Vehicular camera and lens assembly and method of manufacturing same

• US 10,708,476 B2
• Filed: 07/02/2018
• Issued: 07/07/2020
• Est. Priority Date: 03/25/2009
• Status: Active Grant

• Current Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Original Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Inventors: Sesti, Matthew C., Devota, Robert A., Lu, Yuesheng, Byrne, Steven V., Gibson, Joel S.
• Primary Examiner(s): Koch, George R
• Application Number:
  US16/025,062
• Publication Number:
  US 20180332200A1
• Time in Patent Office: 736 Days
• Field of Search: 156 64
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: G02B 13/001 Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras G02B23/243 takes precedence
• CPC Class Codes: G02B 27/0025 for optical correction, e.g. distorsion, aberration
• CPC Class Codes: G02B 27/62 Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
• CPC Class Codes: G02B 7/003 Alignment of optical elements G02B7/001, G02B7/002 take precedence; for mirrors G02B7/1822
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/025 using glue
• CPC Class Codes: G02B 7/04 with mechanism for focusing or varying magnification
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/63 by using electronic viewfinders
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A method of assembling a vehicular camera includes providing a printed circuit board and dispensing an adhesive in an uncured state at the printed circuit board. A front camera housing is mated with the circuit board, and the lens optics are aligned with respect to the imaging array at the circuit board by utilizing a multi-axis positioning device operable to translate the circuit board or lens assembly relative to the other along one or more orthogonal translational axes and manipulate the circuit board or lens assembly relative to the other about one or more orthogonal rotational axes. After aligning the lens optics with respect to the imaging array, the adhesive is cured to a first cure level and the joined lens assembly and the front camera housing are moved to a further curing station, where the adhesive is further cured to a second cure level.

Claims

1. A method of assembling a vehicular camera, said method comprising:

providing a lens assembly comprising a lens barrel and an attaching portion, the lens barrel including lens optics;

providing a front camera housing;

securing the lens assembly at the front camera housing;

providing a printed circuit board having an imaging array disposed thereat;

dispensing an adhesive in an uncured state at the printed circuit board laterally outboard of the imaging array;

mating the attaching portion of the front camera housing and the printed circuit board with the adhesive in its uncured state therebetween;

with the front camera housing mated with the printed circuit board and with the adhesive in its uncured state therebetween, aligning the lens optics with respect to the imaging array;

wherein aligning the lens optics with respect to the imaging array (i) utilizes a multi-axis positioning device operable to align the lens optics with respect to the imaging array by (a) translating the printed circuit board relative to the lens assembly along one or more of x, y, z orthogonal translational axes and (b) manipulating the printed circuit board relative to the lens assembly about one or more of pitch, yaw and roll rotational axes or (ii) utilizes a multi-axis positioning device operable to align the lens optics with respect to the imaging array by (a) translating the lens assembly relative to the printed circuit board along one or more of x, y, z orthogonal translational axes and (b) manipulating the lens assembly relative to the printed circuit board about one or more of pitch, yaw and roll rotational axes;

after aligning the lens optics with respect to the imaging array, curing the adhesive to a first cure level via exposure of the adhesive to ultraviolet light to join the printed circuit board and the front camera housing;

moving the lens assembly and the front camera housing joined with the printed circuit board by the adhesive at the first cure level to a further curing station; and

at the further curing station, further curing the adhesive to a second cure level.

2. The method of claim 1, wherein aligning the lens optics with respect to the imaging array utilizes the multi-axis positioning device operable to align the lens optics with respect to the imaging array by (a) translating the printed circuit board relative to the lens assembly along one or more of x, y, z orthogonal translational axes and (b) manipulating the printed circuit board relative to the lens assembly about one or more of pitch, yaw and roll rotational axes.

3. The method of claim 2, wherein aligning the lens optics with respect to the imaging array comprises grasping, via the multi-axis positioning device, the printed circuit board and manipulating, via the multi-axis positioning device, the printed circuit board relative to the lens assembly.

4. The method of claim 3, wherein, after aligning the lens optics with respect to the imaging array and after curing of the adhesive to the first cure level via exposure to ultraviolet light to join the front camera housing and the printed circuit board is completed, the printed circuit board is released by the multi-axis positioning device.

