Source/drain performance through conformal solid state doping
First Claim
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1. A method of forming a semiconductor device for source/drain applications comprising:
- providing a substrate for processing in a reaction chamber, the substrate having a surface and at least one formed source/drain region;
performing an atomic layer deposition of a dopant layer on the substrate surface for incorporation of dopant into the at least one formed source/drain region; and
performing an atomic layer deposition of a capping layer on the dopant layer;
wherein, after the atomic layer deposition of the capping layer, the semiconductor device is subject to a drive-in anneal step to diffuse dopant from the dopant layer into at least one of the formed source/drain regions, producing a doping level near an interface of greater than 1×
1020/cm3 with a diffusion depth less than 30 nm, andwherein performing the atomic layer deposition of the dopant layer on the substrate surface for incorporation of dopant into the at least one formed source/drain region comprises;
pulsing a first precursor onto the substrate, wherein the first precursor is at least one of;
SbCl3, SbF3, SbI3, and SbBr3;
purging the first precursor from the reaction chamber with a purge gas, wherein the purge gas comprises at least one of;
N2, Ar, or an inert gas;
pulsing a second precursor onto the substrate, wherein the second precursor is at least one of;
trimethyl silyl antimony or triethyl silyl antimony; and
purging the second precursor from the reaction chamber with the purge gas.
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Abstract
A method for improving source/drain performance through conformal solid state doping and its resulting device are disclosed. Specifically, the doping takes place through an atomic layer deposition of a dopant layer. Embodiments of the invention may allow for an increased doping layer, improved conformality, and reduced defect formation, in comparison to alternate doping methods, such as ion implantation or epitaxial doping.
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Citations
18 Claims
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1. A method of forming a semiconductor device for source/drain applications comprising:
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providing a substrate for processing in a reaction chamber, the substrate having a surface and at least one formed source/drain region; performing an atomic layer deposition of a dopant layer on the substrate surface for incorporation of dopant into the at least one formed source/drain region; and performing an atomic layer deposition of a capping layer on the dopant layer; wherein, after the atomic layer deposition of the capping layer, the semiconductor device is subject to a drive-in anneal step to diffuse dopant from the dopant layer into at least one of the formed source/drain regions, producing a doping level near an interface of greater than 1×
1020/cm3 with a diffusion depth less than 30 nm, andwherein performing the atomic layer deposition of the dopant layer on the substrate surface for incorporation of dopant into the at least one formed source/drain region comprises; pulsing a first precursor onto the substrate, wherein the first precursor is at least one of;
SbCl3, SbF3, SbI3, and SbBr3;purging the first precursor from the reaction chamber with a purge gas, wherein the purge gas comprises at least one of;
N2, Ar, or an inert gas;pulsing a second precursor onto the substrate, wherein the second precursor is at least one of;
trimethyl silyl antimony or triethyl silyl antimony; andpurging the second precursor from the reaction chamber with the purge gas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 18)
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9. A method of forming a semiconductor device for source/drain applications comprising:
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providing a substrate for processing in a reaction chamber, the substrate having a surface and a formed source/drain; performing an atomic layer deposition of a dopant layer on the substrate surface for incorporation of dopant into the at least one formed source/drain region, producing a doping level near an interface of greater than 1×
1020/cm3 with a diffusion depth less than 30 nm; andperforming an atomic layer deposition of a capping layer on the dopant layer, wherein performing the atomic layer deposition of the dopant layer on the substrate surface for incorporation of dopant into the at least one formed source/drain region comprises; pulsing a first precursor onto the substrate, wherein the first precursor is at least one of;
SbCl3, SbF3, SbI3, and SbBr3;purging the first precursor from the reaction chamber with a purge gas, wherein the purge gas comprises at least one of;
N2, Ar, or an inert gas;pulsing a second precursor onto the substrate, wherein the second precursor is at least one of;
trimethyl silyl antimony or triethyl silyl antimony; andpurging the second precursor from the reaction chamber with the purge gas. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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Specification