Metal core solder ball and heat dissipation structure for semiconductor device using the same

• US 10,661,394 B2
• Filed: 11/18/2013
• Issued: 05/26/2020
• Est. Priority Date: 01/03/2013
• Status: Active Grant

• Current Assignee: DUKSAN Hi-Metal Co., Ltd.
• Original Assignee: DUKSAN Hi-Metal Co., Ltd.
• Inventors: Chu, Yong Cheol, Lee, Hyun Kyu, Kwak, Jung Ug, Lee, Seung Jin, Jeon, Sang Ho, Choi, Yong Sik
• Primary Examiner(s): Pham, Thanhha S
• Application Number:
  US14/082,339
• Publication Number:
  US 20140183733A1
• Time in Patent Office: 2,381 Days
• Field of Search: 228 563, 257738
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/282 Zn as the principal constituent
• CPC Class Codes: B23K 35/286 Al as the principal constituent
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: B23K 35/3006 Ag as the principal constituent
• CPC Class Codes: B23K 35/3013 Au as the principal constituent
• CPC Class Codes: B23K 35/302 Cu as the principal constituent
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13561 On the entire surface of the core, i.e. integral coating
• CPC Class Codes: H01L 2224/13582 Two-layer coating
• CPC Class Codes: H01L 2224/13611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16 : of an individual bump connector
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81447 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/3656 : Formation of Kirkendall voids
• CPC Class Codes: H05K 2201/0218 : Composite particles, i.e. first metal coated with second metal
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 3/3478 : Applying solder preforms; Transferring prefabricated solder patterns

Abstract

Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Claims

1. An electrically connecting and heat dissipation structure for a semiconductor device comprising:

a connection terminal of the semiconductor device;

an electrode of a substrate facing the connection terminal;

a solder ball comprising a metal core having a diameter of 40-600 μ

m, a first plating layer formed on an outer surface of the metal core, and a second plating layer formed on an outer surface of the first plating layer and comprising an SnAgCu, SnCu, SnMg, or SnAl alloy; and

a bonding portion comprising solder paste brass powder between the electrode of the substrate and the solder ball,

wherein the

2. An electronic device, comprising the electrically connecting and heat dissipation structure of claim 1.