5. The method of claim 1, wherein aligning the lens optics with respect to the imaging array utilizes the multi-axis positioning device operable to align the lens optics with respect to the imaging array by (a) translating the lens assembly relative to the printed circuit board along one or more of x, y, z orthogonal translational axes and (b) manipulating the lens assembly relative to the printed circuit board about one or more of pitch, yaw and roll rotational axes.

6. The method of claim 1, wherein the multi-axis positioning device comprises a multi-axis robot.

7. The method of claim 1, wherein the multi-axis positioning device comprises a five axis robot.

8. The method of claim 1, wherein the multi-axis positioning device comprises a six axis robot.

9. The method of claim 1, wherein aligning the lens optics with respect to the imaging array comprises bringing the lens optics into focus at the imaging array.

10. The method of claim 1, wherein moving the front camera housing and the printed circuit board joined by the adhesive at the first cure level to the further curing station is accomplished without utilizing the multi-axis positioning device.

11. The method of claim 1, wherein aligning the lens optics with respect to the imaging array utilizing the multi-axis positioning device comprises aligning the lens optics with respect to the imaging array while using the imaging array to capture images of a target object, and wherein said method comprises curing the adhesive to the first cure level via exposure to ultraviolet light to join the front camera housing and the printed circuit board when the target object appears in suitable focus and at a suitable position relative to the imaging array.

12. The method of claim 1, wherein the further curing station comprises a thermal curing station.

13. The method of claim 12, wherein the thermal curing station comprises an oven.

14. The method of claim 1, wherein further curing the adhesive to the second cure level comprises heating the adhesive to a temperature of at least 85 degrees C.

15. The method of claim 14, wherein further curing the adhesive to the second cure level comprises heating the adhesive for at least ten seconds.

16. The method of claim 1, wherein the further curing station comprises multiple curing fixtures.

17. The method of claim 1, wherein the further curing station comprises a moisture cure station.

18. The method of claim 1, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for a first time period, and wherein further curing the adhesive to the second cure level comprises further curing the adhesive for a second time period, and wherein the first time period for curing the adhesive to the first cure level is less than the second time period for further curing the adhesive to the second cure level.

19. The method of claim 18, wherein the first time period is less than ten seconds and the second time period is greater than ten seconds.

20. The method of claim 19, wherein the first time period is greater than three seconds.

21. The method of claim 20, wherein the first time period is less than seven seconds.

22. The method of claim 1, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for less than ten seconds.

23. The method of claim 22, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for less than seven seconds.

24. The method of claim 22, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for greater than three seconds.

25. The method of claim 24, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for five to seven seconds.

26. The method of claim 22, wherein further curing the adhesive to the second cure level comprises a further exposure of the adhesive to ultraviolet light.

27. The method of claim 26, wherein further curing the adhesive to the second cure level comprises further exposure of the adhesive to ultraviolet light for a period of time that is greater than ten seconds.

28. The method of claim 1, wherein the adhesive comprises an epoxy-amine adhesive.

29. The method of claim 1, wherein dispensing the adhesive comprises dispensing a plurality of spaced apart dots of adhesive in its uncured state at the printed circuit board laterally outboard of the imaging array.

30. The method of claim 1, wherein dispensing the adhesive comprises dispensing a continuous bead of the adhesive in its uncured state at the printed circuit board laterally outboard of the imaging array.

31. The method of claim 1, wherein dispensing the adhesive comprises dispensing adhesive having a thickness, in its uncured state, of up to 0.75 mm prior to aligning the lens optics with respect to the imaging array.

32. The method of claim 1, wherein dispensing the adhesive utilizes a servo dispenser head.

33. The method of claim 32, comprising monitoring the dispensing of the adhesive via a vision system.

34. The method of claim 1, wherein, when the lens assembly is secured at the front camera housing, the lens barrel is partially received in a cylindrical opening of the front camera housing.

35. The method of claim 34, wherein an annular surface of the lens assembly opposes an annular surface of the front camera housing when the lens barrel is partially received in the cylindrical opening of the front camera housing.

36. The method of claim 35, wherein securing the lens assembly at the front camera housing comprises dispensing another adhesive in an uncured state at at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing.

37. The method of claim 36, wherein the other adhesive dispensed in its uncured state at at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing, when cured, at least in part establishes a seal to the outside environment when the lens assembly is secured at the front camera housing.

38. The method of claim 36, wherein, prior to dispensing the other adhesive in its uncured state, said method comprises plasma-treating at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing.

