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Method of forming camera module for vehicular vision system

  • US 10,694,090 B2
  • Filed: 07/29/2019
  • Issued: 06/23/2020
  • Est. Priority Date: 04/08/2016
  • Status: Active Grant
First Claim
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1. A method of forming a vehicular camera module, the method comprising:

  • providing an imager circuit board, wherein the imager circuit board has a first side and a second side separated by a thickness of the imager circuit board, and wherein an imager is disposed at the first side of the imager circuit board;

    providing a connector circuit board, wherein the connector circuit board has a first side and a second side separated by a thickness of the connector circuit board, and wherein an electrical connecting element is disposed at the second side of the connector circuit board;

    electrically connecting circuitry of the connector circuit board to circuitry of the imager circuit board, with the first side of the connector circuit board opposing the second side of the imager circuit board;

    providing a lens holder for holding a lens assembly, the lens assembly including a lens, the lens comprising a plurality of optical elements;

    disposing an adhesive in an uncured state at one or both of the lens holder and the first side of the imager circuit board;

    positioning the lens holder at the imager circuit board with the uncured adhesive disposed between and contacting the lens holder and the first side of the imager circuit board;

    optically aligning the lens with the imager at the first side of the imager circuit board;

    with the lens optically aligned with the imager at the first side of the imager circuit board, and with the adhesive between and contacting the lens holder and the first side of the imager circuit board, curing the adhesive to an at least partially cured state to secure the lens holder relative to the imager circuit board;

    wherein, with the adhesive cured to the at least partially cured state, and with circuitry of the connector circuit board electrically connected to circuitry of the imager circuit board, the lens holder, the imager circuit board and the connector circuit board form a lens holder and imager circuit board and connector circuit board construction;

    with the adhesive cured to the at least partially cured state, and with the circuitry of the connector circuit board electrically connected to the circuitry of the imager circuit board, placing the lens holder and imager circuit board and connector circuit board construction in a first mold, wherein, when placing the lens holder and imager circuit board and connector circuit board construction in the first mold, the lens holder and imager circuit board and connector circuit board construction is datumed in the first mold by a portion of the lens holder;

    forming an inner molded construction by molding, using a first polymeric resin, an inner molding over and around the imager circuit board and connector circuit board and over a portion of the lens holder;

    placing the inner molded construction in a second mold, wherein, when placing the inner molded construction in the second mold, the inner molded construction is datumed in the second mold by the portion of the lens holder; and

    forming an outer molded construction by molding, using a second polymeric resin, an outer molding over the inner molding and over another portion of the lens holder to encase the inner molding, wherein the second polymeric resin is molded partially over the electrical connecting element at the second side of the connector circuit board.

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