High-performance LED fabrication
First Claim
1. An LED package comprising:
- a substrate having a substrate top surface;
a plurality of contacts;
a reflective material disposed over at least a portion of said top surface, said reflective material not extending above said plurality of contacts; and
a first plurality of flip-chip LEDs and a second plurality of flip-chip LEDs, each having LED contacts, said LED contacts contacting said plurality of contacts, wherein the first and second pluralities of flip-chip LEDs have different emission colors.
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Accused Products
Abstract
High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a wavelength of 390 nm to 470 nm or at a wavelength of 405 nm to 430 nm. Light emitting diode devices are characterized by having a geometric relationship (e.g., aspect ratio) between a lateral dimension of the device and a vertical dimension of the device such that the geometric aspect ratio forms a volumetric light emitting diode that delivers a substantially flat current density across the device (e.g., as measured across a lateral dimension of the active region). The light emitting diode devices are characterized by having a current density in the active region of greater than about 175 Amps/cm2.
473 Citations
20 Claims
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1. An LED package comprising:
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a substrate having a substrate top surface; a plurality of contacts; a reflective material disposed over at least a portion of said top surface, said reflective material not extending above said plurality of contacts; and a first plurality of flip-chip LEDs and a second plurality of flip-chip LEDs, each having LED contacts, said LED contacts contacting said plurality of contacts, wherein the first and second pluralities of flip-chip LEDs have different emission colors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification