Double sided sensor module suitable for integration into electronic devices

• US 10,713,461 B2
• Filed: 09/18/2018
• Issued: 07/14/2020
• Est. Priority Date: 09/19/2017
• Status: Active Grant

• Current Assignee: IDEX Biometrics ASA
• Original Assignee: IDEX Biometrics ASA
• Inventors: Benkley, III, Fred G., Light, David N.
• Primary Examiner(s): Patel, Premal R
• Application Number:
  US16/134,298
• Publication Number:
  US 20190087622A1
• Time in Patent Office: 665 Days
• CPC Class Codes: G06V 40/12 Fingerprints or palmprints
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: G06V 40/1394 using acquisition arrangements
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H04M 1/0277 for a printed circuit board assembly

Abstract

A sensor assembly includes a flexible substrate with conductive traces formed on opposed sides of the substrate and oriented transversely to each other. The substrate is wrapped around a core so that the traces formed on opposed sides of a first part of the substrate form a first sensor surface on one surface of the core, and the traces formed on opposed sides of a second part of the substrate form a second sensor surface on an opposed surface of the core. The core may comprise an encapsulant overmolded onto the conductive traces on a surface of the first part of the substrate, and the second part of the substrate is folded over the encapsulant. The sensor assembly may include an integrated circuit disposed on the flexible substrate, wherein one or more of the conductive traces are electrically connected to each integrated circuit.

Claims

1. A sensor assembly comprising:

a core having first and second surfaces;

a flexible substrate having opposed first and second surfaces;

first conductive traces formed on a first part of the first surface of the flexible substrate, wherein the first conductive traces are generally parallel to one another;

second conductive traces formed on a second part of the first surface of the flexible substrate, wherein the second conductive traces are generally parallel to one another, and wherein the second conductive traces are generally parallel to the first conductive traces; and

third conductive traces formed on the second surface of the flexible substrate, wherein the third conductive traces are oriented transversely to the first and the second conductive traces, and wherein a first portion of the third conductive traces overlies the first conductive traces and a second portion of the third conductive traces overlies the second conductive traces;

wherein the flexible substrate is at least partially wrapped around the core such that the first conductive traces and the first part of the third conductive traces overlie the first surface of the core and the second conductive traces and the second part of the third conductive traces overlie the second surface of the core.

2. The sensor assembly of claim 1, further comprising at least one integrated circuit disposed on the flexible substrate, wherein one or more of the first, second, and third conductive traces are electrically connected to each integrated circuit.

3. The sensor assembly of claim 1, further comprising a conductive interconnect line connecting each of the first conductive traces, the second conductive traces, and the third conductive traces to an integrated circuit.

4. The sensor assembly of claim 1, wherein a first plurality of sensor elements comprises the first conductive traces and the third conductive traces separated from the first conductive traces by a layer of dielectric material,

wherein a second plurality of sensor elements comprises the second conductive traces and the third conductive traces separated from the second conductive traces by the layer of dielectric material, and

wherein each of the first and second plurality of sensor elements is configured to produce a signal in response to a finger surface placed in detectable proximity to the sensor element.

5. The sensor assembly of claim 1, wherein the first and second conductive traces are drive lines configured to transmit a signal, and wherein the third conductive traces are pickup lines configured to receive at least a portion of the signal transmitted by the drive lines.

6. The sensor assembly of claim 1, wherein the third conductive traces are drive lines configured to transmit a signal, and the first and second conductive traces are pickup lines configured to receive at least a portion of the signal transmitted by the drive lines.

7. The sensor assembly of claim 1, wherein a first plurality of sensor elements comprises the first conductive traces and the third conductive traces separated from the first conductive traces by a layer of dielectric material, wherein each of the first and third conductive traces is configured to transmit a signal to a finger surface placed in detectable proximity and receive a resultant signal.

8. The sensor assembly of claim 7, wherein a second plurality of sensor elements comprises the second conductive traces and the third conductive traces separated from the second conductive traces by a layer of dielectric material, wherein each of the second and third conductive traces is configured to transmit a signal to a finger surface placed in detectable proximity and receive a resultant signal.

9. The sensor assembly of claim 1, wherein the first and second surfaces of the core are parallel to each other.

10. The sensor assembly of claim 1, wherein the core comprises an encapsulant over-molded onto the first part of the flexible substrate and covering the first conductive traces and the first portion of the third conductive traces, and wherein the second part of the flexible substrate is folded over the encapsulant.

11. The sensor assembly of claim 1, wherein the core comprises one or more mounting pins on the second surface of the core and the flexible substrate comprises one or more alignment holes formed on the second part of the flexible substrate, and wherein each of the mounting pins extend into one of the alignment holes when the second part of the flexible substrate is partially wrapped over the second surface of the core.

12. The sensor assembly of claim 10, further comprising a second encapsulant over-molded onto the second part of the flexible substrate and covering the second portion of the third conductive traces.

13. The sensor assembly of claim 1, wherein the flexible substrate is wrapped such that the first surface of the flexible substrate overlies and faces the first and second surfaces of the core.

14. The sensor assembly of claim 1, wherein the flexible substrate is wrapped such that the second surface of the flexible substrate overlies and faces the first and second surfaces of the core.

15. The sensor assembly of claim 1, further comprising conductive pads formed on the flexible substrate.

16. The sensor assembly of claim 1, wherein the first conductive traces and the second conductive traces are spatially separated by a distance greater than the height of an edge connecting the first and second surfaces of the core.

17. A sensor module comprising:

a wrapped sensor assembly comprising;

a flexible substrate having opposed first and second surfaces and comprising;

spatially distinct first and second sensing areas;

an integrated circuit disposed on the first surface; and

one or more conductive pads disposed on the first surface, and

an encapsulant core with first and second surfaces over-molded onto the first surface of the flexible substrate and having openings formed therein aligned with the conductive pads, wherein the flexible substrate is partially wrapped around the encapsulant core so that the first surface of the flexible substrate contacts the first and second surfaces of the encapsulant core, the first sensing area overlies the first surface of the encapsulant core, and the second sensing area overlies the second surface of the encapsulant core.

18. The sensor module of claim 17, wherein the encapsulant core encapsulates the integrated circuit and the one or more passive components.

19. The sensor module of claim 18, further comprising a stiffener plate secured to the second surface of a portion of the flexible substrate, wherein the first surface of the portion of the flexible substrate comprises a portion of the encapsulant core encapsulating the integrated circuit.

20. The sensor module of claim 17, further comprising a stiffener plate secured to the second surface of a portion of the flexible substrate, wherein the first surface of the portion of the flexible substrate comprises the integrated circuit.

21. The sensor module of claim 17, wherein the first and second sensing areas are formed on respective parallel surfaces.

22. The sensor module of claim 17, wherein one or both of the first and second sensing areas are covered with a protective coating.

23. The sensor module of claim 17, wherein the wrapped sensor assembly further comprises one or more passive components disposed on the first surface, and wherein the encapsulant core encapsulates the one or more passive components.

24. The sensor module of claim 23, further comprising a stiffener plate secured to the second surface of a portion of the flexible substrate, wherein the first surface of the portion of the flexible substrate comprises a portion of the encapsulant core encapsulating the one or more passive components.

25. A host device with an integrated sensor comprising:

a host device body comprising first and second surfaces;

operative circuitry embedded within the host device body, wherein the host device body includes a sensor cavity formed therein, the sensor cavity being defined by a center cavity open to the second surface of the host device body and a through hole from the center cavity and through the first surface of the host device body; and

a sensor module mounted within the host device body, the sensor module comprising;

a first sensing area on a first surface of the sensor module; and

a second sensing area on a second surface of the sensor module;

wherein the sensor module is disposed within the center cavity of the sensor cavity and the first sensing area is aligned with and accessible through the through hole of the sensor cavity.

26. The host device of claim 25 wherein the first surface of the sensor module is recessed below, co-planar with, or projected above the first surface of the host device body, and the second surface of the sensor module is recessed below, co-planar with, or projected above the second surface of the host device body.

27. The host device of claim 26, further comprising a first frame disposed over the center cavity of the sensor cavity and secured at the periphery thereof to a portion of the second surface of the host device body peripherally surrounding the center cavity, the first frame having a cutout formed therein, wherein the second sensing area is aligned with and accessible through the cut out of the first frame.

28. The host device of claim 27, further comprising a second frame disposed over the through hole and secured at the periphery thereof to a portion of the first surface of the host device body peripherally surrounding the through hole, the second frame having a cutout formed therein, wherein the first sensing area is aligned with and accessible through the cutout of the second frame.

29. The host device of claim 28 where the host device is a smart card.