Fingerprint identification substrate and fabrication method thereof, display panel and display apparatus

• US 10,713,464 B2
• Filed: 04/01/2017
• Issued: 07/14/2020
• Est. Priority Date: 06/30/2016
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Han, Yanling, Dong, Xue, LV, Jing, Wang, Haisheng, Wu, Chun Wei, Ding, Xiaoliang, Liu, Yingming, Wang, Pengpeng, Liu, Wei, Cao, Xueyou, Jia, Yanan, Zhao, Lijun, Li, Changfeng, Xu, Rui, Guo, Yuzhen
• Primary Examiner(s): Safaipour, Bobbak
• Application Number:
  US15/560,050
• Publication Number:
  US 20180307887A1
• Time in Patent Office: 1,200 Days
• Field of Search: 382124
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: G06V 40/1341 Sensing with light passing through the finger
• CPC Class Codes: H01L 21/70 Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof multistep manufacturing processes of assemblies consisting of a plurality of individual semiconductor or other solid state devices H01L25/00; manufacture of assemblies consisting of preformed electrical components H05K3/00, H05K13/00
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H10K 50/00 Organic light-emitting devices integrated devices or assemblies of multiple devices H10K59/00, H10K65/00; organic semiconductor lasers H01S5/36
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens

Abstract

A fingerprint identification substrate and a fabrication method thereof, a display panel and a display apparatus are provided. The fingerprint identification substrate includes a base substrate and a plurality of fingerprint identification units on the base substrate. Each fingerprint identification unit includes a photosensitive sense electrode and a thin film transistor which are positioned on the base substrate, the photosensitive sense electrode is positioned between the base substrate and the thin film transistor, and the photosensitive sense electrode is electrically connected with a source electrode or a drain electrode of the thin film transistor.

Claims

1. A fingerprint identification substrate, comprising a base substrate and a plurality of fingerprint identification units on the base substrate, wherein each fingerprint identification unit includes a photosensitive sense electrode and a thin film transistor which are positioned on the base substrate, the photosensitive sense electrode is positioned between the base substrate and the thin film transistor, the photosensitive sense electrode is configured to convert light to a current signal and the photosensitive sense electrode is electrically connected with a source electrode or a drain electrode of the thin film transistor, and the photosensitive sense electrode and a gate electrode, an active layer and the source electrode of the thin film transistor are located on the base substrate in sequence in a direction substantially perpendicular to the base substrate.

2. The fingerprint identification substrate according to claim 1, wherein the photosensitive sense electrode and each of the gate electrode, the active layer, the source electrode, and the drain electrode of the thin film transistor are overlapped with each other in the direction substantially perpendicular to the base substrate.

3. The fingerprint identification substrate according to claim 1, wherein each fingerprint identification unit further includes a signal line, the signal line and a gate electrode of the thin film transistor are arranged on a same layer, and the signal line is electrically connected with the photosensitive sense electrode.

4. The fingerprint identification substrate according to claim 3, wherein each fingerprint identification unit further includes a first transparent electrode, and the first transparent electrode is arranged between the photosensitive sense electrode and the base substrate and is in direct contact with the photosensitive sense electrode;

and

the signal line is electrically connected with the photosensitive sense electrode via the first transparent electrode.

5. The fingerprint identification substrate according to claim 4, wherein an orthogonal projection of the photosensitive sense electrode on the base substrate locates in an orthogonal projection of the first transparent electrode on the base substrate.

6. The fingerprint identification substrate according to claim 1, wherein the fingerprint identification unit further includes a shielding layer direct above the thin film transistor;

and

orthogonal projections of the thin film transistor and the photosensitive sense electrode on the base substrate locate in an orthogonal projection of the shielding layer on the base substrate.

7. The fingerprint identification substrate according to claim 6, wherein the shielding layer and the thin film transistor are insulated from each other.

8. The fingerprint identification substrate according to claim 1, wherein the fingerprint identification unit further includes a second transparent electrode, the second transparent electrode is arranged between the photosensitive sense electrode and the thin film transistor and is in direct contact with the photosensitive sense electrode, and the orthogonal projection of the photosensitive sense electrode on the base substrate completely coincides with an orthogonal projection of the second transparent electrode on the base substrate.

9. The fingerprint identification substrate according to claim 1, wherein orthogonal projections of the signal line and the transparent electrodes on the base substrate at least partially overlap.

10. The fingerprint identification substrate according to claim 1, wherein the thin film transistor is of bottom gate type.

11. A display panel, comprising:

the fingerprint identification substrate according to claim 1, and a display unit array.

12. The display panel according to claim 11, wherein the display unit array includes a plurality of organic light emitting units, the fingerprint identification substrate is positioned on a light emergent side of the plurality of organic light emitting units, and the plurality of organic light emitting units are configured to emit light to pass through portions of the fingerprint identification substrate, which are positioned between a plurality of fingerprint identification units.

13. The display panel according to claim 11, further comprising a liquid crystal layer positioned between the fingerprint identification substrate and the display unit array, wherein the display unit array includes a plurality of pixel units, the fingerprint identification substrate is positioned on a light emergent side of the plurality of pixel units, and the plurality of pixel units are configured to emit light to pass through portions of the fingerprint identification substrate, which are positioned between the plurality of fingerprint identification units.

14. The display panel according to claim 11, further comprising another base substrate opposite to the fingerprint identification substrate, and the display unit array is positioned on a side of the another base substrate facing to the fingerprint identification substrate.

15. The display panel according to claim 11, further comprising a polarizing film layer and a protective cover board which are positioned on a side of the fingerprint identification substrate facing away from the fingerprint identification substrate, and an optical adhesive layer positioned between the polarizing film layer and the protective cover board.

16. A display apparatus, comprising the display panel according to claim 11.

17. A fabrication method of a fingerprint identification substrate, comprising:

forming a photosensitive sense electrode on a base substrate, wherein the photosensitive sense electrode is configured to convert light to a current signal; and

forming a thin film transistor on the photosensitive sense electrode, wherein the photosensitive sense electrode is positioned between the base substrate and the thin film transistor, and the photosensitive sense electrode is electrically connected with a source electrode or a drain electrode of the thin film transistor, and the photosensitive sense electrode and a gate electrode, an active layer and the source electrode of the thin film transistor are located on the base substrate in sequence in a direction substantially perpendicular to the base substrate.

18. The method according to claim 17, wherein the photosensitive sense electrode and each of the gate electrode, the active layer, the source electrode, and the drain electrode of the thin film transistor overlap with each other in the direction substantially perpendicular to the base substrate.

19. The method according to claim 17, further comprising:

forming a signal line electrically connected with the photosensitive sense electrode, wherein the signal line and a gate electrode of the thin film transistor are simultaneously formed on the same layer.

20. The method according to claim 17, before the photosensitive sense electrode is formed, further comprising:

forming a first transparent electrode on the base substrate,

wherein the first transparent electrode is in direct contact with the photosensitive sense electrode; and

the signal line is electrically connected with the photosensitive sense electrode via the first transparent electrode.