Deep photoenhanced wet material etching using high-power ultraviolet light emitting diodes

• US 10,685,843 B2
• Filed: 07/24/2018
• Issued: 06/16/2020
• Est. Priority Date: 07/24/2017
• Status: Active Grant

• Current Assignee: MicroLink Devices, Inc.
• Original Assignee: MicroLink Devices, Inc.
• Inventors: Youtsey, Christopher, McCarthy, Robert
• Primary Examiner(s): Smith, Zandra V
• Assistant Examiner(s): Stevenson, Andre C
• Application Number:
  US16/044,448
• Publication Number:
  US 20190088494A1
• Time in Patent Office: 693 Days
• CPC Class Codes: H01L 21/02389 Nitrides
• CPC Class Codes: H01L 21/02458 Nitrides
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02664 Aftertreatments planarisation in general H01L21/304
• CPC Class Codes: H01L 21/30612 Etching of AIIIBV compounds
• CPC Class Codes: H01L 21/30635 of AIIIBV compounds
• CPC Class Codes: H01L 21/67075 for wet etching
• CPC Class Codes: H01L 21/67086 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 21/7813 leaving a reusable substrate, e.g. epitaxial lift off
• CPC Class Codes: H01L 29/2003 Nitride compounds
• CPC Class Codes: H01L 31/02363 of the semiconductor body itself, e.g. textured active layers
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers

Abstract

Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to create a high intensity of ultraviolet light at the surface of the substrate or at one or more layers formed on the substrate. Etching rates in GaN substrates and GaN layers are improved by an order of magnitude over conventional systems. Systems and methods for forming a device structure free of a substrate are described. The device structure is grown or applied over a release layer on a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device structure from the substrate.

Claims

1. A method of etching GaN, comprising:

submerging a substrate having a diameter of at least two inches (5.08 centimeters) into an etching solution in a bath, wherein the substrate comprises GaN or a layer comprising GaN is disposed over the substrate; and

illuminating an entire surface of the substrate comprising GaN or an entire surface of the layer comprising GaN disposed over the substrate with an intensity of light in a range from 1 W/cm² to 10 W/cm² using at least one light emitting diode (LED) source outputting an intensity of light in a range from 1 W/cm² to 40 W/cm².

2. The method of claim 1, wherein the diameter of the surface of the substrate is in a range from two inches (5.08 centimeters) to eight inches (20.32 centimeters).

3. The method of claim 1, wherein the diameter of the surface of the substrate is in a range from 10 cm to 20.3 cm.

4. The method of claim 1, wherein the intensity is in a range from 2 W/cm² to 7 W/cm².

5. The method of claim 1, wherein the at least one etching parameter is etch depth, etched feature width, or surface roughness, and a variation for the at least one etching parameter across a surface of the substrate of less than 10%.

6. The method of claim 1, wherein the at least one LED source includes a plurality of LED sources arranged in an array.

7. The method of claim 1, wherein illuminating the substrate comprising GaN or the layer comprising GaN disposed over the substrate using at least one light emitting diode source includes emitting radiation having a nominal emission wavelength of 365 nm.

8. The method of claim 1, further comprising stirring the etching solution.

9. The method of claim 1, wherein illuminating the substrate includes illuminating a front surface or a back surface of the substrate.

10. The method of claim 1, wherein a resulting etched structure in the substrate or in one or more layers on the substrate including the layer comprising GaN has a depth of greater than 10 micrometers.

11. The method of claim 10, wherein the resulting etched structure has a depth in a range from 10 micrometers to 1 mm.

12. The method of claim 10, wherein the resulting etched structure has a depth in a range from 10 micrometers to 500 micrometers.

13. The method of claim 1, wherein a resulting etched structure extends entirely through the substrate and a total thickness etched where a distance that the etch extends entirely through the substrate is in a range from 10 micrometers to 1 mm.

14. The method of claim 13, wherein the resulting etched structure has a depth in a range from 10 micrometers to 500 micrometers.

15. The method of claim 1, wherein a resulting structure is etched into the substrate or into one or more layers on the substrate including the layer comprising GaN at a rate of between 3 micrometers per hour and 250 micrometers per hour.

16. The method of claim 15, wherein the resulting structure is etched into the substrate or into one or more layers on the substrate including the layer comprising GaN at a rate of between 3 micrometers per hour and 100 micrometers per hour.

17. The method of claim 16, wherein the resulting structure is etched into the substrate or into one or more layers on the substrate including the layer comprising GaN at a rate of between 9 micrometers per hour and 20 micrometers per hour.

18. The method of claim 1, wherein the etching solution includes potassium hydroxide (KOH).

19. The method of claim 18, wherein the molarity of KOH in the etching solution is in a range from 0.01 M to 10 M.

20. The method of claim 19, wherein the molarity of KOH in the etching solution is in a range from 0.01 M to 1 M.

21. The method of claim 1, further comprising forming a perforated layer over the substrate comprising GaN or over the layer comprising GaN disposed over the substrate;

wherein illuminating the substrate or the layer comprising GaN disposed over the substrate causes vertical etching of the substrate comprising GaN or of the layer comprising GaN disposed over the substrate at perforations of the perforated layer.

22. The method of claim 1, wherein the substrate comprises GaN.

23. The method of claim 22, wherein the substrate comprises a GaN wafer.

25. The method of claim 1, wherein the method is also a method for forming a GaN-based device free of a substrate and further comprises:

providing the substrate having a front surface and a back surface facing away from the front surface;

forming a release layer over the front surface of the substrate, the release layer having a first bandgap energy level;

forming one or more layers of the device over the release layer to form the GaN-based device; and

forming a perforated support layer on one of the device layers to form an outermost layer of a stackup that includes the substrate, the release layer, the one or more device layers and the perforated support layer,

wherein illuminating the substrate comprises;

exposing the stackup to a photoenhanced vertical wet etch environment including illuminating the perforated support layer and exposed portions of the one or more layers of the device and exposed portions of the release layer using the at least one light emitting diode source to vertically etch the portions of the release layer and at least one of the one or more layers of the device, wherein the etched portions of the release layer and at least one of the one or more layers of the device underlie perforations in the support layer; and

exposing the stackup to a photoenhanced lateral wet etch environment including illuminating the second surface of the substrate using the at least one light emitting diode source to laterally etch the release layer, the photoenhanced lateral wet etch environment impinging photons on the release layer having an energy level greater than or equal to that of the first bandgap energy level of the release layer.

24. A system for photoenhanced etching of GaN, comprising:

a bath including an etching solution into which a substrate is submerged, wherein the substrate comprises GaN or a layer comprising GaN is disposed over the substrate; and

at least one light emitting diode source to illuminate the substrate comprising GaN or the layer comprising GaN disposed over the substrate,

wherein a surface of the substrate has a diameter in a range of two inches (5.08 centimeters) to eight inches (20.32 centimeters) and wherein an intensity of light provided by the system across the entire surface of the substrate or across the entire surface of the layer comprising GaN disposed over the substrate is in a range from 1 W/cm² to 10 W/cm².