outside the aperture configured to convert an electrical signal into extremely high frequency (EHF) radiation and to transmit the EHF radiation through a first end of the waveguide aligned with the aperture towards a second end of the waveguide.

14. The system of claim 13, wherein the plurality of conductive components includes a plurality of conductive vias disposed at intervals along at least a portion of one side of the waveguide.

15. The system of claim 14, wherein the plurality of conductive vias includes:

a first plurality of conductive vias disposed at intervals along a first side of the waveguide,

a second plurality of conductive vias disposed at intervals along a second side of the waveguide, the first and second sides corresponding to opposite sides of the waveguide.

16. The system of claim 15, wherein the IC package is configured to emit the EHF radiation having a frequency range, and wherein a width of the waveguide between the first and second sides is at least half of a wavelength of a lowest frequency EHF signal that the waveguide is designed to operate.

17. The system of claim 15, wherein the plurality of conductive vias further includes a third plurality of conductive vias extending across the opposite sides of the waveguide and defining a third side of the waveguide along an edge of the aperture opposite and the second end of the waveguide.

18. The system of claim 13, wherein the plurality of conductive components further includes a plurality of spaced apart conductive layers disposed between and parallel with the first and second conductive layers, with each pair of adjacent conductive layers separated by a corresponding portion of the dielectric layer, the plurality of conductive layers having respective apertures having edges defining the waveguide, the plurality of conductive components extending through the plurality of conductive layers along the edges of the respective apertures of the plurality of conductive layers.

19. The system of claim 13, further comprising a second IC package having a second transducer disposed in spaced relationship to the aperture of the first conductive layer and adjacent to an opening corresponding to the second end of the waveguide.

20. The system of claim 13, wherein the waveguide corresponds to a space within the dielectric layer defined by the plurality of electrically conductive components.