Gauge pattern selection

• US 10,663,870 B2
• Filed: 11/30/2016
• Issued: 05/26/2020
• Est. Priority Date: 12/18/2015
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Chen, Jun, Wallow, Thomas I., Laenens, Bart, Peng, Yi-Hsing
• Primary Examiner(s): Levin, Naum
• Application Number:
  US16/061,016
• Publication Number:
  US 20180364589A1
• Time in Patent Office: 1,273 Days
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Abstract

A method including obtaining a plurality of gauges of a plurality of gauge patterns for a patterning process, each gauge pattern configured for measurement of a parameter of the patterning process when created as part of the patterning process, and creating a selection of one or more gauges from the plurality of gauges, wherein a gauge is included in the selection provided the gauge and all the other gauges, if any, of the same gauge pattern, or all of the one or more gauges of the same gauge pattern linked to the gauge, pass a gauge printability check.

Claims

1. A method comprising:

obtaining a plurality of gauges of a plurality of gauge patterns for a patterning process, each gauge pattern configured for measurement of a parameter of the patterning process when created as part of the patterning process; and

creating, by a hardware computer system, a selection of one or more gauges from the plurality of gauges, wherein a gauge is included in the selection provided the gauge and all the other gauges, if any, of the same gauge pattern, or all of the one or more gauges of the same gauge pattern linked to the gauge, pass a gauge printability check.

2. The method of claim 1, wherein a gauge is included in the selection provided all of the one or more gauges of the same gauge pattern linked to the gauge, pass the gauge printability check and wherein a plurality of gauges of the same gauge pattern are linked by being associated with a same gauge pattern identification.

3. The method of claim 1, further comprising performing a contour shape check to identify whether a gauge pattern is considered to be printed well and a gauge is included in the selection provided its gauge pattern is considered to be printed well.

4. The method of claim 1, further comprising determining a gauge is metrology friendly by evaluating its gauge pattern against a predetermined shape for which a measurement algorithm of an inspection tool is designed to measure and the gauge is included in the selection provided it is metrology friendly.

5. The method of claim 1, wherein the gauge printability check comprises determining whether an image log slope and/or critical dimension pertaining to a gauge passes a threshold.

6. The method of claim 1, wherein the gauge printability check comprises obtaining a value of a printability parameter relating to a gauge by simulation using a mathematical model representing at least part of the patterning process.

7. The method of claim 1, further comprising selecting one or more gauges from the selection based on sensitivity of a gauge to a physical, chemical or optical parameter of the patterning process.

8. The method of claim 7, wherein the selecting based on sensitivity comprises selecting based on whether a resist and/or optical sensitivity of a gauge crosses or remains within a threshold.

9. The method of claim 1, further comprising using information obtained by, and/or information derived from, a measurement of the one or more gauges of the selection to calibrate or verify a mathematical model representing at least part of the patterning process.

10. The method of claim 9, wherein using information obtained by, and/or information derived from, the measurement of the one or more gauges of the selection to calibrate or verify the mathematical model comprises using a SEM image and/or a contour derived from SEM data to calibrate or verify the mathematical model representing at least part of the patterning process.

11. The method of claim 1, further comprising using measurement of the one or more gauges of the selection to control or monitor the patterning process.

12. The method of claim 1, wherein the gauge pattern comprises a feature of an integrated circuit pattern.

13. A method comprising:

obtaining a plurality of gauges of a plurality of gauge patterns for a patterning process, each gauge pattern configured for measurement of a parameter of the patterning process when created as part of the patterning process; and

creating, by a hardware computer system, a selection of one or more gauges from the plurality of gauges, wherein a gauge is included in the selection provided that its gauge pattern is considered to be printed well based on evaluation of the printability of the gauge pattern.

14. The method of claim 13, wherein the gauge is considered to be printed well based on a determination that a difference between at least part of a contour shape of its gauge pattern and a corresponding at least part of a shape of its nominal gauge pattern crosses a threshold.

15. The method of claim 13, further comprising determining whether a gauge is metrology friendly by evaluating the gauge pattern of the gauge against a predetermined shape for which a measurement algorithm of an inspection tool is designed to measure and the gauge is included in the selection provided it is metrology friendly.

16. The method of claim 13, comprising evaluating the printability of the pattern by determining whether a difference between a shape of a contour pertaining to the gauge pattern and a predetermined shape for which the measurement algorithm of the inspection tool is designed to measure crosses or remains within a threshold.

17. The method of claim 13, further comprising selecting one or more gauges from the selection based on sensitivity of a gauge to a physical, chemical or optical parameter of the patterning process.

18. The method of claim 13, further comprising using information obtained by, and/or information derived from, a measurement of the one or more gauges of the selection to calibrate or verify a mathematical model representing at least part of the patterning process.

19. A non-transitory computer program product comprising machine-readable instructions, when executed, configured to cause a processor system to at least:

obtain a plurality of gauges of a plurality of gauge patterns for a patterning process, each gauge pattern configured for measurement of a parameter of the patterning process when created as part of the patterning process; and

create a selection of one or more gauges from the plurality of gauges, wherein a gauge is included in the selection provided the gauge and all the other gauges, if any, of the same gauge pattern, or all of the one or more gauges of the same gauge pattern linked to the gauge, pass a gauge printability check.

20. A system comprising:

a scanning electron microscope configured to provide an image of a lithographically created structure; and

an image analysis engine comprising the non-transitory computer program product of claim 19.

21. A non-transitory computer program product comprising machine-readable instructions, when executed configured to cause a processor system to at least:

obtain a plurality of gauges of a plurality of gauge patterns for a patterning process, each gauge pattern configured for measurement of a parameter of the patterning process when created as part of the patterning process; and

create a selection of one or more gauges from the plurality of gauges, wherein a gauge is included in the selection provided that its gauge pattern is considered to be printed well based on evaluation of the printability of the gauge pattern.