Reactivity enhancement in ion beam etcher
First Claim
1. A method of fabricating a slanted surface-relief structure in a material layer, the method comprising:
- injecting a first reactive gas into an reactive ion source generator;
generating a plasma using the first reactive gas in the reactive ion source generator, the plasma including reactive ions of the first reactive gas that are configured to react with the material layer to generate volatile materials;
extracting at least some of the reactive ions from the plasma to form a collimated reactive ion beam towards the material layer; and
injecting a second reactive gas onto the material layer, the second reactive gas configured to react with the material layer,wherein the collimated reactive ion beam and the second reactive gas etch the material layer both physically and chemically to form the slanted surface-relief structure in the material layer.
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Accused Products
Abstract
Techniques for fabricating a slanted structure are disclosed. In one embodiment, a method of fabricating a slanted structure in a material layer includes injecting a first reactive gas into an reactive ion source generator, generating a plasma that includes reactive ions in the reactive ion source generator, extracting at least some of the reactive ions from the plasma to form a collimated reactive ion beam towards the material layer, and injecting a second reactive gas onto the material layer. The collimated reactive ion beam and the second reactive gas etch the material layer both physically and chemically to form the slanted surface-relief structure.
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Citations
15 Claims
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1. A method of fabricating a slanted surface-relief structure in a material layer, the method comprising:
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injecting a first reactive gas into an reactive ion source generator; generating a plasma using the first reactive gas in the reactive ion source generator, the plasma including reactive ions of the first reactive gas that are configured to react with the material layer to generate volatile materials; extracting at least some of the reactive ions from the plasma to form a collimated reactive ion beam towards the material layer; and injecting a second reactive gas onto the material layer, the second reactive gas configured to react with the material layer, wherein the collimated reactive ion beam and the second reactive gas etch the material layer both physically and chemically to form the slanted surface-relief structure in the material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification