Method of manufacturing a semiconductor device
First Claim
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1. A semiconductor device comprising:
- an IGBT (Insulated Gate Bipolar Semiconductor) including;
a semiconductor layer having a first surface and a second surface;
a first conductive-type collector region formed such that the collector region is exposed on the second surface of the semiconductor layer;
a second conductive-type base region formed closer to the first surface of the semiconductor layer with respect to the collector region such that the base region is in contact with the collector region;
a first conductive-type channel region formed closer to the first surface of the semiconductor layer with respect to the base region such that the channel region is in contact with the base region;
a second conductive-type emitter region formed closer to the first surface of the semiconductor layer with respect to the channel region such that the emitter region is in contact with the channel region, the emitter region forming a portion of the first surface of the semiconductor layer;
a collector electrode formed such that the collector electrode is in contact with the second surface of the semiconductor layer, the collector electrode connected to the collector region;
a gate electrode formed on the first surface of the semiconductor layer such that an insulating film is formed between the gate electrode and the semiconductor layer; and
an emitter electrode formed such that the emitter electrode is in contact with the first surface of the semiconductor layer, the emitter electrode connected to the emitter region, anda Schottky joint portion forming a Schottky junction with the first surface of the semiconductor layer using the emitter electrode as an anode electrode in the vicinity of the IGBT.
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Abstract
A method for manufacturing a semiconductor device having an SiC-IGBT and an SiC-MOSFET in a single semiconductor chip, including forming a second conductive-type SiC base layer on a substrate, and selectively implanting first and second conductive-type impurities into surfaces of the substrate and base layer to form a collector region, a channel region in a surficial portion of the SiC base layer, and an emitter region in a surficial portion of the channel region, the emitter region serving also as a source region of the SiC-MOSFET.
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Citations
21 Claims
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1. A semiconductor device comprising:
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an IGBT (Insulated Gate Bipolar Semiconductor) including; a semiconductor layer having a first surface and a second surface; a first conductive-type collector region formed such that the collector region is exposed on the second surface of the semiconductor layer; a second conductive-type base region formed closer to the first surface of the semiconductor layer with respect to the collector region such that the base region is in contact with the collector region; a first conductive-type channel region formed closer to the first surface of the semiconductor layer with respect to the base region such that the channel region is in contact with the base region; a second conductive-type emitter region formed closer to the first surface of the semiconductor layer with respect to the channel region such that the emitter region is in contact with the channel region, the emitter region forming a portion of the first surface of the semiconductor layer; a collector electrode formed such that the collector electrode is in contact with the second surface of the semiconductor layer, the collector electrode connected to the collector region; a gate electrode formed on the first surface of the semiconductor layer such that an insulating film is formed between the gate electrode and the semiconductor layer; and an emitter electrode formed such that the emitter electrode is in contact with the first surface of the semiconductor layer, the emitter electrode connected to the emitter region, and a Schottky joint portion forming a Schottky junction with the first surface of the semiconductor layer using the emitter electrode as an anode electrode in the vicinity of the IGBT. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device comprising:
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a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) including; a semiconductor layer having a first surface and a second surface; a first conductive-type drain region formed such that the drain region is exposed on the second surface of the semiconductor layer; a first conductive-type drift region formed closer to the first surface of the semiconductor layer with respect to the drain region such that the drift region is in contact with the drain region; a second conductive-type channel region formed closer to the first surface of the semiconductor layer with respect to the drift region such that the channel region is in contact with the drift region; a first conductive-type source region formed closer to the first surface of the semiconductor layer with respect to the channel region such that the source region is in contact with the channel region, the source region forming a portion of the first surface of the semiconductor layer; a drain electrode formed such that the drain electrode is in contact with the second surface of the semiconductor layer, the drain electrode connected to the drain region; a gate electrode formed on the first surface of the semiconductor layer such that an insulating film is formed between the gate electrode and the semiconductor layer; and an source electrode formed such that the source electrode is in contact with the first surface of the semiconductor layer, the source electrode connected to the source region, and a Schottky joint portion forming a Schottky junction with the first surface of the semiconductor layer using the source electrode as an anode electrode in the vicinity of the MOSFET. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification