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Fiber-reinforced ceramic matrix composite for electronic devices

  • US 10,703,680 B2
  • Filed: 05/04/2016
  • Issued: 07/07/2020
  • Est. Priority Date: 05/25/2015
  • Status: Active Grant
First Claim
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1. A ceramic housing component for an electronic device, comprising:

  • a unitary sintered ceramic matrix material formed from a slurry deposited into a mold cavity;

    reinforcing fibers distributed substantially evenly throughout the ceramic matrix material and aligned in directions of flow of the slurry when the slurry is introduced into the mold cavity, the reinforcing fibers being oriented radially outwardly from a particular area within a first portion of the ceramic housing component and unidirectionally within a second portion of the ceramic housing component, a direction of the reinforcing fibers of the second portion being different from directions of the reinforcing fibers of the first portion;

    wherein the ceramic housing component is formed by sintering a slurry comprising the ceramic matrix material and the reinforcing fibers to remove a binder from the ceramic matrix material.

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