Laser component and method of producing a laser component
First Claim
1. A method of producing a laser component comprisingproviding a wafer having a first laser chip and a second laser chip;
- applying a trench extending from an upper side of the first laser chip and the second laser chip into the wafer,the trench being arranged between the first laser chip and the second laser chip,the trench being oriented parallel to a resonator of the first laser chip; and
arranging a passivation layer in the trench;
arranging a first metallization on the upper side of the first laser chip;
separating the first laser chip and the second laser chip along a separating plane extending through the trench, side surfaces of the first laser chip and the second laser chip being formed on the separating plane; and
arranging the first laser chip on a surface of a carrier, the side surface of the first laser chip facing toward the surface of the carrier, a first solder contact arranged on the surface of the carrier being electrically conductively connected to the first metallization.
1 Assignment
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Accused Products
Abstract
A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.
23 Citations
16 Claims
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1. A method of producing a laser component comprising
providing a wafer having a first laser chip and a second laser chip; -
applying a trench extending from an upper side of the first laser chip and the second laser chip into the wafer, the trench being arranged between the first laser chip and the second laser chip, the trench being oriented parallel to a resonator of the first laser chip; and arranging a passivation layer in the trench; arranging a first metallization on the upper side of the first laser chip; separating the first laser chip and the second laser chip along a separating plane extending through the trench, side surfaces of the first laser chip and the second laser chip being formed on the separating plane; and arranging the first laser chip on a surface of a carrier, the side surface of the first laser chip facing toward the surface of the carrier, a first solder contact arranged on the surface of the carrier being electrically conductively connected to the first metallization. - View Dependent Claims (2, 3)
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4. A laser component comprising
an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein the side surface is oriented perpendicularly to the upper side and to the end side: -
an emission region is arranged on the end side; a first metallization is arranged on the upper side; a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface; a passivation layer is arranged in the set-back part of the side surface; the edge-emitting first laser chip is arranged on a surface of a carrier, wherein the side surface faces toward the surface of the carrier; and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A laser component comprising
an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein the side surface is oriented perpendicularly to the upper side and to the end side; -
an emission region is arranged on the end side; a first metallization is arranged on the upper side; a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface; a passivation layer is arranged in the set-back part of the side surface; the edge-emitting first laser chip is arranged on a surface of a carrier, wherein the side surface faces toward the surface of the carrier; a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization; the first metallization connects the upper side of the edge-emitting first laser chip to an upper side of a second laser chip; and a distance between the emission region of the edge-emitting first laser chip and an emission region of the second laser chip is less than 20 μ
m.
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Specification