Solid state lamp using light emitting strips

• US 10,690,294 B2
• Filed: 10/23/2019
• Issued: 06/23/2020
• Est. Priority Date: 02/22/2011
• Status: Active Grant

• Current Assignee: Quarkstar LLC
• Original Assignee: Quarkstar LLC
• Inventors: Steele, Robert V., Lerman, Louis, York, Allan Brent, Dau, Wilson, Teng, Jacqueline, Lerman, George
• Primary Examiner(s): Breval, Elmito
• Application Number:
  US16/661,978
• Publication Number:
  US 20200056749A1
• Time in Patent Office: 244 Days
• Field of Search: None
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/235 Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps F21K9/238 takes precedence
• CPC Class Codes: F21K 9/237 Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases F21K9/238 takes precedence
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21K 9/65 specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 13/14 the elements being filters or photoluminescent elements, reflectors and refractors
• CPC Class Codes: F21V 17/12 by screwing
• CPC Class Codes: F21V 17/14 Bayonet-type fastening
• CPC Class Codes: F21V 19/0025 the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 23/02 the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/10 Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/00 : Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 3/02 : characterised by the shape
• CPC Class Codes: F21V 5/10 : comprising photoluminescent material
• CPC Class Codes: F21V 7/00 : Reflectors for light sources characterised by cooling arrangements F21V29/505
• CPC Class Codes: F21V 7/06 : with parabolic curvature
• CPC Class Codes: F21V 9/00 : Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters coloured shades F21V1/00; elements characterised by cooling arrangements F21V29/502
• CPC Class Codes: F21V 9/30 : Elements containing photoluminescent material distinct from or spaced from the light source shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40
• CPC Class Codes: F21V 9/32 : characterised by the arrangement of the photoluminescent material
• CPC Class Codes: F21V 9/38 : Combination of two or more photoluminescent elements of different materials
• CPC Class Codes: F21Y 2101/00 : Point-like light sources
• CPC Class Codes: F21Y 2103/10 : comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/00 : Planar light sources
• CPC Class Codes: F21Y 2107/00 : Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/20 : on convex supports or substrates, e.g. on the outer surface of spheres
• CPC Class Codes: F21Y 2107/30 : on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2107/90 : on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 : Light-emitting diodes [LED]
• CPC Class Codes: F21Y 2115/15 : Organic light-emitting diodes [OLED]
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

In one embodiment, an LED lamp has a generally bulb shape. The LEDs are low power types and are encapsulated in thin, narrow, flexible strips. The LEDs are connected in series in the strips to drop a desired voltage. The strips are affixed to the outer surface of a bulb form to provide structure to the lamp. The strips are connected in parallel to a power supply, which may be housed in the lamp. Since many low power LEDs are used and are spread out over a large surface area, there is no need for a large metal heat sink. Further, the light emission is similar to that of an incandescent bulb. In other embodiment, there is no bulb form and the strips are bendable to have a variety of shapes. In another embodiment, a light sheet is bent to provide 360 degrees of light emission. Many other embodiments are described.

Claims

1. A solid state lamp comprising:

a connector configured to connect the solid state lamp to a socket, the connector defining an axis; and

a bulb portion extending along the axis and attached to the connector, the bulb portion comprising;

a flexible elongate substrate extending from a first end to a second end opposite the first end, the substrate supporting a plurality of spaced-apart light emitting diode (LED) dies encapsulated on the substrate by an encapsulant comprising a phosphor and a binder,

wherein the LED dies are unpackaged LED dies operatively connected without wire bonds.

2. The solid state lamp of claim 1, wherein the substrate is curved.

3. The solid state lamp of claim 1, wherein the LED dies are flip-chip LED dies operatively interconnected without wire bonds.

4. The solid state lamp of claim 3, wherein the interconnections between the flip-chip LED dies comprise electrically conductive traces.

5. The solid state lamp of claim 1, wherein the substrate is curved in the form of a spiral.

6. The solid state lamp of claim 1, wherein the elongate substrate has opposing first and second sides extending between the first and second ends and the elongate substrate allows light to pass between the first and second sides.

7. The solid state lamp of claim 1, wherein the elongate substrate is transparent or reflective.

8. The solid state lamp of claim 1, wherein the elongate substrate has opposing first and second sides extending between the first and second ends and the dies are arranged on the first side of the substrate.

9. The solid state lamp of claim 1, wherein the elongate substrate has opposing first and second sides extending between the first and second ends and the dies are arranged on the first and second sides of the substrate.

10. The solid state lamp of claim 1, further comprising one or more additional flexible elongate substrates each extending from a corresponding first end to a corresponding second end opposite the first end, each substrate supporting a plurality of spaced-apart LED dies encapsulated on the substrate by an encapsulant comprising a phosphor and a binder.

11. The solid state lamp of claim 10, wherein for at least one of the elongate substrates, the dies are flip-chip LED dies operatively interconnected without wire bonds.

12. The solid state lamp of claim 10, wherein the substrates are symmetrically distributed around the axis.

13. The solid state lamp of claim 10, wherein the substrates are arranged in planes perpendicular to the axis.

14. The solid state lamp of claim 10, wherein at least one of the additional elongate substrates is a curved substrate.

15. The solid state lamp of claim 10, wherein at least one of the substrates has a spiral shape.

16. The solid state lamp of claim 10, wherein at least one of the substrates extends in a radial direction from the axis.

17. The solid state lamp of claim 10, wherein the substrates are arranged in a helix.

18. The solid state lamp of claim 10, wherein each of the flexible elongate substrates, with its corresponding LED dies and encapsulant compose a corresponding strip, the strips being spaced apart from each other by a space containing a gas.

19. The solid state lamp of claim 1, wherein a projection of the flexible elongate substrate onto a plane perpendicular to the axis defines a curved path.

20. The solid state lamp of claim 1, wherein a projection of the flexible elongate substrate onto a plane parallel to the axis defines a curved path.

21. The solid state lamp of claim 1, wherein the first and second ends of the flexible elongate substrate comprise corresponding first and second terminals configured to provide power to the LED dies supported by the flexible elongate substrate.

22. The solid state lamp of claim 21, further comprising one or more additional flexible elongate substrates each extending from a corresponding first end to a corresponding second end opposite the first end, each substrate supporting a corresponding plurality of spaced-apart LED dies encapsulated on the substrate by an encapsulant comprising a phosphor and a binder, each substrate supporting corresponding first and second terminals configured to provide power to the LED dies supported by the flexible elongate substrate, and

further comprising a common conductor electrically connected to the first terminals of at least some of the flexible elongate substrates that are arranged proximate to the connector, the common conductor being configured to provide power to all the LED dies.

23. The solid state lamp of claim 1, further comprising a support structure, wherein the support structure provides support for the elongate substrate.

24. The solid state lamp of claim 23, wherein the elongate substrate has a curved shape and the support structure maintains the curved shape of the elongate substrate.

25. The solid state lamp of claim 23, wherein the support structure comprises a stiff rod.

26. The solid state lamp of claim 25, wherein a shape, height, or curvature of the elongate substrate depends on a length of the stiff rod.

27. The solid state lamp of claim 23, wherein the support structure has a support surface in contact with the elongate substrate or the encapsulant.

28. The solid state lamp of claim 1, wherein the elongate substrate, the dies, and the encapsulant are configured to mimic the appearance of a filament in an incandescent light bulb during operation.

29. The solid state lamp of claim 1, wherein the substrate comprises one or more metal portions including copper or aluminum.