Package structure for optical fiber and method for forming the same
First Claim
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1. A package structure, comprising:
- an optical component over a substrate;
a reflector disposed over the substrate, wherein the reflector comprises;
a first semiconductor layer over a second semiconductor layer;
a dielectric layer between the first semiconductor layer and the second semiconductor layer; and
a metal layer between the second semiconductor layer and the substrate;
a waveguide between the metal layer and the optical component; and
a passivation layer covering the optical component and the waveguide, wherein a portion of the passivation layer is directly under the metal layer of the reflector.
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Abstract
A package structure is provided. The package structure includes an optical component over a substrate, and a reflector disposed over the substrate. The reflector includes a first semiconductor layer over a second semiconductor layer, and a dielectric layer between the first semiconductor layer and the second semiconductor layer. The reflector also includes a metal layer between the second semiconductor layer and the substrate. In addition, the package structure includes a waveguide between the metal layer and the optical component.
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Citations
20 Claims
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1. A package structure, comprising:
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an optical component over a substrate; a reflector disposed over the substrate, wherein the reflector comprises; a first semiconductor layer over a second semiconductor layer; a dielectric layer between the first semiconductor layer and the second semiconductor layer; and a metal layer between the second semiconductor layer and the substrate; a waveguide between the metal layer and the optical component; and a passivation layer covering the optical component and the waveguide, wherein a portion of the passivation layer is directly under the metal layer of the reflector. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A package structure, comprising:
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an optical component and a first waveguide over a surface of a substrate; a passivation layer covering the optical component and the first waveguide; a reflector disposed over the surface of the substrate, wherein the reflector comprises; a first semiconductor layer over the passivation layer; a second semiconductor layer surrounded by the passivation layer, wherein the first semiconductor layer is over the second semiconductor layer; and a metal layer surrounded by the second semiconductor layer, wherein the first waveguide is between the metal layer and the optical component. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A package structure, comprising:
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a waveguide over a substrate, a reflector over the substrate and adjacent to the waveguide, wherein the reflector comprises a metal layer having an inversed V-shaped cross-section, and a semiconductor layer covering the metal layer; an optical component over the substrate, wherein the waveguide and a portion of the semiconductor layer are between the optical component and the metal layer; a chip disposed over the optical component, wherein the optical component is electrically connected to the chip; and a molding material surrounding the chip and another semiconductor layer over the semiconductor layer of the reflector. - View Dependent Claims (18, 19, 20)
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Specification