Encapsulation structure, substrate and display panel

• US 10,680,204 B2
• Filed: 12/11/2018
• Issued: 06/09/2020
• Est. Priority Date: 12/15/2017
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Original Assignee: Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Inventors: Qiao, Zi, Jiang, Zhiliang
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US16/476,402
• Publication Number:
  US 20200052245A1
• Time in Patent Office: 546 Days
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/124 Insulating layers formed between TFT elements and OLED elements

Abstract

Disclosed are an encapsulation structure, a substrate and a display panel. The package structure includes an encapsulation layer and a transition layer, wherein the encapsulation layer includes a first encapsulation layer and a second encapsulation layer which are laminated with each other, the first encapsulation layer is located on a first main surface of the second encapsulation layer, the transition layer and the first encapsulation layer are juxtaposed on the first main surface, the first main surface includes a first region in contact with the first encapsulation layer and a second region in contact with the transition layer, the second region is located at an edge of the first main surface, and a bonding strength between the transition layer and the second encapsulation layer is greater than a bonding strength between the first encapsulation laver and the second encapsulation layer.

Claims

1. A substrate, comprising a base and an encapsulation structure, the encapsulation structure being located on the base, the encapsulation structure comprising:

an encapsulation layer, comprising a first encapsulation layer and a second encapsulation layer, wherein the first encapsulation layer and the second encapsulation layer are sequentially laminated on the base, the first encapsulation layer is located on a first main surface of the second encapsulation layer; and

a transition layer, juxtaposed with the first encapsulation layer on the first main surface;

wherein the first main surface includes a first region in contact with the first encapsulation layer and a second region in contact with the transition layer, the second region is located at an edge of the first main surface, and a bonding strength between the transition layer and the second encapsulation layer is greater than a bonding strength between the first encapsulation layer and the second encapsulation layer.

2. The substrate according to claim 1, wherein

an orthographic projection of the transition layer on a plane where the substrate is located is located outside an orthographic projection of the first encapsulation layer on the plane where the substrate is located.

3. The substrate according to claim 1, wherein

materials of the second encapsulation layer and the transition layer both include organic materials.

4. The substrate according to claim 1, wherein

an orthographic projection of the second region on the plane where the substrate is located is in a closed ring shape, and an orthographic projection of the first region on the plane where the substrate is located is located within the orthographic projection of the second region on the plane where the substrate is located.

5. The substrate according to claim 1, wherein

a surface of the transition layer in contact with the first main surface is provided with at least one concave-convex structure.

6. The substrate according to claim 5, wherein

the concave-convex structure is arranged in multiple layers in a direction from an edge of the first main surface to a center of the first main surface.

7. The substrate according to claim 5, wherein

in a direction perpendicular to the plane where the substrate is located, a cross-sectional shape of the concave-convex structure includes one or a combination of an arc, a rectangle, a trapezoid and an inverted trapezoid.

8. The substrate according to claim 1, further comprising:

a dielectric layer, disposed at a side of the transition layer away from the second encapsulation layer,

wherein a bonding strength of the dielectric layer and the transition layer is greater than a bonding strength of the dielectric layer and the first encapsulation layer.

9. The substrate according to claim 8, wherein

a preparation material of the dielectric layer comprises an organic material, and the dielectric layer is one of a buffer layer, a gate insulating layer, an interlayer dielectric layer, a passivation layer, a planarization layer and a pixel defining layer in the substrate.

10. The substrate according to claim 1, wherein

the transition layer is configured to be disposed in a same layer and made of a same material as one or a combination of a gate insulating layer, an interlayer dielectric layer, a passivation layer, a planarization layer and a pixel defining layer in the substrate.

11. The substrate according to claim 1, wherein

in the second region, a ratio of a thickness of the transition layer to a thickness of the second encapsulation layer is 1/6 to 1/3.

12. The substrate according to claim 1, further comprising:

a third encapsulation layer, disposed at a side of the second encapsulation layer away from the first main surface,

wherein materials of the first encapsulation layer and the third encapsulation layer comprise inorganic materials.

13. The substrate according to claim 12, wherein

an orthographic projection of the second encapsulation layer on a plane where the substrate is located and an orthographic projection of the transition layer on the plane where the substrate is located are both located within an orthographic projection of the third encapsulation layer on the plane where the substrate is located.

14. The substrate according to claim 12, further comprising:

a barrier dam, located at a side of the transition layer away from the first encapsulation layer,

wherein an orthographic projection of the barrier dam on a plane where the substrate is located is located within an orthographic projection of the third encapsulation layer on the plane where the substrate is located, and at least a portion of the barrier dam is disposed in a same layer and made of a same material as the transition layer.

15. A display panel, comprising the substrate according to claim 1.

16. An encapsulation structure, comprising:

an encapsulation layer, comprising a first encapsulation layer and a second encapsulation layer, the first encapsulation layer and the second encapsulation layer being laminated with each other, the first encapsulation layer being located on a first main surface of the second encapsulation layer; and

a transition layer, juxtaposed with the first encapsulation layer on the first main surface;

wherein the first main surface includes a first region in contact with the first encapsulation layer and a second region in contact with the transition layer, the second region is located at an edge of the first main surface, and a bonding strength between the transition layer and the second encapsulation layer is greater than a bonding strength between the first encapsulation layer and the second encapsulation layer.

17. The encapsulation structure according to claim 16, wherein

an orthographic projection of the transition layer on the first main surface is located outside an orthographic projection of the first encapsulation layer on the first main surface.

18. The encapsulation structure according to claim 16, wherein

materials of the second encapsulation layer and the transition layer both include organic materials.

19. The encapsulation structure according to claim 16, wherein

an orthographic projection of the second region on the first main surface is in a closed ring shape, and an orthographic projection of the first region on a plane where the substrate is located is located within an orthographic projection of the second region on the first main surface.

20. The encapsulation structure according to claim 16, wherein

a surface of the transition layer in contact with the first main surface is provided with at least one concave-convex structure.