Micro-transfer printed LED and color filter structures

• US 10,692,844 B2
• Filed: 05/25/2018
• Issued: 06/23/2020
• Est. Priority Date: 04/05/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Inventors: Cok, Ronald S., Bower, Christopher Andrew
• Primary Examiner(s): Gebreyesus, Yosef
• Application Number:
  US15/990,305
• Publication Number:
  US 20180277525A1
• Time in Patent Office: 760 Days
• CPC Class Codes: H01L 24/00 Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

A micro-transfer printed intermediate structure comprises an intermediate substrate and one or more pixel structures disposed on the intermediate substrate. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure. A fractured intermediate tether is physically attached to the intermediate substrate. A method of making an intermediate structure source wafer comprises providing a source wafer having a patterned sacrificial layer including sacrificial portions separated by anchors, disposing an intermediate substrate over the patterned sacrificial layer, and disposing one or more pixel structures on the intermediate substrate entirely on or over each sacrificial portion. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure to form an intermediate structure.

Claims

1. A micro-transfer printed color-filter structure, comprising:

a color filter; and

a fractured color-filter tether attached to the color filter or layers formed in contact with the color filter.

2. The color filter of claim 1, wherein the color filter is or includes one or more of:

a curable resin, a dye, a pigment, a color-conversion material, a semiconductor crystal, a phosphor, and a quantum dot.

3. The color filter of claim 1, wherein the fractured color-filter tether includes at least some of the same material as the color filter.

4. The color-filter structure of claim 1, further comprising an encapsulation layer, wherein the fractured color-filter tether includes at least some of the same material as the encapsulation layer or at least a portion of the encapsulation layer forms the color-filter tether.

5. The color-filter structure of claim 1, wherein the color filter is constructed to filter light.

6. The color-filter structure of claim 1, wherein the color filter is constructed to convert light.

7. A micro-transfer printed pixel structure, comprising:

an LED having a light-emitting side;

a color filter disposed adjacent to the light-emitting side of the LED; and

a fractured pixel tether physically attached (i) to the LED, (ii) to layers disposed on or in contact with the LED, (iii) to the color filter, or (iv) to layers disposed on the color filter.

8. The pixel structure of claim 7, wherein the color filter is or includes one or more of:

a curable resin, a dye, a pigment, a color conversion material, a semiconductor crystal, a phosphor, and a quantum dot.

9. The pixel structure of claim 7, wherein the fractured pixel tether includes at least some of the same material as the color filter, wherein the fractured pixel tether includes at least some of the same material as the LED, or both.

10. A light-emitting diode (LED) display, comprising:

a display substrate; and

a plurality of micro-transfer printed pixel structures according to claim 7 disposed on the display substrate, wherein the LED of each of the micro-transfer printed pixel structures is an inorganic LEDs.

11. The LED display of claim 10, wherein the corresponding color filter is located between the display substrate and the corresponding inorganic LED.

12. The LED display of claim 10, wherein each of the one or more inorganic LEDs is located between the display substrate and the corresponding color filter.

13. The LED display of claim 10, wherein the corresponding color filter is constructed to filter light.

14. The LED display of claim 10, wherein the corresponding color filter is constructed to convert light.

15. The micro-transfer printed pixel structure of claim 7, comprising an encapsulation layer encapsulating the LED and the color filter, wherein the encapsulation layer forms the fractured pixel tether or the fractured pixel tether is a part of or is attached to the encapsulation layer.

16. A micro-transfer printed intermediate structure, comprising:

an intermediate substrate;

one or more pixel structures disposed on or over the intermediate substrate, each of the one or more pixel structures including an LED having a light-emitting side, a color filter disposed adjacent to the light-emitting side of the LED, and a fractured pixel tether physically attached to the pixel structure; and

a fractured intermediate tether physically attached to the intermediate substrate or physically attached to a layer disposed on the intermediate substrate.

17. The intermediate structure of claim 16, wherein:

(i) the color filter is or includes one or more of;

a curable resin, a dye, a pigment, a color conversion material, a semiconductor crystal, a phosphor, or a quantum dot;

(ii) the intermediate substrate is or includes a glass, a polymer, a semiconductor, or silicon;

or

both (i) and (ii).

18. The intermediate structure of claim 16, wherein the fractured pixel tether includes at least some of the same material as the color filter or wherein the fractured pixel tether includes at least some of the same material as the LED, or both.

19. The intermediate structure of claim 16, wherein the fractured intermediate tether includes at least some of the same material as the color filter or wherein the fractured intermediate tether includes at least some of the same material as the intermediate substrate, or both.

20. The intermediate structure of claim 16, comprising an encapsulation layer encapsulating the color filter and LED, wherein the fractured pixel tether includes at least some of the same material as the encapsulation layer or at least a portion of the encapsulation layer forms the fractured pixel tether or the fractured pixel tether is a part of or is attached to the encapsulation layer.

21. The intermediate structure of claim 16, comprising an encapsulation layer encapsulating the color filter and LED, wherein the fractured intermediate tether includes at least some of the same material as the encapsulation layer or at least a portion of the encapsulation layer forms the fractured intermediate tether or the fractured intermediate tether is a part of or is attached to the encapsulation layer.

22. A light-emitting diode (LED) display, comprising:

a display substrate; and

a plurality of pixel structures disposed on the display substrate, each of the plurality of pixel structures comprising one or more LEDs and a corresponding color filter corresponding to each of the one or more LEDs, wherein the one or more LEDs each have a light-emitting side and the corresponding color filter is disposed adjacent to the light-emitting side of the corresponding LED,

wherein said each of the one or more LEDs is a micro-transfer printed LED and a fractured LED tether is physically attached to the LED.

23. A light-emitting diode (LED) display, comprising:

a display substrate; and

a plurality of pixel structures disposed on the display substrate, each of the plurality of pixel structures comprising one or more LEDs and a corresponding color filter corresponding to each of the one or more LEDs, wherein the one or more LEDs each have a light-emitting side and the corresponding color filter is disposed adjacent to the light-emitting side of the corresponding LED,

wherein the corresponding color filter is a micro-transfer printed color filter and a fractured color-filter tether is physically attached to the color filter.

24. A light-emitting diode (LED) display, comprising:

a display substrate; and

a plurality of pixel structures disposed on the display substrate, each of the plurality of pixel structures comprising one or more LEDs and a corresponding color filter corresponding to each of the one or more LEDs, wherein the one or more LEDs each have a light-emitting side and the corresponding color filter is disposed adjacent to the light-emitting side of the corresponding LED,

wherein each of the plurality of pixel structures is a micro-transfer printed pixel structure comprising a fractured pixel tether.

25. A light-emitting diode (LED) display, comprising:

a display substrate; and

a plurality of pixel structures disposed on the display substrate, each of the plurality of pixel structures comprising one or more LEDs and a corresponding color filter corresponding to each of the one or more LEDs, wherein the one or more LEDs each have a light-emitting side and the corresponding color filter is disposed adjacent to the light-emitting side of the corresponding LED,

wherein each of the plurality of pixel structures is part of an intermediate structure comprising a fractured intermediate tether.