39. The method of claim 1, comprising attaching a rear camera housing to the front camera housing to encase the printed circuit board and the imaging array.

40. The method of claim 39, wherein attachment of the rear camera housing to the front camera housing sealingly joins the rear camera housing and the front camera housing together.

41. The method of claim 39, wherein the front camera housing is formed of a plastic material.

42. The method of claim 41, wherein attaching the rear camera housing to the front camera housing comprises fastening the rear camera housing to the front camera housing via at least one fastener.

43. The method of claim 39, wherein attaching the rear camera housing to the front camera housing comprises welding the rear camera housing and the front camera housing together.

44. The method of claim 39, wherein attaching the rear camera housing to the front camera housing comprises laser welding the rear camera housing and the front camera housing together.

45. The method of claim 39, wherein the rear camera housing comprises an electrical connector configured to electrically connect to a wiring harness of a vehicle when the vehicular camera is mounted at the vehicle.

46. The method of claim 45, comprising electrically connecting terminals of the electrical connector of the rear camera housing to circuitry associated with the imaging array when the rear camera housing is attached to the front camera housing.

47. A method of assembling a vehicular camera, said method comprising:

providing a lens assembly comprising a lens barrel and an attaching portion, the lens barrel including lens optics;

providing a front camera housing;

securing the lens assembly at the front camera housing;

providing a printed circuit board having an imaging array disposed thereat;

dispensing an adhesive in an uncured state at the printed circuit board laterally outboard of the imaging array;

mating the attaching portion of the front camera housing and the printed circuit board with the adhesive in its uncured state therebetween;

with the front camera housing mated with the printed circuit board and with the adhesive in its uncured state therebetween, aligning the lens optics with respect to the imaging array;

wherein aligning the lens optics with respect to the imaging array utilizes a six axis robot that is operable (a) to grasp the printed circuit board, (b) to translate the printed circuit board relative to the lens assembly along up to three of x, y, z orthogonal translational axes and (c) to manipulate the printed circuit board relative to the lens assembly about up to three of pitch, yaw and roll rotational axes;

after aligning the lens optics with respect to the imaging array, curing the adhesive to a first cure level via exposure of the adhesive to ultraviolet light to join the printed circuit board and the front camera housing;

moving the lens assembly and the front camera housing joined with the printed circuit board by the adhesive at the first cure level to a further curing station; and

at the further curing station, further curing the adhesive to a second cure level.

48. The method of claim 47, wherein, after aligning the lens optics with respect to the imaging array and after curing of the adhesive to the first cure level via exposure to ultraviolet light to join the front camera housing and the printed circuit board is completed, the printed circuit board is released by the six axis robot.

49. The method of claim 48, wherein aligning the lens optics with respect to the imaging array comprises bringing the lens optics into focus at the imaging array.

50. The method of claim 49, wherein moving the front camera housing and the printed circuit board joined by the adhesive at the first cure level to the further curing station is accomplished without utilizing the six axis robot.

51. The method of claim 47, wherein aligning the lens optics with respect to the imaging array utilizing the six axis robot comprises aligning the lens optics with respect to the imaging array while using the imaging array to capture images of a target object, and wherein said method comprises curing the adhesive to the first cure level via exposure to ultraviolet light to join the front camera housing and the printed circuit board when the target object appears in suitable focus and at a suitable position relative to the imaging array.

52. The method of claim 51, wherein the further curing station comprises a thermal curing station.

53. The method of claim 47, wherein further curing the adhesive to the second cure level comprises heating the adhesive to a temperature of at least 85 degrees C., and wherein further curing the adhesive to the second cure level comprises heating the adhesive for at least ten seconds.

54. The method of claim 47, wherein the further curing station comprises a moisture cure station.

55. The method of claim 47, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for a first time period, and wherein further curing the adhesive to the second cure level comprises further curing the adhesive for a second time period, and wherein the first time period for curing the adhesive to the first cure level is less than the second time period for further curing the adhesive to the second cure level, and wherein the first time period is less than ten seconds and the second time period is greater than ten seconds.

56. The method of claim 55, wherein the first time period is greater than three seconds, and wherein the first time period is less than seven seconds.

