Manufacturing method of LED display device

• US 10,672,829 B2
• Filed: 12/05/2018
• Issued: 06/02/2020
• Est. Priority Date: 08/19/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Chu, Wei-Cheng, Jiang, Ming-Fu, Jhang, Gu-Jhong
• Primary Examiner(s): Dang, Phuc T
• Application Number:
  US16/209,998
• Publication Number:
  US 20190109174A1
• Time in Patent Office: 545 Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P μm; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H μm. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 μm≥P μm≥H+0.48 μM.

Claims

1. A manufacturing method of an LED display device, comprising:

providing a substrate;

forming at least one first bonding pad and at least one second bonding pad on the substrate;

forming at least one spacer on the substrate, wherein the at least one spacer is located between the at least one first bonding pad and the at least one second bonding pad, and a height of the at least one spacer is P μ

m;

providing a conductive paste layer above the substrate, the conductive paste layer comprising a plurality of conductive particles; and

bonding at least one LED on the substrate, wherein the at least one LED comprises a first electrode and a second electrode, and the first electrode and the second electrode have a height H μ

m, wherein the first electrode and the second electrode of the at least one LED are respectively electrically connected to the at least one first bonding pad and the at least one second bonding pad of the substrate through the plurality of conductive particles of the conductive paste layer, and H+3.5 μ

m≥

P μ

m≥

H+0.48 μ

m.

2. The manufacturing method of the LED display device according to claim 1, wherein a width of the at least one spacer is X μ

m and a gap between the first electrode and the second electrode of the at least one LED is S μ

m, and S μ

m≥

X μ

m≥

S−

3.5 μ

m.

3. The manufacturing method of the LED display device according to claim 1, further comprising:

forming a plurality of light-shielding patterns on the substrate before providing the conductive paste layer above the substrate, wherein the at least one LED comprises a plurality of LEDs, and the plurality of light-shielding patterns and the plurality of LEDs are alternately arranged.

4. The manufacturing method of the LED display device according to claim 1, wherein the conductive paste layer comprises a plurality of patterned conductive parts, each of the plurality of patterned conductive parts comprising a first patterned conductive part corresponding to the at least one first bonding pad and a second patterned conductive part corresponding to the at least one second bonding pad, wherein the plurality of conductive particles are dispersedly disposed in the first patterned conductive part and the second patterned conductive part.

5. The manufacturing method of the LED display device according to claim 1, wherein the conductive paste layer comprises a plurality of patterned conductive parts, each of the plurality of patterned conductive parts comprising a first patterned conductive part corresponding to the at least one first bonding pad and a second patterned conductive part corresponding to the at least one second bonding pad, wherein the plurality of conductive particles are disposed in the first patterned conductive part and the second patterned conductive part, the first patterned conductive part corresponds to one of the plurality of conductive particles, the second patterned conductive part corresponds to one of the plurality of conductive particles, and the plurality of conductive particles are arranged in matrices.

6. A manufacturing method of an LED display device, comprising:

providing a substrate;

forming a plurality of first bonding pads and a plurality of second bonding pads on the substrate, wherein the plurality of first bonding pads and the plurality of second bonding pads are alternately arranged;

forming a plurality of positioning structures on the substrate, wherein the positioning structures are spaced apart from each other;

providing a conductive paste layer above the substrate, wherein the conductive paste layer comprises a plurality of conductive particles;

providing a wafer comprising a growth substrate and a plurality of LEDs, wherein the plurality of LEDs are located on the growth substrate and are arranged in intervals, each of the plurality of LEDs comprises a first electrode and a second electrode, and the first electrode and the second electrode have a height H μ

m;

forming a plurality of spacers on the plurality of LEDs, wherein each of the plurality of spacers is located between the first electrode and the second electrode of each of the plurality of LEDs, and a height of each of the plurality of spacers is P μ

m; and

bonding the wafer on the substrate, wherein the first electrode and the second electrode of each of the plurality of LEDs are respectively electrically connected to each of the plurality of first bonding pads and each of the plurality of second bonding pads of the substrate through the plurality of conductive particles of the conductive paste layer, at least two of the plurality of LEDs are located between any two of the plurality of positioning structures, and H+3.5 μ

m≥

P μ

m≥

H+0.48 μ

m.

7. The manufacturing method of an LED display device according to claim 6, wherein a width of each of the plurality of spacers is X μ

m in and a gap between the first electrode and the second electrode of each of the plurality of LEDs is S μ

m, and S μ

m≥

X μ

m≥

S−

3.5 μ

m.

8. The manufacturing method of an LED display device according to claim 6, further comprising:

forming a plurality of light-shielding patterns on the growth substrate before bonding the wafer on the substrate, wherein the plurality of light-shielding patterns and the plurality of LEDs are alternately arranged.

9. The manufacturing method of an LED display device according to claim 6, wherein the conductive paste layer comprises a plurality of patterned conductive parts, each of the plurality of patterned conductive parts comprising a first patterned conductive part corresponding to the plurality of first bonding pads and a second patterned conductive part corresponding to the plurality of second bonding pads, and the plurality of conductive particles are dispersedly disposed in the first patterned conductive part and the second patterned conductive part.

10. The manufacturing method of an LED display device according to claim 6, wherein the conductive paste layer comprises a plurality of patterned conductive parts, each of the plurality of patterned conductive parts comprising a first patterned conductive part corresponding to the plurality of first bonding pads and a second patterned conductive part corresponding to the plurality of second bonding pads, the plurality of conductive particles are disposed in the first patterned conductive part and the second patterned conductive part, the first patterned conductive part corresponds to one of the plurality of conductive particles, the second patterned conductive part corresponds to one of the plurality of conductive particles, and the plurality of conductive particles are arranged in matrices.

11. The manufacturing method of an LED display device according to claim 6, wherein the substrate comprises a glass substrate, a flexible plastic substrate, a thin-film transistor substrate, a flexible circuit board, or a printed circuit board.