RF filter with separate capacitive and inductive substrates

• US 10,680,302 B2
• Filed: 01/29/2018
• Issued: 06/09/2020
• Est. Priority Date: 02/04/2017
• Status: Active Grant

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Jing, Dong, Vangala, Reddy
• Primary Examiner(s): Patel, Rakesh B
• Application Number:
  US15/881,898
• Publication Number:
  US 20180226936A1
• Time in Patent Office: 862 Days
• Field of Search: 333175, 333185, 333204, 333206
• CPC Class Codes: H01P 1/2039 Galvanic coupling between Input/Output
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H03H 2001/0085 Multilayer, e.g. LTCC, HTCC, green sheets inside PCB filters H05K
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence
• CPC Class Codes: H03H 7/0123 comprising distributed impedance elements together with lumped impedance elements
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards

Abstract

An RF filter comprises a first substrate which in one embodiment is a plate including one or more exterior surfaces with a pattern of conductive material defining a plurality of capacitors. A second substrate which in one embodiment is a block includes one or more exterior surfaces with a pattern of conductive material defining a plurality of inductors. The block is seated on the plate in a relationship with the block normal to the plate and the capacitors coupled to the inductors respectively. In one embodiment, the capacitors comprise low impedance open ended capacitive RF signal transmission lines and the inductors comprise high impedance inductive RF signal transmission lines coupled to the low impedance capacitive RF signal transmission lines respectively to define transmission zeros.

Claims

1. An RF filter comprising:

a first substrate including one or more exterior surfaces with a pattern of isolated strips of conductive material on the one or more exterior surfaces of the first substrate defining first and second RF signal input/output pads and a pattern of isolated strips of conductive material on the one or more exterior surfaces of the first substrate defining a plurality of capacitors; and

a second substrate including one or more exterior surfaces with a pattern of isolated strips of conductive material thereon defining a plurality of inductors,

the first and second substrates being coupled together in a relationship wherein the capacitors on the first substrate are directly connected to the respective inductors on the second substrate.

3. The RF filter of claim 1, wherein the plurality of capacitors on the first substrate are defined by a plurality of low impedance capacitive RF signal transmission lines and one or more of the plurality of inductors define an inductive lumped coil element.

4. The RF filter of claim 1, wherein the first substrate is a plate and the second substrate is a block seated on the plate in a relationship normal to the plate to define a three dimensional RF filter.

5. The RF filter of claim 1, wherein the first and second RF signal input/output pads are coupled to respective first and second RF signal input/output transmission lines which are coupled to respective ones of the plurality of capacitors and inductors defined on the first and second substrates respectively.

6. The RF filter of claim 1, wherein the pattern of conductive material on the respective first and second substrates defines respective solder pads for soldering the second substrate to the first substrate.

2. An RF filter comprising:

a first substrate including one or more exterior surfaces with a pattern of conductive material thereon defining first and second RF signal input/output pads and a plurality of capacitors; and

a second substrate including one or more exterior surfaces with a pattern of isolated strips of conductive material thereon defining a plurality of inductors,

the first and second substrates being coupled together in a relationship wherein the capacitors on the first substrate are coupled to the respective inductors on the second substrate,

wherein the plurality of capacitors on the first substrate are defined by a plurality of low impedance capacitive RF signal transmission lines and the plurality of inductors on the second substrate are defined by a plurality of high impedance inductive RF signal transmission lines coupled to the plurality of low impedance capacitive RF signal transmission lines.

7. An RF filter comprising:

a first substrate including one or more exterior surfaces with a pattern of conductive material thereon defining first and second RF signal input/output pads and a plurality of capacitors; and

a second substrate including one or more exterior surfaces with a pattern of conductive material thereon defining a plurality of inductors,

the first and second substrates being coupled together in a relationship wherein the capacitors on the first substrate are coupled to the respective inductors on the second substrate, wherein one or more of the capacitors are defined by open ended capacitive RF signal transmission lines which are coupled to respective ones of the plurality of inductors on the second substrate to define one or more transmission zeros.

8. An RF filter comprising:

a first substrate including one or more exterior surfaces with a pattern of conductive material defining first and second RF signal input/output transmission lines, and a plurality of low impedance capacitive open ended capacitive RF signal transmission lines coupled to the first and second RF signal input/output transmission lines; and

a second substrate including one or more exterior surfaces with a pattern of conductive material defining a plurality of inductive elements;

the first and second substrates being coupled together in a relationship wherein the capacitive RF signal transmission lines on the first substrate are coupled to the respective inductive elements on the second substrate and define one or more transmission zeros.

9. The RF filter of claim 8, wherein the plurality of inductive elements define a plurality of high impedance inductive RF signal transmission lines.

10. The RF filter of claim 8, wherein one or more of the plurality of inductive elements define an inductive lumped coil element.

11. The RF filter of claim 8, wherein the first substrate is a plate and the second substrate is a block seated on the plate in a relationship normal to the plate to define a three dimensional RF filter.