Electronic device and manufacturing method thereof

• US 10,653,012 B2
• Filed: 09/19/2018
• Issued: 05/12/2020
• Est. Priority Date: 10/24/2017
• Status: Active Grant

• Current Assignee: Gio Optoelectronics Corp. (InnoLux Corporation)
• Original Assignee: Gio Optoelectronics Corp. (InnoLux Corporation)
• Inventors: Li, Chin-Tang
• Primary Examiner(s): Norris, Jeremy C
• Application Number:
  US16/135,492
• Publication Number:
  US 20190124764A1
• Time in Patent Office: 601 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 2201/0373 Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2203/0353 Making conductive layer thin, e.g. by etching selective thinning for providing different thickness H05K2203/0369
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/4076 by thin-film techniques
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.

Claims

1. An electronic device, comprising:

a circuit board, comprising;

a substrate,

at least a thin-film conductive line disposed on the substrate, and

at least an electrical connection pad disposed on the substrate and electrically connected with the thin-film conductive line; and

at least an electronic element disposed on the electrical connection pad and electrically connected with the thin-film conductive line via the electrical connection pad,

wherein the electronic element is electrically connected with the electrical connection pad by eutectic bonding, the electrical connection pad directly contacts the thin-film conductive line, a thickness of the electrical connection pad is between 3 μ

m and 20 μ

m, a porosity of the electrical connection pad is greater than or equal to 5%, and is less than or equal to 40%.

2. The electronic device according to claim 1, wherein the substrate is a flexible substrate or a hard substrate.

3. The electronic device according to claim 2, wherein the flexible substrate comprises an organic polymer material, and a glass transition temperature of the organic polymer material is between 250°

C. and 600°

C.

4. The electronic device according to claim 1, wherein a width of at least a part of the thin-film conductive line is between 1 μ

m and 10 μ

m.

5. The electronic device according to claim 1, wherein a thickness of the thin-film conductive line is less than 3 m.

6. The electronic device according to claim 1, wherein a material of the electrical connection pad comprises copper powder and polymer material.

7. The electronic device according to claim 1, further comprising:

an insulation layer covering at least a part of the thin-film conductive line.

8. The electronic device according to claim 1, wherein the electrical connection pad comprises a body portion and an extension portion, the extension portion is extended in parallel with the substrate from the body portion, the electronic element is connected to the body portion, and the extension portion is connected to the thin-film conductive line.

9. The electronic device according to claim 8, wherein a width or a thickness of the body portion is different from a width or a thickness of the extension portion.

10. The electronic device according to claim 8, wherein the extension portion at least partially covers the thin-film conductive line.

11. The electronic device according to claim 1, wherein the electronic element is an SMD, an IC or a control circuit board.

12. The electronic device according to claim 1, further comprising:

a conductive material disposed on the substrate, wherein an electrode of the electronic element is electrically connected with the electrical connection pad and the thin-film conductive line via the conductive material.

13. The electronic device according to claim 1, wherein the electrical connection pad is a single-structured layer.

14. The electronic device according to claim 13, wherein a material of the electrical connection pad comprises copper powder.

15. A manufacturing method of an electronic device, comprising steps of:

forming at least a thin-film conductive line on a substrate by a thin-film process;

forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and

disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad,

wherein the electronic element is electrically connected with the electrical connection pad by eutectic bonding, the electrical connection pad directly contacts the thin-film conductive line, a thickness of the electrical connection pad is between 3 μ

m and 20 μ

m, a porosity of the electrical connection pad is greater than or equal to 5%, and is less than or equal to 40%.

16. The manufacturing method according to claim 15, further comprising a step of:

forming the substrate on a rigid carrier plate.

17. The manufacturing method according to claim 15, wherein the printing process is a non-vacuum printing process.

18. The manufacturing method according to claim 15, further comprising a step of:

forming an insulation layer on the substrate, wherein the insulation layer at least partially covers the thin-film conductive line.

19. The manufacturing method according to claim 16, further comprising a step of:

performing multiple times of the printing process for increasing a width or the thickness of the electrical connection pad.

20. The manufacturing method according to claim 15, wherein the electrical connection pad is a single-structured layer, and a material of the electrical connection pad comprises copper powder.