Method for attaching light transmissive member to light emitting element for manufacturing light emitting device

• US 10,693,045 B2
• Filed: 07/17/2018
• Issued: 06/23/2020
• Est. Priority Date: 07/28/2017
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Maeda, Rie
• Primary Examiner(s): Luke, Daniel
• Application Number:
  US16/037,763
• Publication Number:
  US 20190035986A1
• Time in Patent Office: 707 Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The method of manufacturing a light emitting device includes: providing a light-transmissive member having a plate-like shape; providing light emitting elements each having a primary light emission surface and an electrode formation surface; bonding the light emitting elements to a base member such that the electrode formation surfaces of the light emitting elements face an upper surface of the base member; disposing the light emitting elements on the light-transmissive member such that the primary light emission surfaces of the light emitting elements face an upper surface of the light-transmissive member via a light-transmissive bonding member; disposing a part of the bonding member on a lateral surface of each of the light emitting elements; removing a part of the light-transmissive member to form a groove between the light emitting elements; forming a light-reflective member at least in the groove; and cutting the light-reflective member and the base member.

Claims

1. A method of manufacturing a light emitting device, the method comprising:

providing a light-transmissive member having a plate-like shape;

providing a plurality of light emitting elements each having a primary light emission surface and an electrode formation surface on a side opposite to the primary light emission surface;

bonding the light emitting elements to an upper surface of a base member such that the electrode formation surface of each of the light emitting elements faces the upper surface of the base member;

after the bonding of the light emitting elements to the upper surface of the base member, orienting the light emitting elements and the base member so that the primary emission surface of each of the light emitting elements face downwardly, bringing the light emitting elements into contact with a light-transmissive bonding member while the primary emission surface of each of the light emitting elements faces downwardly, and placing the bonding member on the primary light emission surface of each of the light emitting elements,

disposing the light emitting elements on an upper surface of the light-transmissive member such that the primary light emission surface of each of the light emitting elements faces the upper surface of the light-transmissive member via the bonding member interposed therebetween;

disposing a part of the bonding member on a lateral surface of each of the light emitting elements;

removing a part of the light-transmissive member to form a groove between the light emitting elements;

forming a light-reflective member at least in the groove; and

cutting the light-reflective member.

2. The method of manufacturing a light emitting device according to claim 1, wherein the disposing of the part of the bonding member on the lateral surface of each of the light emitting elements includes disposing the bonding member such that a thickness of a portion of the bonding member which is in contact with the lateral surface of a corresponding one of the light emitting elements is greater than a thickness of a portion of the bonding member which is away from the lateral surface of the corresponding one of the light emitting elements, the thickness being measured along a direction parallel to the lateral surface of the corresponding one of the light emitting elements.

3. The method of manufacturing a light emitting device according to claim 1, wherein

the providing of the light-transmissive member includes providing a layered body of a fluorescent material-containing layer and a fluorescent material-free layer as the light-transmissive member, and

the disposing of the light emitting elements on the upper surface of the light-transmissive member includes disposing the light emitting elements on the fluorescent material-containing layer such that the primary light emission surface of each of the light emitting elements faces the fluorescent material-containing layer.

4. The method of manufacturing a light emitting device according to claim 1, wherein the disposing of the part of the bonding member on the lateral surface of each of the light emitting elements includes disposing the part of the bonding member to contact both of the lateral surface of one of the light emitting elements and the lateral surface of an adjacent one of the light emitting elements facing each other.

5. The method of manufacturing a light emitting device according to claim 1, wherein the removing of the part of the light-transmissive member to form the groove between the light emitting elements includes removing a part of the bonding member.

6. The method of manufacturing a light emitting device according to claim 1, wherein the forming of the light-reflective member includes:

covering the upper surface of the light-transmissive member; and

exposing the light-transmissive member by removing the light-reflective member disposed on the upper surface of the light-transmissive member.

7. The method of manufacturing a light emitting device according to claim 1, further comprising

cutting the base member after the forming of the light-reflective member or after the cutting of the light-reflective member.

8. The method of manufacturing a light emitting device according to claim 1, wherein

the removing of the part of the light-transmissive member includes adjusting a width of the groove so that a portion of the light-reflective member covering the lateral surface of each of the light emitting elements has a prescribed thickness.

9. The method of manufacturing a light emitting device according to claim 1, wherein the providing of the plurality of light emitting elements includes forming a distributed Bragg reflector on an electrode formation surface side of a semiconductor layered body of each of the light emitting elements.

10. The method of manufacturing a light emitting device according to claim 1, wherein

the bonding of the light emitting elements to the upper surface of the base member includes arranging the light emitting elements at an interval of 10 μ

m to 1000 μ

m.

11. The method of manufacturing a light emitting device according to claim 1, wherein

the bonding member contains an additive that scatters light.

12. The method of manufacturing a light emitting device according to claim 1, wherein

the disposing of the part of the bonding member on the lateral surface of each of the light emitting elements includes disposing the part of the bonding member so that the part of the bonding member covers an entirety of the lateral surface of each of the light emitting elements.

13. The method of manufacturing a light emitting device according to claim 1, wherein

the removing of the part of the light-transmissive member includes adjusting a depth of the groove to be in a range of from 150 μ

m to 210 μ

m.

14. The method of manufacturing a light emitting device according to claim 1, wherein

the disposing of the part of the bonding member on the lateral surface of each of the light emitting elements includes disposing of the part of the bonding member so that an outer surface of the part of the bonding member is inclined so as to extend away from the lateral surface of each of the light emitting elements.

15. The method of manufacturing a light emitting device according to claim 1, wherein

the forming of the light-reflective member includes forming the light-reflective member so that a surface of the light-reflective member is flush with a surface of the light transmissive member.

16. The method of manufacturing a light emitting device according to claim 1, wherein

the removing of the part of the light-transmissive member includes forming the groove between every two or more light emitting elements.

17. The method of manufacturing a light emitting device according to claim 3, wherein

the providing of the light-transmissive member includes providing the fluorescent material-containing layer on a side closer to the primary light emission surface of each of the light emitting elements, and providing the fluorescent material-free layer on a side away from the primary light emission surface of each of the light emitting elements.

18. The method of manufacturing a light emitting device according to claim 1, further comprising

before the bringing of the light emitting elements into contact with the bonding member, providing the bonding member on a flat base.

19. The method of manufacturing a light emitting device according to claim 1, wherein

the bringing of the light emitting elements into contact with the bonding member includes applying heat while the light emitting elements are in contact with the bonding member.