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Encapsulation structure, display panel, electronic device and encapsulation method

  • US 10,673,014 B2
  • Filed: 08/29/2019
  • Issued: 06/02/2020
  • Est. Priority Date: 10/08/2018
  • Status: Active Grant
First Claim
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1. An encapsulation structure, comprising:

  • a first substrate;

    a second substrate facing the first substrate; and

    a first sealant and a second sealant which are between the first substrate and the second substrate and bond the first substrate and the second substrate to each other, whereinthe first sealant comprises a first inclined surface facing away from the first substrate;

    the second sealant comprises a second inclined surface facing away from the second substrate, and the second inclined surface is attached to and in contact with the first inclined surface;

    in a direction parallel to the first substrate and the second substrate, each of the first inclined surface and the second inclined surface extends from a first position to a second position;

    along a direction from the first position to the second position, a distance from the first inclined surface to the first substrate gradually changes, and a distance from the second inclined surface to the second substrate gradually changes; and

    within a range from the first position to the second position, sums of the distance from the first inclined surface to the first substrate and the distance from the second inclined surface to the second substrate are substantially equal.

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