Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods

• US 10,653,033 B1
• Filed: 10/30/2018
• Issued: 05/12/2020
• Est. Priority Date: 10/30/2018
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Qu, Xiaopeng, Chun, Hyunsuk
• Primary Examiner(s): Dravininkas, Adam B
• Application Number:
  US16/174,810
• Publication Number:
  US 20200137923A1
• Time in Patent Office: 560 Days
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20172 Fan mounting or fan specifications

Abstract

Kits for cooling computing devices may include at least one heat-generating component and a fan. A first duct may be sized and shaped to surround the at least one heat-generating component on three sides to direct a portion of air flow from the fan. A second duct may be sized and shaped to extend over the first duct and direct another portion of air flow between the first and second ducts. The at least one heat-generating component may comprise multiple vertically and longitudinally aligned memory modules Computing devices, electronic systems and methods of cooling are also disclosed.

Claims

1. A kit for cooling a computing device, comprising:

a fan;

a first duct sized and shaped to surround at least one heat-generating electronic component longitudinally aligned with the first duct on three sides of the at least one heat-generating electronic component and to direct air flow from the fan over and around the at least one heat-generating electronic component; and

a second duct sized and shaped to extend over the first duct in alignment therewith on at least one side, such that the first duct is interposed between the at least one heat-generating electronic component and the second duct and a longitudinally extending volume exists between the first duct and the second duct;

wherein the first duct comprises a heat sink structure located on an exterior side of the first duct.

2. The kit of claim 1, wherein a height of the first duct positioned to be located proximate to the at least one heat-generating component is greater than, or at least substantially equal to, a height of an upper extent of the at least one heat-generating component.

3. The kit of claim 1, wherein the heat sink is integral to a remainder of the first duct.

4. The kit of claim 1, wherein the heat sink is distinct from, and secured to, a remainder of the first duct.

5. The kit of claim 1, wherein the first duct comprises a metal material.

6. The kit of claim 1, wherein the second duct comprises a metal material or a polymer material.

7. The kit of claim 1, wherein the second duct surrounds the first duct on three sides thereof and the longitudinally extending volume is of U-shaped cross-section.

8. The kit of claim 1, wherein side walls of the second duct are substantially aligned with side walls of the first duct and secured to the first duct, the longitudinally extending volume existing between a top surface of the first duct and an interior of the second duct.

9. A computing device, comprising:

multiple, vertically and longitudinally extending, mutually adjacent heat-generating components;

at least one fan proximate a longitudinal end of the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components;

a first longitudinally extending duct aligned with and surrounding the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components on three sides, the first duct positioned to direct air flow from the fan within the duct around and between multiple, vertically and longitudinally extending, mutually adjacent heat-generating components; and

a second duct extending over the first duct and providing a longitudinally extending volume between the first duct and the second duct for air flow from the at least one fan,

wherein the first duct comprises a heat sink structure located on an upper surface of the first duct opposite the multiple, vertically and longitudinally extending mutually adjacent heat-generating components, the heat sink structure thermally coupled to the multiple, vertically and longitudinally extending mutually adjacent heat-generating component.

10. The computing device of claim 9, wherein an underlying surface of the first duct is spaced from the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components.

11. The computing device of claim 9, wherein an underlying surface of the first duct is in thermal contact with the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components.

12. The computing device of claim 9, wherein the first duct and the heat sink structure comprise a unitary structure.

13. The computing device of claim 9, wherein the heat sink structure is a separate structure from the first duct, and secured to the first duct.

14. The computing device of claim 9, wherein the first duct comprises a metal or metal alloy material.

15. The computing device of claim 9, wherein the second duct comprises a metal material or a polymer material.

16. The computing device of claim 9, further comprising at least one processor, the at least one processor located between the at least one fan and the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components.

17. The computing device of claim 16, wherein the second duct extends longitudinally closer to the at least one processor than the first duct.

18. The computing device of claim 9, wherein the second duct extends over the first duct in spaced relation thereto, forming the longitudinally extending volume in a U-shaped cross-section.

19. The computing device of claim 18, wherein the first duct and the second duct are of a substantially common lateral extent with substantially mutually vertically aligned side walls to constrain the longitudinally extending volume between a top surface of the first duct and an interior of the second duct.

20. An electronic system, comprising:

an input device;

an output device;

a processor in operable communication with the input device and the output device;

multiple longitudinally and vertically aligned memory modules in operable communication with the processor; and

a cooling assembly comprising;

at least one fan positioned to direct air flow toward and past the multiple longitudinally and vertically aligned memory modules;

a first duct extending over and aligned with the multiple longitudinally and vertically aligned memory modules; and

a second duct over the first duct defining a longitudinally extending volume therebetween;

wherein the first duct comprises a heat sink structure located on an exterior side of the first duct.

21. The electronic system of claim 20, wherein the longitudinally extending volume extends around sides of the first duct.

22. A method of cooling multiple longitudinally and vertically aligned memory modules, the method comprising:

directing air flow toward the multiple longitudinally and vertically aligned memory modules;

constraining a portion of the air flow around and between the multiple longitudinally and vertically aligned memory modules with a first duct;

constraining another portion of the air flow within a volume between at least an upper surface of the first duct and an interior of a second duct extending over the first duct, and dissipating heat utilizing a heat sink structure located on an exterior side of the first duct.

23. The method of claim 22, wherein constraining the other portion of the air flow within a volume between at least an upper surface of the first duct and an interior of a second duct extending over the first duct further comprises constraining the other portion within a volume extending between sides of the first duct and sides of the second duct.