Shielded semiconductor device and lead frame therefor
First Claim
1. An article of manufacture, comprising:
- a lead frame, wherein the lead frame includes a die receiving area, a plurality of leads disposed on at least one side of the die receiving area and that are generally perpendicular to the at least one side of the die receiving area, wherein each lead of the plurality of leads has an inner lead end that is spaced from but near to the at least one side of the die receiving area and an outer lead end that is distal to the at least one side of the die receiving area, and a strip formed in the die receiving area that is bendable to a substantially vertical position for electrical connection to a package lid, and wherein the die receiving area, the plurality of leads, and the strip are all formed of the same electrically conductive sheet material.
1 Assignment
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Accused Products
Abstract
A shielded semiconductor device is assembled using a lead frame having a die receiving area, leads disposed around the die receiving area, and a bendable strip formed in the die receiving area. Each lead has an inner lead end that is spaced from but near to one of the sides of the die receiving area and an outer lead end that is distal to that side of the die receiving area. An IC die is attached to the die receiving area and electrically connected to the inner lead ends of the leads. An encapsulant is formed over the die and the electrical connections and forms a body. The strip is bent to extend vertically to a top side of the body. A lid is formed on the top side of the body and is in contact with a distal end of the vertical strip.
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Citations
20 Claims
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1. An article of manufacture, comprising:
a lead frame, wherein the lead frame includes a die receiving area, a plurality of leads disposed on at least one side of the die receiving area and that are generally perpendicular to the at least one side of the die receiving area, wherein each lead of the plurality of leads has an inner lead end that is spaced from but near to the at least one side of the die receiving area and an outer lead end that is distal to the at least one side of the die receiving area, and a strip formed in the die receiving area that is bendable to a substantially vertical position for electrical connection to a package lid, and wherein the die receiving area, the plurality of leads, and the strip are all formed of the same electrically conductive sheet material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A shielded semiconductor device comprising:
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a lead frame including a die receiving area, a plurality of leads disposed on at least one side of the die receiving area and that are generally perpendicular to the at least one side of the die receiving area, wherein each lead of the plurality of leads has an inner lead end that is spaced from but near to the at least one side of the die receiving area and an outer lead end that is distal to the at least one side of the die receiving area, and a strip formed in the die receiving area that is bent to a substantially vertical position, and wherein the die receiving area, the plurality of leads, and the strip are all formed of the same electrically conductive sheet material; a first integrated circuit die attached to the die receiving area and electrically connected to the inner lead ends of the plurality of leads; an encapsulant formed over the first die and the electrical connections between the first die and the plurality of inner lead ends, wherein the encapsulant forms a body, and wherein the strip extends vertically to an upper edge of the body; and a package lid formed on the upper edge of the body and in contact with a distal end of the vertical strip such that the vertical strip is in electrical communication with the package lid. - View Dependent Claims (15)
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16. A method of assembling a shielded semiconductor device, comprising:
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providing a lead frame including a die receiving area, a plurality of leads disposed on at least one side of the die receiving area and that are generally perpendicular to the at least one side of the die receiving area, wherein each lead of the plurality of leads has an inner lead end that is spaced from but near to the at least one side of the die receiving area and an outer lead end that is distal to the at least one side of the die receiving area, and a strip formed in the die receiving area that is bent to a substantially vertical position for electrical connection to a package lid, and wherein the die receiving area, the plurality of leads, and the strip are all formed of the same electrically conductive sheet material; attaching a first integrated circuit (IC) die to the die receiving area of the lead frame; electrically connecting the first IC die to the inner lead ends of the plurality of leads; encapsulating the first IC die, the electrical connections and the lead frame with a molding compound, wherein the molding compound forms a body and wherein the distal ends of the plurality of leads are exposed along at least one lateral side of the body and a distal end of the vertical strip is exposed at a top surface of the body; and forming a metallic lid on the top surface of the body, wherein the exposed distal end of the vertical strip contacts the package lid such that the vertical strip is in electrical communication with the package lid. - View Dependent Claims (17, 18, 19, 20)
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Specification