Back pan cooling assembly for electronic display

• US 10,660,245 B2
• Filed: 10/16/2013
• Issued: 05/19/2020
• Est. Priority Date: 10/16/2012
• Status: Active Grant

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Dunn, William, Brown, Mike, Hubbard, Tim
• Primary Examiner(s): Moubry, Grant
• Assistant Examiner(s): Faulkner, Ryan L
• Application Number:
  US14/055,499
• Publication Number:
  US 20140113540A1
• Time in Patent Office: 2,407 Days
• Field of Search: 454184
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

Exemplary embodiments disclosed herein provide a back pan cooling assembly for an electronic display having a rear pan. A cooling back pan is preferably positioned behind the rear pan, the space between the cooling back pan and the rear pan defining a gap. A fan is positioned to cause a flow of ambient air through the gap. An electronic component for driving the electronic display may be placed in conductive thermal communication with the cooling back pan. A rear cover can be placed against the cooling back pan to define a sealed compartment which does not permit ambient air to enter. A port can be provided within the rear cover which allows ambient air to travel between the surroundings, the fan, and the gap.

Claims

1. A back pan cooling assembly for an electronic display having a rear pan, the assembly comprising:

a cooling back pan having a front surface and a rear surface, wherein said cooling back pan is positioned behind the rear pan;

a gap located between the cooling back pan and the rear pan;

a rear cover positioned on the cooling back pan to define a rear compartment formed between the cooling back pan and the rear cover which is substantially sealed to prevent ambient air from entering the rear compartment;

a port in the rear cover which accepts ambient air;

a fan positioned and configured to, when operated, cause a flow of ambient air to be ingested through the port and be exhausted through the gap; and

a power supply or microprocessor for driving the electronic display, the power supply or microprocessor placed at the rear surface of the cooling back pan within the sealed rear compartment and in conductive thermal communication with the cooling back pan;

wherein the fan is substantially sealed within the rear compartment such that ambient aft is not permitted to contact the power supply or microprocessor.

2. The cooling assembly of claim 1 wherein:

the electronic display is in conductive thermal communication with the rear pan.

3. The cooling assembly of claim 1 further comprising:

an LED backlight within the electronic display and placed in thermal communication with the rear pan.

4. The cooling assembly of claim 3 wherein:

the LED backlight is a direct-lit LED backlight having a front surface and a rear surface; and

the rear pan comprises the rear surface of the direct-lit LED backlight.

5. The cooling assembly of claim 1 wherein:

the rear pan and cooling back pan each contain four perimeter edges which are substantially aligned with one another.

6. The cooling assembly of claim 5 wherein:

the gap extends to all four perimeter edges of the rear pan and cooling back pan.

7. The cooling assembly of claim 5 wherein:

ambient air is permitted to exit the gap along the four perimeter edges of the rear pan and the cooling back pan.

8. A back pan cooling assembly for an electronic display having a rear pan, the assembly comprising:

a cooling back pan having a front surface and a rear surface, wherein said cooling back pan is positioned behind the rear pan;

a gap located between the cooling back pan and the rear pan;

a rear cover positioned on the cooling back pan to define a rear compartment formed between the cooling back pan and the rear cover which is sealed to prevent ambient air from entering the rear compartment;

a power supply or microprocessor for driving the electronic display, the power supply or microprocessor placed at the rear surface of the cooling back pan within the sealed rear compartment and in conductive thermal communication with the cooling back pan;

a port which accepts ambient air;

an open loop gaseous pathway defined by gaseous communication between the port and the gap; and

a fan positioned and configured to, when operated cause a flow of ambient air to flow through the open loop gaseous pathway;

wherein the fan is substantially sealed within the rear compartment such that ambient air is not permitted to contact the power supply or microprocessor.

9. The cooling assembly of claim 8 wherein:

the rear pan and the cooling back pan each contain four perimeter edges which are substantially aligned with one another.

10. The cooling assembly of claim 9 wherein:

the gap extends to all of the four perimeter edges of the rear pan and cooling back pan.

11. The cooling assembly of claim 8 wherein:

the fan is oriented such that ambient air is drawn through the port and exhausted out of the gap.

12. The cooling assembly of claim 8 wherein:

the fan is oriented such that ambient air is drawn through the gap and exhausted out of the port.

13. A back pan cooling assembly for an electronic display having a rear pan with a pair of vertical edges and a pair of horizontal edges, the assembly comprising:

a cooling back pan having a pair of vertical edges substantially aligned with the vertical edges of the rear pan and a pair of horizontal edges which are substantially aligned with the horizontal edges of the rear pan;

a gap defined between the cooling back pan and rear pan which extends to each horizontal edge to define a pair of horizontal edge gaps and to each vertical edge to define a pair of vertical edge gaps;

a fan positioned to cause ambient air to flow through the vertical edge gaps and the horizontal edge gaps;

a rear cover positioned on the cooling back pan to define a rear compartment formed between the cooling back pan and the rear cover which is sealed to prevent ambient air from entering the rear compartment;

a port within the rear cover;

an open loop gaseous pathway defined by gaseous communication between the port, fan, the horizontal edge gaps, and the vertical edge gaps; and

a power supply or microprocessor for driving the electronic display placed at the rear of the cooling back pan within the sealed rear compartment, wherein the power supply or microprocessor is in conductive thermal communication with the cooling back pan;

wherein the fan is substantially sealed within the rear compartment such that ambient air is not permitted to contact the power supply or microprocessor.

14. The cooling assembly of claim 13 wherein:

the fan is positioned near a center of the cooling back pan.

15. The cooling assembly of claim 13 further comprising:

an LED backlight within the electronic display which is placed in conductive thermal communication with the rear pan.