Rigid electrical connection to strain sensitive sensing component

• US 10,673,184 B2
• Filed: 03/27/2018
• Issued: 06/02/2020
• Est. Priority Date: 03/27/2018
• Status: Active Grant

• Current Assignee: Veoneer US Safety Systems LLC
• Original Assignee: Veoneer US Inc. (SSW Partners LP)
• Inventors: Pusheck, Jacob
• Primary Examiner(s): Le, Thanh Tam T
• Application Number:
  US15/937,154
• Publication Number:
  US 20190305491A1
• Time in Patent Office: 798 Days
• Field of Search: 439 761, 43962021, 43962022, 439913, 439936, 73493
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 13/41 by frictional grip in grommet, panel or base
• CPC Class Codes: H01R 13/6683 with built-in sensor
• CPC Class Codes: H01R 43/0256 for soldering or welding connectors to a printed circuit board
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board
• CPC Class Codes: H05K 5/0078 specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors

Abstract

An apparatus includes a sensor package, a housing, and one or more stitched terminals. The housing comprises a first cavity configured to receive the sensor package, a second cavity configured to receive an electrical connector, and a wall separating the cavities. The first cavity has a support surface located between a sensor receiving opening and the wall. The one or more stitched terminals are generally stitched into the wall, each having a sensor contact end extending into the first cavity and a connector contact end extending into the second cavity. At least one of the sensor package and the stitched terminals is positionable to align electrical contact pads of the sensor package with the sensor contact ends of the stitched terminals. The sensor package, when positioned between the support surface and the sensor contact ends of the stitched terminals, is essentially uncompressed.

Claims

1. An apparatus comprising:

a sensor package implementing a kinematic sensor and having a first surface comprising one or more electrical contact pads;

a housing comprising a first cavity configured to receive said sensor package and a second cavity configured to receive an electrical connector, wherein the first cavity and the second cavity are separated by a wall, the first cavity is accessible through an opening in the housing, a support surface is located within the first cavity opposite the opening and extending from the wall separating the first cavity and the second cavity, the opening in the housing has dimensions allowing the sensor package to be placed and manipulated within the first cavity; and

one or more stitched terminals stitched into the wall separating the first cavity and the second cavity, each having a sensor contact end extending from the wall into the first cavity and a connector contact end extending from the wall into the second cavity,

wherein (i) at least one of the sensor package and the stitched terminals is positionable to align the electrical contact pads with the sensor contact ends of the stitched terminals, (ii) a distance between the support surface and the sensor contact ends of the stitched terminals allows the sensor package to be placed at a first position on the support surface within said first cavity and slid along the support surface from the first position to a second position on the support surface adjacent to the sensor contact ends of the stitched terminals until the electrical contact pads align with the sensor contact ends of the stitched terminals, (iii) the housing comprises ribs within the first cavity configured to center the sensor package on the support surface at a first position separated from the sensor contact ends of the stitched terminals when the sensor package is inserted, and (iv) the sensor package, when positioned between the support surface and the sensor contact ends of the stitched terminals, is essentially uncompressed.

2. The apparatus according to claim 1, wherein said sensor package is located on said support surface within said first cavity and said stitched terminals are stitched over said sensor package aligning the sensor contact ends of the stitched terminals with the electrical contact pads.

3. The apparatus according to claim 1, wherein:

the sensor contact ends of the stitched terminals comprise apertures into which solder can be disposed; and

the sensor contact ends of the stitched terminals are electrically and mechanically coupled to the electrical contact pads of the sensor package when soldered.

4. The apparatus according to claim 3, wherein:

the support surface faces the opening in the housing providing access to the first cavity; and

the sensor contact ends of the stitched terminals extend parallel to the support surface, with the apertures facing the opening in the housing providing access to the first cavity to provide access for soldering the sensor contact ends of the stitched terminals to the electrical contact pads of the sensor package using a soldering tool via the opening in the housing.

5. The apparatus according to claim 1, wherein the housing further comprises ledges within said first cavity, said ledges configured to center the sensor package on the support surface when the sensor package is slid along the support surface to a second position on the support surface adjacent to the sensor contact ends of the stitched terminals.

6. The apparatus according to claim 5, wherein the support surface further comprises a recessed groove providing access to a second surface of the sensor package on an opposite side of the sensor package from the first surface.

7. The apparatus according to claim 6, wherein the recessed groove is configured to allow a pick and place tool to place the sensor package on the support surface at the first position and guide the sensor package along the support surface to the second position adjacent to (i) the wall separating the first cavity and the second cavity and (ii) the sensor contact ends of the stitched terminals.

8. The apparatus according to claim 5, wherein the ledges, the support surface, and the sensor contact ends of the stitched terminals constrain the sensor package and orient the sensor package relative to the wall separating the first cavity and the second cavity without compressing the sensor package.

9. The apparatus according to claim 1, wherein each of the sensor contact ends of the stitched terminals comprises an aperture configured to anchor the stitched terminals to the housing when the first cavity is filled with a potting material.

10. The apparatus according to claim 1, wherein said first surface of said sensor package, said support surface of said housing, and said stitched terminals are parallel to each other.

11. The apparatus according to claim 1, wherein said first surface comprising said one or more electrical contact pads is (i) parallel to said support surface of said housing and (ii) perpendicular to said wall from which said one or more stitched terminals extend.

12. The apparatus according to claim 1, wherein said stitched terminals are separated from said support surface by a distance greater than a thickness of said sensor package, allowing said sensor package to be slid along said support surface and positioned between said stitched terminals and said support surface without contacting said stitched terminals.

13. An apparatus comprising:

a sensor package having a first surface comprising one or more electrical contact pads;

a housing comprising a first cavity configured to receive said sensor package and a second cavity configured to receive an electrical connector, wherein the first cavity and the second cavity are separated by a wall, the first cavity is accessible through an opening in the housing, a pocket having a recessed surface is located within an inner surface of the first cavity opposite the opening, the recessed surface of the pocket has dimensions corresponding to entire dimensions of the first surface of the sensor package, and the opening in the housing has dimensions allowing the sensor package to pass through the opening in the housing and be placed into the pocket; and

one or more stitched terminals stitched into the wall separating the first cavity and the second cavity, each having a sensor contact end extending from the wall separating the first cavity and the second cavity into the first cavity and a connector contact end extending from the wall separating the first cavity and the second cavity into the second cavity,

wherein (i) a distance between the recessed surface of the pocket and the sensor contact ends of the stitched terminals allows the stitched terminals to be stitched over the sensor package while the sensor package is in the pocket, (ii) the sensor contact ends of the stitched terminals are aligned with the electrical contact pads of the sensor package, and (iii) the sensor package, when positioned in the pocket between the recessed surface and the sensor contact ends of the stitched terminals, is essentially uncompressed.

14. The apparatus according to claim 13, wherein:

each of the sensor contact ends of the stitched terminals comprise a first aperture into which solder can be disposed; and

the sensor contact ends of the stitched terminals are electrically and mechanically coupled to the electrical contact pads of the sensor package when soldered.

15. The apparatus according to claim 14, wherein each of the sensor contact ends of the stitched terminals further comprise a second aperture configured to anchor the stitched terminals to the housing when the first cavity is filled with a potting material.

16. The apparatus according to claim 13, wherein the pocket and the sensor contact ends of the stitched terminals constrain the sensor package and orient the sensor package relative to the wall separating the first cavity and the second cavity without compressing the sensor package.

17. A method of manufacturing a remote sensor module comprising:

placing a sensor package implementing a kinematic sensor onto a support surface in a first cavity of a sensor housing, wherein said sensor package has a first surface comprising one or more electrical contact pads, said sensor housing comprises a second cavity configured to receive an electrical connector, the first cavity and the second cavity are separated by a wall, the first cavity is configured to receive the sensor package through an opening in the sensor housing opposite the support surface, the first cavity comprises either (i) ribs configured to center the sensor package on the support surface when the sensor package is placed at a first position on said support surface within said first cavity and slid to a second position on said support surface adjacent to the wall separating the first cavity from the second cavity of the sensor housing and one or more terminal pins, or (ii) a pocket located within an inner surface of the first cavity opposite the opening with the support surface recessed from the inner surface of the first cavity and having dimensions corresponding to entire dimensions of the first surface of the sensor package;

stitching the one or more terminal pins through the wall separating the first cavity of the sensor housing from the second cavity of the sensor housing, such that a sensor contact end of the one or more terminal pins is adjacent to the one or more electrical contact pads of the sensor package when the sensor package is between the support surface and the one or more terminal pins; and

forming electrical and mechanical connections between the one or more electrical contact pads of the sensor package and the one or more terminal pins, wherein the sensor package is essentially uncompressed.

18. The method according to claim 17, wherein said sensor package is placed in said pocket within said inner surface of said first cavity and said one or more terminal pins are then stitched over said sensor package.

19. The method according to claim 17, wherein said electrical and mechanical connections are formed using a solder reflow process.

20. The method according to claim 17, further comprising anchoring said one or more terminal pins to the sensor housing via apertures in said one or more terminal pins by filling said first cavity with a potting material.