57. The method of claim 47, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for less than ten seconds.

58. The method of claim 57, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for greater than three seconds.

59. The method of claim 58, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for five to seven seconds.

60. The method of claim 57, wherein further curing the adhesive to the second cure level comprises a further exposure of the adhesive to ultraviolet light.

61. The method of claim 60, wherein further curing the adhesive to the second cure level comprises further exposure of the adhesive to ultraviolet light for a period of time that is greater than ten seconds.

62. The method of claim 47, wherein dispensing the adhesive comprises dispensing a plurality of spaced apart dots of adhesive in its uncured state at the printed circuit board laterally outboard of the imaging array.

63. The method of claim 47, wherein dispensing the adhesive comprises dispensing a continuous bead of the adhesive in its uncured state at the printed circuit board laterally outboard of the imaging array.

64. The method of claim 47, wherein dispensing the adhesive comprises dispensing adhesive having a thickness, in its uncured state, of up to 0.75 mm prior to aligning the lens optics with respect to the imaging array.

65. The method of claim 47, wherein dispensing the adhesive utilizes a servo dispenser head.

66. The method of claim 47, comprising monitoring the dispensing of the adhesive via a vision system.

67. The method of claim 47, wherein, when the lens assembly is secured at the front camera housing, the lens barrel is partially received in a cylindrical opening of the front camera housing, and wherein an annular surface of the lens assembly opposes an annular surface of the front camera housing when the lens barrel is partially received in the cylindrical opening of the front camera housing, and wherein securing the lens assembly at the front camera housing comprises dispensing another adhesive, in an uncured state, at at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing, that, when cured, at least in part establishes a seal to the outside environment when the lens assembly is secured at the front camera housing.

68. The method of claim 67, wherein, prior to dispensing the other adhesive in its uncured state, said method comprises plasma-treating at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing.

69. The method of claim 47, comprising attaching a rear camera housing to the front camera housing to encase the printed circuit board and the imaging array, wherein attachment of the rear camera housing to the front camera housing sealingly joins the rear camera housing and the front camera housing.

70. The method of claim 69, wherein attaching the rear camera housing to the front camera housing comprises fastening the rear camera housing to the front camera housing via at least one fastener.

71. The method of claim 69, wherein attaching the rear camera housing to the front camera housing comprises welding the rear camera housing and the front camera housing together.

72. The method of claim 69, wherein the rear camera housing comprises an electrical connector configured to electrically connect to a wiring harness of a vehicle when the vehicular camera is mounted at the vehicle, and wherein said method comprises electrically connecting terminals of the electrical connector of the rear camera housing to circuitry associated with the imaging array when the rear camera housing is attached to the front camera housing.

73. A method of assembling a vehicular camera, said method comprising:

providing a lens assembly comprising a lens barrel and an attaching portion, the lens barrel including lens optics;

providing a front camera housing;

securing the lens assembly at the front camera housing;

providing a printed circuit board having an imaging array disposed thereat;

dispensing an adhesive in an uncured state at the printed circuit board laterally outboard of the imaging array;

mating the attaching portion of the front camera housing and the printed circuit board with the adhesive in its uncured state therebetween;

with the front camera housing mated with the printed circuit board and with the adhesive in its uncured state therebetween, aligning the lens optics with respect to the imaging array;

wherein aligning the lens optics with respect to the imaging array utilizes a multi-axis robot that manipulates the printed circuit board relative to the lens assembly;

wherein, when aligning the lens optics with respect to the imaging array, the multi-axis robot is operable (a) to translationally move the printed circuit board relative to the lens assembly along any one or more of x, y and z orthogonal axes and (b) to rotationally move the printed circuit board relative to the lens assembly about any one or more of pitch, yaw and roll orthogonal axes;

after aligning the lens optics with respect to the imaging array, curing the adhesive to a first cure level via exposure of the adhesive to ultraviolet light to join the printed circuit board and the front camera housing;

moving the lens assembly and the front camera housing joined with the printed circuit board by the adhesive at the first cure level to a further curing station; and

at the further curing station, further curing the adhesive to a second cure level.

74. The method of claim 73, wherein the multi-axis robot comprises a six axis robot.

75. The method of claim 74, wherein, after aligning the lens optics with respect to the imaging array and after curing of the adhesive to the first cure level via exposure to ultraviolet light to join the front camera housing and the printed circuit board is completed, the printed circuit board is released by the multi-axis robot.

