Semiconductor integrated circuit device

• US 10,658,355 B2
• Filed: 09/09/2019
• Issued: 05/19/2020
• Est. Priority Date: 09/16/2011
• Status: Active Grant

• Current Assignee: Socionext Inc.
• Original Assignee: Socionext Inc.
• Inventors: Usami, Shiro
• Primary Examiner(s): Tobergte, Nicholas J
• Application Number:
  US16/565,380
• Publication Number:
  US 20200006321A1
• Time in Patent Office: 253 Days
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 23/5286 Arrangements of power or ground buses
• CPC Class Codes: H01L 27/0248 for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
• CPC Class Codes: H01L 27/0251 for MOS devices
• CPC Class Codes: H01L 27/0255 using diodes as protective elements
• CPC Class Codes: H01L 27/0259 using bipolar transistors as protective elements
• CPC Class Codes: H01L 27/0262 including a PNP transistor and a NPN transistor, wherein each of said transistors has its base coupled to the collector of the other transistor, e.g. silicon controlled rectifier [SCR] devices
• CPC Class Codes: H01L 27/0266 using field effect transistors as protective elements
• CPC Class Codes: H01L 27/0288 using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
• CPC Class Codes: H01L 27/0292 using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses
• CPC Class Codes: H01L 29/861 Diodes
• CPC Class Codes: H01L 29/87 Thyristor diodes, e.g. Shockley diodes, break-over diodes

Abstract

Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.

Claims

1. A semiconductor integrated circuit device having an ESD (Electro Static Discharge) protection circuit, wherein:

the ESD protection circuit comprises;

a first wiring electrically connected to a first terminal;

a second wiring and a third wiring electrically connected to a power supply terminal or a ground terminal;

a first region and a second region having a first conductivity type, that are connected to the first wiring, the first and second regions being separated from each other and serving as one of an anode or a cathode of a diode;

a third region having a second conductivity type different from the first conductivity type, that is connected to the second wiring and disposed so as to be opposed to the first region in a first direction;

a fourth region having the second conductivity type, that is connected to the third wiring and disposed so as to be opposed to the second region in the first direction, and the third and fourth regions serving as the other of an anode or a cathode of the diode; and

a fifth region having the second conductivity type,

the third region, the first region, the second region and the fourth region are disposed in this order in the first direction, and

the fifth region is disposed so as to be opposed to the first region in a second direction perpendicular to the first direction.

2. The semiconductor integrated circuit device according to claim 1, wherein:

the first, second and third wirings extend in the second direction.

3. The semiconductor integrated circuit device according to claim 2, wherein:

a space between the first wiring and the second wiring in the first direction is smaller than a space between the first region and the third region in the first direction, and

a space between the first wiring and the third wiring in the first direction is smaller than a space between the second region and the fourth region in the first direction.

4. The semiconductor integrated circuit device according to claim 2, wherein:

a space between the first wiring and the second wiring in the first direction is larger than a space between the first region and the third region in the first direction, and

a space between the first wiring and the third wiring in the first direction is larger than a space between the second region and the fourth region in the first direction.

5. The semiconductor integrated circuit device according to claim 1, wherein:

the ESD protection circuit further comprises a sixth region having the second conductivity type, and

the sixth region is disposed so as to be opposed to the second region in the second direction.

6. The semiconductor integrated circuit device according to claim 1, wherein:

the ESD protection circuit further comprises a seventh region having the second conductivity type,

the seventh region is disposed so as to be opposed to the first region in the second direction, and

the fifth region, the first region and the seventh region are disposed in this order in the second direction.

7. The semiconductor integrated circuit device according to claim 1, wherein:

a length of each of the first and second regions in the first direction is smaller than a length of each of the first and second regions in the second direction.

8. The semiconductor integrated circuit device according to claim 1, wherein:

the first conductivity type is a P type and the second conductivity type is an N type, and

the first and second regions serve as an anode of the diode, and

the third and fourth regions serve as a cathode of the diode.

9. The semiconductor integrated circuit device according to claim 8, wherein:

the second and third wirings are electrically connected to the power supply terminal.

