Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods
First Claim
Patent Images
1. A kit for cooling a computing device, comprising:
- a fan;
a first duct sized and shaped to surround at least one heat-generating electronic component longitudinally aligned with the first duct on three sides of the at least one heat-generating electronic component and to direct air flow from the fan over and around the at least one heat-generating electronic component; and
a second duct sized and shaped to extend over the first duct in alignment therewith on at least one side, such that the first duct is interposed between the at least one heat-generating electronic component and the second duct and a longitudinally extending volume exists between the first duct and the second duct;
wherein the first duct comprises a heat sink structure located on an exterior side of the first duct.
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Abstract
Kits for cooling computing devices may include at least one heat-generating component and a fan. A first duct may be sized and shaped to surround the at least one heat-generating component on three sides to direct a portion of air flow from the fan. A second duct may be sized and shaped to extend over the first duct and direct another portion of air flow between the first and second ducts. The at least one heat-generating component may comprise multiple vertically and longitudinally aligned memory modules Computing devices, electronic systems and methods of cooling are also disclosed.
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Citations
23 Claims
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1. A kit for cooling a computing device, comprising:
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a fan; a first duct sized and shaped to surround at least one heat-generating electronic component longitudinally aligned with the first duct on three sides of the at least one heat-generating electronic component and to direct air flow from the fan over and around the at least one heat-generating electronic component; and a second duct sized and shaped to extend over the first duct in alignment therewith on at least one side, such that the first duct is interposed between the at least one heat-generating electronic component and the second duct and a longitudinally extending volume exists between the first duct and the second duct; wherein the first duct comprises a heat sink structure located on an exterior side of the first duct. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A computing device, comprising:
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multiple, vertically and longitudinally extending, mutually adjacent heat-generating components; at least one fan proximate a longitudinal end of the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components; a first longitudinally extending duct aligned with and surrounding the multiple, vertically and longitudinally extending, mutually adjacent heat-generating components on three sides, the first duct positioned to direct air flow from the fan within the duct around and between multiple, vertically and longitudinally extending, mutually adjacent heat-generating components; and a second duct extending over the first duct and providing a longitudinally extending volume between the first duct and the second duct for air flow from the at least one fan, wherein the first duct comprises a heat sink structure located on an upper surface of the first duct opposite the multiple, vertically and longitudinally extending mutually adjacent heat-generating components, the heat sink structure thermally coupled to the multiple, vertically and longitudinally extending mutually adjacent heat-generating component. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An electronic system, comprising:
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an input device; an output device; a processor in operable communication with the input device and the output device; multiple longitudinally and vertically aligned memory modules in operable communication with the processor; and a cooling assembly comprising; at least one fan positioned to direct air flow toward and past the multiple longitudinally and vertically aligned memory modules; a first duct extending over and aligned with the multiple longitudinally and vertically aligned memory modules; and a second duct over the first duct defining a longitudinally extending volume therebetween; wherein the first duct comprises a heat sink structure located on an exterior side of the first duct. - View Dependent Claims (21)
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22. A method of cooling multiple longitudinally and vertically aligned memory modules, the method comprising:
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directing air flow toward the multiple longitudinally and vertically aligned memory modules; constraining a portion of the air flow around and between the multiple longitudinally and vertically aligned memory modules with a first duct; constraining another portion of the air flow within a volume between at least an upper surface of the first duct and an interior of a second duct extending over the first duct, and dissipating heat utilizing a heat sink structure located on an exterior side of the first duct. - View Dependent Claims (23)
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Specification