Printed circuit board inspecting apparatus, method for determining fault type of screen printer and computer readable recording medium
First Claim
1. A printed circuit board inspection apparatus comprising:
- a memory configured to store a machine-learning based model that derives at least one value indicating relevance between at least one fault type of a screen printer and an image indicating whether an anomaly associated with a plurality of solder pastes printed on a printed circuit board is detected; and
a processor electrically connected with the memory,wherein the processor is configured to;
generate at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if the anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board,obtain at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, anddetermine a fault type associated with the at least one solder paste in which the anomaly is detected from the at least one fault type, based on the obtained at least one value,wherein the at least one solder paste in which the anomaly is detected and at least one solder paste in which the anomaly is not detected among the plurality of solder pastes printed on the first printed circuit board are distinguished from each other in the at least one image generated by the processor.
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Accused Products
Abstract
A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.
37 Citations
19 Claims
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1. A printed circuit board inspection apparatus comprising:
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a memory configured to store a machine-learning based model that derives at least one value indicating relevance between at least one fault type of a screen printer and an image indicating whether an anomaly associated with a plurality of solder pastes printed on a printed circuit board is detected; and a processor electrically connected with the memory, wherein the processor is configured to; generate at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if the anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtain at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determine a fault type associated with the at least one solder paste in which the anomaly is detected from the at least one fault type, based on the obtained at least one value, wherein the at least one solder paste in which the anomaly is detected and at least one solder paste in which the anomaly is not detected among the plurality of solder pastes printed on the first printed circuit board are distinguished from each other in the at least one image generated by the processor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A non-transitory computer-readable recording medium having a program to be executed by a computer, wherein the program includes executable instructions that instruct a processor, when the program is executed by the processor, to perform:
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generating at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board; obtaining at least one value indicating relevance between at least one fault type and the at least one image using a machine-learning based model that derives at least one value indicating relevance between at least one fault type of a screen printer and an image indicating whether an anomaly in the plurality of solder pastes printed on a printed circuit board is detected; and determining a fault type associated with the at least one solder paste in which the anomaly is detected from the at least one fault type, based on the obtained at least one value, wherein the at least one solder paste in which the anomaly is detected and at least one solder paste in which the anomaly is not detected among the plurality of solder pastes printed on the first printed circuit board are distinguished from each other in the at least one image generated by the processor. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A method for determining a fault type of a screen printer by a printed circuit board inspection apparatus, the method comprising:
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generating at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board; obtaining at least one value indicating relevance between at least one fault type and the generated at least one image, using a machine-learning based model that derives at least one value indicating relevance between at least one fault type of the screen printer and an image indicating whether an anomaly associated with the plurality of solder pastes printed on a printed circuit board is detected; and determining a fault type associated with the at least one solder paste in which the anomaly is detected from the at least one fault type, based on the obtained at least one value, wherein the at least one solder paste in which the anomaly is detected and at least one solder paste in which the anomaly is not detected among the plurality of solder pastes printed on the first printed circuit board are distinguished from each other in the at least one image generated by the processor.
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Specification