Optical fingerprint sensor

• US 10,705,272 B2
• Filed: 11/27/2017
• Issued: 07/07/2020
• Est. Priority Date: 02/02/2015
• Status: Active Grant

• Current Assignee: Beijing Jiiov Technology Company Limited
• Original Assignee: Will Semiconductor Shanghai Co., Ltd.
• Inventors: Smith, Patrick, Wickboldt, Paul, Worfolk, Patrick A., Molesa, Steven, Lee, Young, Klenkler, Richard
• Primary Examiner(s): Lemieux, Ian L
• Application Number:
  US15/823,457
• Publication Number:
  US 20180081098A1
• Time in Patent Office: 953 Days
• CPC Class Codes: G02B 27/30 Collimators
• CPC Class Codes: G02B 27/58 Optics for apodization or superresolution; Optical synthetic aperture systems
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: G02B 5/208 for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
• CPC Class Codes: G02B 6/005 provided by one optical element, or plurality thereof, placed on the light output side of the light guide
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing

Abstract

Systems and methods for optical imaging are disclosed. The optical fingerprint sensor includes an image sensor array; a collimator filter layer disposed above the image sensor array, the collimator filter layer having an array of apertures; and an illumination layer disposed above the collimator filter layer. The collimator filter layer filters reflected light such that only certain of the reflected light beams reach optical sensing elements in the image sensor array. Employing the collimator filter layer prevents blurring while allowing for a lower-profile image sensor.

Claims

1. An optical fingerprint sensor, comprising:

an image sensor array;

a collimator filter layer disposed above the image sensor array, the collimator filter layer having an array of apertures, wherein the array of apertures are positioned to receive light from a light source for fingerprint imaging, and wherein sidewalls of the apertures in the array of apertures include structures to prevent light from reflecting off the sidewalls and reaching the image sensor array, wherein the structures comprise grooved surfaces; and

a reflective layer disposed on a top surface of the collimator filter layer, wherein the reflective layer is configured to reflect and direct light towards a sensing surface.

2. The optical fingerprint sensor of claim 1, wherein the image sensor array and the collimator filter layer are formed in a semiconductor die.

3. The optical fingerprint sensor of claim 1, wherein the collimator filter layer comprises a cured polymer.

4. The optical fingerprint sensor of claim 1, further comprising a blocking layer disposed above the collimator filter layer, wherein the blocking layer is configured to permit transmission of non-visible light and block transmission of visible light.

5. The optical fingerprint sensor of claim 4, wherein the blocking layer comprises an electron conducting layer.

6. The optical fingerprint sensor of claim 4, where in wherein the blocking layer comprises a semitransparent layer.

7. The optical fingerprint sensor of claim 1, wherein the reflective layer comprises a multifaceted surface.

8. The optical fingerprint sensor of claim 7, wherein the multifaceted surface is metalized.

9. The optical fingerprint sensor of claim 1, wherein the top surface of the collimator filter layer is texturized.

10. An optical fingerprint sensor, comprising:

a collimating layer including a plurality of apertures and a top surface, wherein the plurality of apertures are configured to block a first portion of light originated from a light source and to transmit a second portion of the light, and wherein the top surface is configured to reflect a third portion of the light towards a sensing region; and

an image sensor layer disposed below the collimating layer, the image sensor layer including an array of optical sensor elements arranged to receive the second portion of light transmitted through one of the plurality of apertures;

wherein sidewalls of the apertures in the plurality of apertures of the collimating layer include structures to prevent light from reflecting off the sidewalls and reaching the image sensor layer, wherein the structures comprise grooved surfaces.

11. The optical fingerprint sensor of claim 10, wherein the image sensor layer and the collimating layer are formed in a semiconductor die.

12. The optical fingerprint sensor of claim 10, wherein the collimating layer comprises a cured polymer.

13. The optical fingerprint sensor of claim 10, further comprising a blocking layer disposed above the collimating layer, wherein the blocking layer is configured to at least partially permit transmission of light of a first wavelength and at least partially block transmission of light of a second wavelength.

14. The optical fingerprint sensor of claim 13, wherein the blocking layer is semitransparent.

15. The optical fingerprint sensor of claim 13, wherein the blocking layer comprises an electron conducting layer.

16. The optical fingerprint sensor of claim 10, wherein the top surface comprises a multifaceted surface.

17. The optical fingerprint sensor of claim 16, wherein the multifaceted surface is metalized.

18. The optical fingerprint sensor of claim 10, wherein the top surface of the collimating layer is texturized.