Symmetric and irregular shaped plasmas using modular microwave sources

• US 10,707,058 B2
• Filed: 04/11/2017
• Issued: 07/07/2020
• Est. Priority Date: 04/11/2017
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Chua, Thai Cheng, Houshmand, Farzad, Amormino, Christian, Kraus, Philip Allan
• Primary Examiner(s): Dhingra, Rakesh K
• Application Number:
  US15/485,217
• Publication Number:
  US 20180294143A1
• Time in Patent Office: 1,183 Days
• Field of Search: 15634541, 15634535, 15634542, 15634524-34528, 118723 MW, 118723 ME, 118723 MA, 118723 MR
• CPC Class Codes: H01J 37/3222 Antennas
• CPC Class Codes: H01J 37/32238 Windows
• CPC Class Codes: H01J 37/32247 Resonators
• CPC Class Codes: H01J 37/32266 Means for controlling power transmitted to the plasma
• CPC Class Codes: H01J 37/3299 Feedback systems

Abstract

Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.

Claims

1. A plasma processing tool, comprising:

a processing chamber; and

a plurality of modular microwave sources coupled to the processing chamber, wherein the plurality of modular microwave sources comprise;

an array of applicators, wherein the array of applicators are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber, and wherein each applicator comprises a dielectric resonant cavity, wherein the dielectric resonant cavity is a solid material, an applicator housing around an outer sidewall of the dielectric resonant cavity, and a monopole extending down an axial center of the dielectric resonant cavity and into a channel formed in the center of the dielectric resonant cavity wherein an end of the monopole antenna is spaced away from a bottom surface of the channel, and wherein the array of applicators are coupled to the dielectric body; and

an array of microwave amplification modules, wherein each microwave amplification module comprises a main amplifier, and is coupled to at least one of the applicators in the array of applicators, wherein the dielectric body comprises a plurality of recesses, wherein at least one applicator is within at least one of the recesses, and wherein at least a portion of the applicator housing, a portion of the dielectric resonant cavity, and a portion of the monopole are positioned within the recess, and wherein the plurality of recesses do not pass entirely through the dielectric body.

2. The plasma processing tool of claim 1, wherein the dielectric body is symmetrical.

3. The plasma processing tool of claim 2, wherein the dielectric body is substantially wedge shaped.

4. The plasma processing tool of claim 1, wherein the dielectric body is non-symmetrical.

5. The plasma processing tool of claim 1, wherein the dielectric body is non-planar.

6. The plasma processing tool of claim 5, wherein the dielectric body is a dome.

7. The plasma processing tool of claim 6, wherein the array of applicators includes applicators with non-uniform dimensions.

8. The plasma processing tool of claim 7, wherein the resonance of each of the applicators are uniform.

9. The plasma processing tool of claim 6, wherein each of the microwave amplification modules are independently controllable.

10. The plasma processing tool of claim 6, further comprising a plurality of plasma sensors positioned among the applicators.

11. The plasma processing tool of claim 10, wherein feedback control data for each microwave amplification module is provided by one or more of the plurality of plasma sensors.

12. A plasma processing tool, comprising:

a processing chamber, wherein at least one surface of the processing chamber is a dielectric body wherein the dielectric body comprises a plurality of recesses; and

a plurality of modular microwave sources coupled to the processing chamber, wherein the plurality of modular microwave sources comprise;

an array of applicators, wherein the array of applicators are positioned in contact with the dielectric body, and wherein each applicator comprises;

a dielectric resonant cavity, wherein the dielectric resonant cavity is a solid material;

an applicator housing formed around an outer sidewall of the dielectric resonant cavity;

a monopole extending down an axial center of the dielectric resonant cavity and into a channel formed in the center of the dielectric resonant cavity, wherein an end of the monopole antenna is spaced away from a bottom surface of the channel;

wherein at least a portion of the applicator housing, a portion of the dielectric resonant cavity, and a portion of the monopole are positioned within the recess, and wherein the plurality of recesses do not pass entirely through the dielectric body; and

an array of microwave amplification modules, wherein each microwave amplification module is coupled to at least one of the applicators in the array of applicators, and wherein each microwave amplification module comprises;

a pre-amplifier;

a main power amplifier;

a power supply electrically coupled to the pre-amplifier, and the main power amplifier; and

a circulator.

13. The plasma processing tool of claim 12, wherein the dielectric body has a thickness that is less than approximately 30 mm.

14. The plasma processing tool of claim 12, wherein the plurality of recesses are not the same size.

15. The plasma processing tool of claim 12, wherein the dielectric body is symmetric.

16. The plasma processing tool of claim 12, wherein the dielectric body is non-planar.