Insulative structure with diffusion break integral with isolation layer and methods to form same
First Claim
1. An integrated circuit (IC) structure comprising:
- a substrate;
a set of shallow trench isolations (STIs) adjacent opposing sidewalls of the substrate;
an insulative structure overlying the substrate, the insulative structure including;
an isolation layer contacting an upper surface of the substrate, anda diffusion break region integral with and extending from the isolation layer, wherein the diffusion break region horizontally separates a pair of upper surfaces of the isolation layer;
a pair of active semiconductor layers each positioned on a respective one of the pair of upper surfaces of the isolation layer, each active semiconductor layer being adjacent an opposing sidewall of the diffusion break region; and
an inter-level dielectric (ILD) over the set of STIs and adjacent opposing sidewalls of the insulative structure;
wherein the isolation layer electrically separates the pair of active semiconductor layers from the substrate, and wherein the diffusion break region electrically separates the pair of active semiconductor layers from each other.
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Accused Products
Abstract
An IC structure according to the disclosure includes an insulative structure overlying a substrate and set of STIs. The insulative structure includes an isolation layer contacting an upper surface of the substrate, and a diffusion break region integral with and extending from the isolation layer, wherein the diffusion break region horizontally separates a pair of upper surfaces of the isolation layer. A pair of active semiconductor layers, each positioned on a respective one of the pair of upper surfaces of the isolation layer, are adjacent opposing sidewalls of the diffusion break region. The isolation layer electrically separates the pair of active semiconductor layers from the substrate, and the diffusion break region electrically separates the pair of active semiconductor layers from each other.
71 Citations
20 Claims
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1. An integrated circuit (IC) structure comprising:
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a substrate; a set of shallow trench isolations (STIs) adjacent opposing sidewalls of the substrate; an insulative structure overlying the substrate, the insulative structure including; an isolation layer contacting an upper surface of the substrate, and a diffusion break region integral with and extending from the isolation layer, wherein the diffusion break region horizontally separates a pair of upper surfaces of the isolation layer; a pair of active semiconductor layers each positioned on a respective one of the pair of upper surfaces of the isolation layer, each active semiconductor layer being adjacent an opposing sidewall of the diffusion break region; and an inter-level dielectric (ILD) over the set of STIs and adjacent opposing sidewalls of the insulative structure; wherein the isolation layer electrically separates the pair of active semiconductor layers from the substrate, and wherein the diffusion break region electrically separates the pair of active semiconductor layers from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated circuit (IC) structure comprising:
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a substrate; a set of shallow trench isolations (STIs) adjacent opposing sidewalls of the substrate; an insulative structure overlying the substrate, the insulative structure including; an isolation layer contacting an upper surface of the substrate, and a diffusion break region integral with and extending from the isolation layer, wherein the diffusion break region horizontally separates a pair of upper surfaces of the isolation layer; a pair of transistors each positioned on a respective one of the pair of upper surfaces of the isolation layer, each transistor being adjacent an opposing sidewall of the diffusion break region, wherein each of the pair of transistors includes; a nanosheet stack above the isolation layer, the nanosheet stack including a plurality of semiconductor nanosheets alternating with a plurality of gate metals, a gate region around the nanosheet stack, the gate region including a gate metal, a pair of semiconductor terminals, each semiconductor terminal adjacent a respective sidewall of the nanosheet stack, and a spacer layer horizontally between one of the pair of active semiconductor layers and the diffusion break region; and an inter-level dielectric (ILD) over the STI and adjacent opposing sidewalls of the insulative structure and the pair of transistors; wherein the isolation layer electrically separates the pair of transistors from the substrate, and wherein the diffusion break region electrically separates the pair of transistors from each other. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of forming an integrated circuit (IC) structure, the method comprising:
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providing a precursor structure including; a substrate, a set of shallow trench isolations (STIs) adjacent opposing sidewalls of the substrate, a sacrificial material on the substrate, the sacrificial material having a different composition from the substrate, a plurality of active semiconductor layers on an upper surface of the sacrificial material, the plurality of active semiconductor layers being horizontally separated from each other, a plurality of nanosheet stacks over the sacrificial material and extending between adjacent pairs of the plurality of semiconductor terminals, a plurality of gate stacks, each formed around a respective one of the plurality of nanosheet stacks; forming a cavity within the precursor structure, wherein the forming includes; forming a first portion of the cavity by removing;
one of the plurality of semiconductor terminals, or one plurality of gate stacks and an underlying one of the plurality of nanosheet stacks, to expose a portion of the sacrificial material, andforming a second portion of the cavity vertically between the substrate and each of the plurality of semiconductor terminals and the plurality of nanosheet stacks by selectively removing the sacrificial material; and forming an insulative structure within the first and second portions of the cavity. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification