Components of an electronic device and methods for their assembly

• US 10,667,418 B2
• Filed: 04/20/2018
• Issued: 05/26/2020
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Kiple, Bryan P., Woodhull, Charles B., Pakula, David A., Tan, Tang Y., Coleman, Michael P., Johannessen, Thomas, Heley, Richard W.
• Primary Examiner(s): Bui, Luan K
• Application Number:
  US15/958,915
• Publication Number:
  US 20180242470A1
• Time in Patent Office: 767 Days
• Field of Search: 4555751, 36167902, 36167955, 36167956, 206320
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing roughing and finishing B23C2220/605
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Claims

1. A housing for a portable electronic device, comprising:

a first side wall characterized as having a first grain pattern formed by a first extrusion process, the first grain pattern oriented along a first axis;

a second side wall characterized as having a second grain pattern formed by a second extrusion process, the second grain pattern oriented along a second axis; and

a housing section that comprises a third side wall, a fourth side wall, and a bottom wall that together define a cavity, the housing section having a third grain pattern formed by a third extrusion process, the third grain pattern oriented along a third axis;

wherein the first side wall and the second side wall are joined to opposite ends of the housing section, the first axis and the second axis are parallel to each other and perpendicular to the third axis, and the first grain pattern, the second grain pattern, and the third grain pattern provide an appearance of a continuous grain structure.

2. The housing of claim 1, wherein the first side wall, the second side wall, and the housing section are formed from a material that is opaque to radio frequency radiation.

3. The housing of claim 1, wherein the first side wall is joined to the housing section by one or more coupling members that interface with locking members of the housing section.

4. The housing of claim 3, wherein the one or more coupling members are formed of a dielectric material.

5. The housing of claim 4, wherein the one or more coupling members comprise a through-hole, and a fastener extends through the through-hole to further join the first side wall, the second side wall, and the housing section together.

6. The housing of claim 1, wherein the housing section has an area that is greater than a combined area of the first side wall and the second side wall.

7. A five-wall housing for a portable electronic device, comprising:

a first wall having a first grain pattern formed by a first extrusion process, the first grain pattern oriented along a first axis;

a second wall having a second grain pattern formed by a second extrusion process, the second grain pattern oriented along a second axis; and

a three-wall housing section comprising a third wall and an opposing fourth wall that extend from a bottom wall, the three-wall housing section having a third grain pattern formed by a third extrusion process, the third grain pattern oriented along a third axis;

the first wall and the second wall joined to opposite ends of the three-wall housing section such that the first axis and the second axis are perpendicular to the third axis;

wherein the first grain pattern, the second grain pattern, and the third grain pattern provide an appearance of a continuous grain structure throughout the five-wall housing.

8. The five-wall housing of claim 7, wherein the three-wall housing section comprises one or more edge surfaces having locking members.

9. The five-wall housing of claim 8, wherein the first wall and the second wall are joined to the opposite ends of the three-wall housing section by one or more coupling members that interface with the locking members of the three-wall housing section.

10. The five-wall housing of claim 7, wherein each of the first wall and the second wall comprise a planar region and a wall that extends from the planar region.

11. The five-wall housing of claim 7, wherein the first side wall, the second side wall, and the three-wall housing section are formed from a material that is opaque to radio frequency radiation.

12. The five-wall housing of claim 7, wherein the first side wall, the second side wall, and the three-wall housing section are formed from electrically conductive material.

13. The five-wall housing of claim 7, further comprising:

a cover glass coupled to the first wall and the second wall.

14. A housing for a portable electronic device, the housing comprising:

a top housing section extruded along a first extrusion axis and having a first grain structure oriented along the first extrusion axis;

a bottom housing section extruded along a second extrusion axis and having a second grain structure oriented along the second extrusion axis; and

a center housing section extruded along a third extrusion axis and having a third grain structure oriented along the third extrusion axis, the center housing section having a U-shaped cross-section that comprises a planar region and walls that extend from opposing sides thereof to at least partially define a cavity;

the top housing section, the bottom housing section, and the center housing section coupled together such that the first extrusion axis and the second extrusion axis are perpendicular to the third extrusion axis and the first grain pattern, the second grain pattern, and the third grain pattern provide an appearance of a continuous grain structure.

15. The housing of claim 14, wherein top housing section, the bottom housing section, and the center housing section are formed from a material that is opaque to radio frequency radiation.

16. The housing of claim 14, wherein top housing section, the bottom housing section, and the center housing section are formed of electrically conductive material.

17. The housing of claim 14, further comprising:

a cover glass coupled to at least one of the top housing section, the center housing section, or the bottom housing section.

18. The housing of claim 14, wherein the wherein the top housing section, the bottom housing section, and the center housing section are coupled together by a coupling member, and the coupling member comprises electrically insulating material.

19. The housing of claim 18, wherein the electrically insulating material comprises a resin.