10. The semiconductor integrated circuit device according to claim 1, wherein:

the first conductivity type is an N type and the second conductivity type is a P type,

the first and second regions serve as a cathode of the diode, and

the third and fourth regions serve as an anode of the diode.

11. The semiconductor integrated circuit device according to claim 10, wherein:

the second and third wirings are electrically connected to the ground terminal.

12. A semiconductor integrated circuit device having an ESD (Electro Static Discharge) protection circuit, wherein:

the ESD protection circuit comprises;

a first wiring and a second wiring electrically connected to a first terminal;

a third wiring, a fourth wiring and a fifth wiring electrically connected to a power supply terminal or a ground terminal;

a first region and a second region having a first conductivity type, that are connected to the first wiring, the first and second regions being separated from each other;

a third region and a fourth region having the first conductivity type, that are connected to the second wiring, the third and fourth regions being separated from each other, and the first, second, third and fourth regions serving as one of an anode or a cathode of a diode;

a fifth region having a second conductivity type different from the first conductivity type, that is connected to the third wiring and disposed so as to be opposed to the first region in a first direction;

a sixth region having the second conductivity type, that is connected to the fourth wiring and disposed so as to be opposed to the second region in the first direction;

a seventh region having the second conductivity type, that is connected to the fifth wiring and disposed so as to be opposed to the fourth region in the first direction, and the fifth, the sixth and the seventh regions serving as the other of an anode or a cathode of the diode; and

an eighth region and a ninth region having the second conductivity type,

the fifth region, the first region, the second region, the sixth region, the third region, the fourth region and the seventh region are disposed in this order in the first direction,

the eighth region is disposed so as to be opposed to the first region in a second direction perpendicular to the first direction, and

the ninth region is disposed so as to be opposed to the third region in the second direction.

13. The semiconductor integrated circuit device according to claim 12, wherein:

the first, second, third, fourth and fifth wirings extend in the second direction.

14. The semiconductor integrated circuit device according to claim 13, wherein:

a space between the first wiring and the third wiring in the first direction is smaller than a space between the first region and the fifth region in the first direction,

a space between the first wiring and the fourth wiring in the first direction is smaller than a space between the second region and the sixth region in the first direction,

a space between the second wiring and the fourth wiring in the first direction is smaller than a space between the third region and the sixth region in the first direction, and

a space between the second wiring and the fifth wiring in the first direction is smaller than a space between the fourth region and the seventh region in the first direction.

15. The semiconductor integrated circuit device according to claim 12, wherein:

the ESD protection circuit further comprises a tenth region and an eleventh region having the second conductivity type,

the tenth region is disposed so as to be opposed to the second region in the second direction, and

the eleventh region is disposed so as to be opposed to the fourth region in the second direction.

16. The semiconductor integrated circuit device according to claim 12, wherein:

the ESD protection circuit further comprises a twelfth region and a thirteenth region having the second conductivity type,

the twelfth region is disposed so as to be opposed to the first region in the second direction,

the thirteenth region is disposed so as to be opposed to the third region in the second direction,

the eighth region, the first region and the twelfth region are disposed in this order in the second direction, and

the ninth region, the third region and the thirteenth region are disposed in this order in the second direction.

17. The semiconductor integrated circuit device according to claim 12, wherein:

a length of each of the first, second, third and fourth regions in the first direction is smaller than a length of each of the first, second, third and fourth regions in the second direction.

18. The semiconductor integrated circuit device according to claim 12, wherein:

the first conductivity type is a P type and the second conductivity type is an N type,

the first, second, third and fourth regions serve as an anode of the diode,

the fifth, sixth and seventh regions serve as a cathode of the diode, and

the third, fourth and fifth wirings are electrically connected to the power supply terminal.

19. The semiconductor integrated circuit device according to claim 12, wherein:

the first conductivity type is an N type and the second conductivity type is a P type,

the first, second, third and fourth regions serve as a cathode of the diode,

the fifth, sixth and seventh regions serve as an anode of the diode, and

the third, fourth and fifth wirings are electrically connected to the ground terminal.