Semiconductor device and method for manufacturing the same
First Claim
1. A method for manufacturing a semiconductor device, the method comprising:
- forming an active pattern on a substrate such that the active pattern includes sacrificial patterns and semiconductor patterns alternately and repeatedly stacked on the substrate;
forming first spacer patterns at both sides of each of the sacrificial patterns by performing an oxidation process; and
forming second spacer patterns at both sides of each of the semiconductor patterns by performing the oxidation process,wherein the first spacer patterns correspond to oxidized portions of each of the sacrificial patterns, and the second spacer patterns correspond to oxidized portions of each of the semiconductor patterns,wherein the sacrificial patterns include a first semiconductor material containing impurities,wherein the semiconductor patterns include a second semiconductor material different from the first semiconductor material,wherein the impurities include an element different from semiconductor elements of the first semiconductor material and the second semiconductor material, andwherein the first spacer patterns include the impurities.
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Accused Products
Abstract
A method for manufacturing a semiconductor device and a semiconductor device, the method including forming an active pattern on a substrate such that the active pattern includes sacrificial patterns and semiconductor patterns alternately and repeatedly stacked on the substrate; and forming first spacer patterns at both sides of each of the sacrificial patterns by performing an oxidation process, wherein the first spacer patterns correspond to oxidized portions of each of the sacrificial patterns, wherein the sacrificial patterns include a first semiconductor material containing impurities, wherein the semiconductor patterns include a second semiconductor material different from the first semiconductor material, and wherein the impurities include an element different from semiconductor elements of the first semiconductor material and the second semiconductor material.
19 Citations
19 Claims
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1. A method for manufacturing a semiconductor device, the method comprising:
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forming an active pattern on a substrate such that the active pattern includes sacrificial patterns and semiconductor patterns alternately and repeatedly stacked on the substrate; forming first spacer patterns at both sides of each of the sacrificial patterns by performing an oxidation process; and forming second spacer patterns at both sides of each of the semiconductor patterns by performing the oxidation process, wherein the first spacer patterns correspond to oxidized portions of each of the sacrificial patterns, and the second spacer patterns correspond to oxidized portions of each of the semiconductor patterns, wherein the sacrificial patterns include a first semiconductor material containing impurities, wherein the semiconductor patterns include a second semiconductor material different from the first semiconductor material, wherein the impurities include an element different from semiconductor elements of the first semiconductor material and the second semiconductor material, and wherein the first spacer patterns include the impurities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing a semiconductor device, the method comprising:
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forming a preliminary active pattern extending in a first direction on a substrate such that the preliminary active pattern includes preliminary sacrificial patterns and preliminary semiconductor patterns alternately and repeatedly stacked on the substrate; forming a sacrificial gate pattern on the substrate such that the sacrificial gate pattern extends in a second direction intersecting the first direction to intersect the preliminary active pattern; removing portions of the preliminary active pattern at both sides of the sacrificial gate pattern to form an active pattern under the sacrificial gate pattern such that the active pattern includes sacrificial patterns and semiconductor patterns alternately and repeatedly stacked; and oxidizing both sidewalls of the active pattern to form first spacer patterns at both sides of each of the sacrificial patterns and second spacer patterns at both sides of each of the semiconductor patterns at the same time, wherein the first spacer patterns correspond to oxidized portions of each of the sacrificial patterns and the second spacer patterns correspond to oxidized portions of each of the semiconductor patterns, wherein the preliminary sacrificial patterns and the sacrificial patterns include a first semiconductor material containing impurities, wherein the preliminary semiconductor patterns and the semiconductor patterns include a second semiconductor material different from the first semiconductor material, and wherein the impurities include an element different from semiconductor elements of the first and second semiconductor materials. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification