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Three-dimensional semiconductor chip containing memory die bonded to both sides of a support die and methods of making the same

  • US 10,665,581 B1
  • Filed: 01/23/2019
  • Issued: 05/26/2020
  • Est. Priority Date: 01/23/2019
  • Status: Active Grant
First Claim
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1. A bonded assembly comprising:

  • a support die comprising a peripheral circuitry, front support-die bonding pads electrically connected to a first subset of the peripheral circuitry, and backside bonding structures electrically connected to a second subset of the peripheral circuitry;

    a first memory die comprising a first three-dimensional array of memory elements and first memory-die bonding pads that are bonded to the front support-die bonding pads; and

    a second memory die comprising a second three-dimensional array of memory elements and second memory-die bonding pads that are bonded to the backside bonding structures;

    wherein the first memory-die bonding pads are bonded to the front support-die bonding pads by metal-to-metal bonding; and

    the second memory-die bonding pads are bonded to the backside bonding structures by metal-to-metal bonding.

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