76. The method of claim 75, wherein aligning the lens optics with respect to the imaging array comprises bringing the lens optics into focus at the imaging array.

77. The method of claim 76, wherein moving the front camera housing and the printed circuit board joined by the adhesive at the first cure level to the further curing station is accomplished without utilizing the multi-axis robot.

78. The method of claim 73, wherein aligning the lens optics with respect to the imaging array utilizing the multi-axis robot comprises aligning the lens optics with respect to the imaging array while using the imaging array to capture images of a target object, and wherein said method comprises curing the adhesive to the first cure level via exposure to ultraviolet light to join the front camera housing and the printed circuit board when the target object appears in suitable focus and at a suitable position relative to the imaging array.

79. The method of claim 78, wherein the further curing station comprises a thermal curing station.

80. The method of claim 73, wherein further curing the adhesive to the second cure level comprises heating the adhesive to a temperature of at least 85 degrees C., and wherein further curing the adhesive to the second cure level comprises heating the adhesive for at least ten seconds.

81. The method of claim 73, wherein the further curing station comprises a moisture cure station.

82. The method of claim 73, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for a first time period, and wherein further curing the adhesive to the second cure level comprises further curing the adhesive for a second time period, and wherein the first time period for curing the adhesive to the first cure level is less than the second time period for further curing the adhesive to the second cure level, and wherein the first time period is less than ten seconds and the second time period is greater than ten seconds.

83. The method of claim 82, wherein the first time period is greater than three seconds, and wherein the first time period is less than seven seconds.

84. The method of claim 73, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for less than ten seconds.

85. The method of claim 84, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for greater than three seconds.

86. The method of claim 85, wherein curing the adhesive to the first cure level comprises exposure of the adhesive to ultraviolet light for five to seven seconds.

87. The method of claim 84, wherein further curing the adhesive to the second cure level comprises a further exposure of the adhesive to ultraviolet light.

88. The method of claim 87, wherein further curing the adhesive to the second cure level comprises further exposure of the adhesive to ultraviolet light for a period of time that is greater than ten seconds.

89. The method of claim 73, wherein dispensing the adhesive comprises dispensing a plurality of spaced apart dots of adhesive in its uncured state at the printed circuit board laterally outboard of the imaging array.

90. The method of claim 73, wherein dispensing the adhesive comprises dispensing a continuous bead of the adhesive in its uncured state at the printed circuit board laterally outboard of the imaging array.

91. The method of claim 73, wherein dispensing the adhesive comprises dispensing adhesive having a thickness, in its uncured state, of up to 0.75 mm prior to aligning the lens optics with respect to the imaging array.

92. The method of claim 73, wherein dispensing the adhesive utilizes a servo dispenser head.

93. The method of claim 73, comprising monitoring the dispensing of the adhesive via a vision system.

94. The method of claim 73, wherein, when the lens assembly is secured at the front camera housing, the lens barrel is partially received in a cylindrical opening of the front camera housing, and wherein an annular surface of the lens assembly opposes an annular surface of the front camera housing when the lens barrel is partially received in the cylindrical opening of the front camera housing, and wherein securing the lens assembly at the front camera housing comprises dispensing another adhesive, in an uncured state, at at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing, that, when cured, at least in part establishes a seal to the outside environment when the lens assembly is secured at the front camera housing.

95. The method of claim 94, wherein, prior to dispensing the other adhesive in its uncured state, said method comprises plasma-treating at least one of (i) the annular surface of the lens assembly and (ii) the annular surface of the front camera housing.

96. The method of claim 73, comprising attaching a rear camera housing to the front camera housing to encase the printed circuit board and the imaging array, wherein attachment of the rear camera housing to the front camera housing sealingly joins the rear camera housing and the front camera housing.

97. The method of claim 96, wherein attaching the rear camera housing to the front camera housing comprises fastening the rear camera housing to the front camera housing via at least one fastener.

98. The method of claim 96, wherein attaching the rear camera housing to the front camera housing comprises welding the rear camera housing and the front camera housing together.

99. The method of claim 96, wherein the rear camera housing comprises an electrical connector configured to electrically connect to a wiring harness of a vehicle when the vehicular camera is mounted at the vehicle, and wherein said method comprises electrically connecting terminals of the electrical connector of the rear camera housing to circuitry associated with the imaging array when the rear camera housing is attached to the front camera housing.