Bi-sided pattern processor
First Claim
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1. A bi-sided pattern processor, comprising:
- an input for transferring at least a first portion of a first pattern;
a plurality of storage-processing units (SPU'"'"'s) communicatively coupled with said input, each of said SPU'"'"'s comprising at least a memory array and a pattern-processing circuit, wherein said memory array stores at least a second portion of a second pattern, said pattern-processing circuit performs pattern processing for said first and second patterns;
a semiconductor substrate with first and second surfaces, wherein said memory array is disposed on said first surface, said pattern-processing circuit is disposed on said second surface, said memory array and said pattern-processing circuit are communicatively coupled by a plurality of inter-surface connections.
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Abstract
A bi-sided pattern processor comprises a plurality of storage-processing units (SPU'"'"'s). Each of the SPU'"'"'s comprises at least a memory array and a pattern-processing circuit. The preferred pattern processor further comprises a semiconductor substrate with opposing first and second surfaces. The memory array is disposed on the first surface, whereas the pattern-processing circuit is disposed on the second surface. The memory array stores patterns; the pattern-processing circuit processes these patterns; and, they are communicatively coupled by a plurality of inter-surface connections.
29 Citations
20 Claims
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1. A bi-sided pattern processor, comprising:
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an input for transferring at least a first portion of a first pattern; a plurality of storage-processing units (SPU'"'"'s) communicatively coupled with said input, each of said SPU'"'"'s comprising at least a memory array and a pattern-processing circuit, wherein said memory array stores at least a second portion of a second pattern, said pattern-processing circuit performs pattern processing for said first and second patterns; a semiconductor substrate with first and second surfaces, wherein said memory array is disposed on said first surface, said pattern-processing circuit is disposed on said second surface, said memory array and said pattern-processing circuit are communicatively coupled by a plurality of inter-surface connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification