Gate-all-around fin device
First Claim
1. A method comprising:
- forming a doped well in a substrate of a first conductivity type;
forming a doped continuous well of a second conductivity type in the substrate of the first conductivity type;
forming a source contact of the first conductivity type to contact a gate structure over the doped continuous well of the second conductivity type; and
forming drain regions of the second conductivity type to contact the gate structure over the doped continuous well,wherein the drain regions include alternating p regions and n regions.
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Abstract
A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.
44 Citations
20 Claims
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1. A method comprising:
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forming a doped well in a substrate of a first conductivity type; forming a doped continuous well of a second conductivity type in the substrate of the first conductivity type; forming a source contact of the first conductivity type to contact a gate structure over the doped continuous well of the second conductivity type; and forming drain regions of the second conductivity type to contact the gate structure over the doped continuous well, wherein the drain regions include alternating p regions and n regions. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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forming a doped well in a substrate of a first conductivity type; forming a doped continuous well of a second conductivity type in the substrate of the first conductivity type; forming a first doped fin contact region of the first conductivity type to form a source contact to a gate structure over the doped continuous well of the second conductivity type; and forming a second doped fin contact region of the second conductivity type to form drain regions to the gate structure, the second doped fin contact region being formed over the doped continuous well, wherein the drain regions include alternating p regions and n regions formed directly on the second doped fin contact region. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A structure comprising:
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a substrate of a first conductivity type; a doped well in the substrate of the first conductivity type; a doped continuous well of a second conductivity type in the substrate of the first conductivity type; a source contact of the first conductivity type that contacts a gate structure over the doped continuous well of the second conductivity type; and drain regions of the second conductivity type that contact the gate structure over the doped continuous well, wherein the drain regions include alternating p regions and n regions. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification