Housing including metal material and electronic device including same
First Claim
1. An electronic device, comprising:
- a first plate;
a second plate facing an opposite direction relative to the first plate;
a side member coupled to or integrally formed with the second plate, the side member surrounding a space between the first plate and the second plate; and
a mid-plate coupled to or integrally formed with the side member, the mid-plate extending into the space, wherein the side member further comprises;
an aluminum substrate layer formed between a first surface forming a part of an outer surface of the electronic device and a second surface exposed within the space,an aluminum oxide layer formed between the first surface and the aluminum substrate layer, the aluminum oxide layer comprising multiple pores extending in a direction substantially perpendicular to the first surface,a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, anda second layer formed on the first layer as to form the first surface, the second layer comprising titanium.
1 Assignment
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Accused Products
Abstract
A device, a house for the device and a method are disclosed herein. The device includes a first plate, a second plate facing an opposite direction, a side member integrally formed with the second plate, surrounding a space between the first the second plate, and a mid-plate coupled to the side member, extending into the space, the side member further including an aluminum substrate layer formed between a first and second surface exposed within the space, an aluminum oxide layer formed between the first surface and the aluminum substrate layer including multiple pores, a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, and a second layer formed on the first layer as to form the first surface, the second layer comprising titanium.
16 Citations
20 Claims
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1. An electronic device, comprising:
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a first plate; a second plate facing an opposite direction relative to the first plate; a side member coupled to or integrally formed with the second plate, the side member surrounding a space between the first plate and the second plate; and a mid-plate coupled to or integrally formed with the side member, the mid-plate extending into the space, wherein the side member further comprises; an aluminum substrate layer formed between a first surface forming a part of an outer surface of the electronic device and a second surface exposed within the space, an aluminum oxide layer formed between the first surface and the aluminum substrate layer, the aluminum oxide layer comprising multiple pores extending in a direction substantially perpendicular to the first surface, a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, and a second layer formed on the first layer as to form the first surface, the second layer comprising titanium. - View Dependent Claims (2, 3, 4, 5)
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6. A housing for an electronic device, comprising:
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a plate forming a surface of the housing; and a side member arranged along a periphery of the plate so as to form a side surface of the housing, the side member comprising a mid-plate extending from the side surface to an interior space defined at least partly by the plate, wherein the side member comprises; a nonconductive member forming a first part of the side member, a substrate layer forming a second part of the side member, the substrate layer formed of an anodizable metal; an anodizing coating layer including multiple irregular pores formed by oxidation of at least a partial surface of the substrate layer; a bonding layer formed along a surface of the anodizing coating layer, the surface comprising the multiple irregular pores; and a deposition layer deposited on the bonding layer so as to fill the multiple irregular pores. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A housing manufacturing method, comprising:
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preparing a substrate including a mid-plate formed on a surface and a side surface of a housing, the substrate disposed inside the side surface; forming an anodizing coating by connecting the substrate to an anode of a power supply and immersing the substrate in an electrolyte solution; forming a bonding layer along a surface of the anodizing coating, the surface comprising multiple pores; and filling the pores and forming a deposition layer on the bonding layer. - View Dependent Claims (19, 20)
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Specification