Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
First Claim
Patent Images
1. A device comprising:
- a flexible printed circuit board having a plurality of discrete operative devices electrically interconnected and one or more contact pads on a backside of the flexible printed circuit board; and
a plurality of conductive stiffeners affixed to the backside of the flexible printed circuit board, each conductive stiffener electrically connecting at least one contact pad of the flexible printed circuit board to a bottom surface of the conductive stiffener and comprising;
a non-conductive substrate sheet;
a hole through the non-conductive substrate sheet; and
a conductive material forming a pad on a bottom surface of the non-conductive substrate sheet and lining the hole, wherein the pad of conductive material is electrically connected to a top surface of the non-conductive substrate sheet through the conductive material lining the hole,wherein the conductive material forms a pad on the top surface of the non-conductive substrate sheet, and the pad of conductive material on the top surface comprises a thermal relief pattern in the conductive material surrounding the hole.
3 Assignments
0 Petitions
Accused Products
Abstract
A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.
-
Citations
31 Claims
-
1. A device comprising:
-
a flexible printed circuit board having a plurality of discrete operative devices electrically interconnected and one or more contact pads on a backside of the flexible printed circuit board; and a plurality of conductive stiffeners affixed to the backside of the flexible printed circuit board, each conductive stiffener electrically connecting at least one contact pad of the flexible printed circuit board to a bottom surface of the conductive stiffener and comprising; a non-conductive substrate sheet; a hole through the non-conductive substrate sheet; and a conductive material forming a pad on a bottom surface of the non-conductive substrate sheet and lining the hole, wherein the pad of conductive material is electrically connected to a top surface of the non-conductive substrate sheet through the conductive material lining the hole, wherein the conductive material forms a pad on the top surface of the non-conductive substrate sheet, and the pad of conductive material on the top surface comprises a thermal relief pattern in the conductive material surrounding the hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A device comprising:
-
a flexible printed circuit board having a plurality of discrete operative devices electrically interconnected and one or more contact pads on a backside of the flexible printed circuit board; and a plurality of conductive stiffeners affixed to the backside of the flexible printed circuit board, each conductive stiffener electrically connecting at least one contact pad of the flexible printed circuit board to a bottom surface of the conductive stiffener and comprising; a non-conductive substrate sheet; a hole through the non-conductive substrate sheet; and a conductive material forming a pad on a bottom surface of the non-conductive substrate sheet and lining the hole, wherein the pad of conductive material is electrically connected to a top surface of the non-conductive substrate sheet through the conductive material lining the hole, wherein the conductive material forms a pad on the top surface of the non-conductive substrate sheet, and the pad of conductive material on the top surface is 0.0014 inches thick. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
-
Specification