Component carrier and method to produce said component carrier

• US 10,716,201 B2
• Filed: 06/07/2017
• Issued: 07/14/2020
• Est. Priority Date: 06/08/2016
• Status: Active Grant

• Current Assignee: AT&S Austria Technologie & Systemtechnik AG
• Original Assignee: AT&S Austria Technologie & Systemtechnik AG
• Inventors: Park, Hyung Wook
• Primary Examiner(s): Buttar, Mandeep S
• Application Number:
  US15/616,717
• Publication Number:
  US 20170359889A1
• Time in Patent Office: 1,133 Days
• Field of Search: 361717, 361704, 361708, 361709, 361710, 361713, 361719, 257777, 257712, 438106, 438107, 438113, 438121, 438125, 438 15, 438 25, 438 51
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1635 Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence

Abstract

The invention relates to a component carrier for an electronic device, the component carrier comprising at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, characterized in that the heat spreader layer forms at least an outside section of a casing of said electronic device. Also an electronic device that comprises at least one component carrier according to the invention, as well as a method to produce a respective component carrier are indicated.

Claims

1. A component carrier formed of a printed circuit board, an intermediate printed circuit board product, or an IC-substrate disposed in an electronic device wherein the electronic device comprises a casing on the outside of the component carrier wherein the casing further comprises a first component and a second component;

and wherein the component carrier is a multi-layer component carrier that further comprises at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier such that the at least one heat-releasing component does not extend through the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, wherein the heat spreader layer is one carrier layer of the multi-layer component carrier and forms the second component of the casing of said electronic device.

2. The component carrier according to claim 1, wherein the heat spreader layer is arranged as outer carrier layer forming an outside surface of the component carrier.

3. The component carrier according to claim 1, wherein the at least one embedded heat-releasing component adjoins to the heat spreader layer.

4. The component carrier according to claim 1, wherein the at least one embedded heat-releasing component is directly mounted on the heat spreader layer.

5. The component carrier according to claim 1, wherein the heat spreader layer is a core layer made of a solid material.

6. The component carrier according to claim 1, wherein the heat spreader layer is made of a composite material.

7. The component carrier according to claim 1, wherein at least one battery is integrated within the component carrier.

8. The component carrier according to claim 1, wherein the heat spreader layer is at least partly covered by a sealing means that protects the heat spreader layer.

9. The component carrier according to claim 8, wherein the sealing means at least temporarily protects the heat spreader layer during manufacture.

10. The component carrier according to claim 1, wherein the heat spreader layer is at least partly covered by a surface-finishing means that is attached to the heat spreader layer and patterns its surface.

11. An electronic device, comprising at least one component carrier according to claim 1, wherein at least one heat-releasing component is embedded in the component carrier and thermoconductively coupled to a heat spreader layer, wherein the heat spreader layer forms at least a section of the casing of said electronic device.

12. The electronic device according to claim 11, wherein the at least one heat-releasing component adjoins to or is directly mounted on the heat spreader layer.

13. The electronic device according to claim 11, wherein the heat-releasing component comprises an inlay structure, preferably an inlay structure made of copper, that enhances heat transfer.

14. The component carrier according to claim 5, wherein the heat spreader layer is made of metal.

15. The component carrier according to claim 6, wherein the heat spreader layer is made of a carbon-containing composite material.