Light bulb

• US 10,720,414 B2
• Filed: 02/19/2020
• Issued: 07/21/2020
• Est. Priority Date: 08/15/2012
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Hsieh, Min Hsun
• Primary Examiner(s): Miller, Jami Valentine
• Application Number:
  US16/794,861
• Publication Number:
  US 20200185362A1
• Time in Patent Office: 153 Days
• Field of Search: 257 88
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21W 2121/00 Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light bulb includes a base, a filament coupled to the base and a cover covering the filament. The filament includes a transparent structure, optoelectronic units arranged on the transparent structure in sequence, each including a side surface, a first and second bonding pad formed on a top side of one of the optoelectronic units, a third and fourth bonding pad formed on a top side of another optoelectronic unit, conductive elements, one of the conductive elements including a bottom surface directly connecting the first and third bonding pads without covering the side surfaces of the one and the another of the optoelectronic units, and a top surface opposite to the bottom surface, the transparent structure continuously covering the optoelectronic units and the conductive elements without directly contacting the top surfaces of the conductive elements, first and seconds terminal electrically connected to the optoelectronic units.

Claims

1. A light bulb, comprising:

a base;

a first filament coupled to the base, comprising;

a transparent structure;

a plurality of optoelectronic units arranged on the transparent structure in a sequence configuration, each of the plurality of optoelectronic units comprising a side surface;

a first bonding pad and a second bonding pad formed on a top side of one of the plurality of optoelectronic units;

a third bonding pad and a fourth bonding pad formed on a top side of another of the plurality of optoelectronic units;

a plurality of conductive elements spaced apart from each other, wherein one of the plurality of conductive elements comprises a bottom surface directly connecting the first bonding pad formed on the one of the plurality of optoelectronic units and the third bonding pad formed on the another of the plurality of optoelectronic units without covering the side surfaces of the one and the another of the plurality of optoelectronic units, and a top surface opposite to the bottom surface, wherein the transparent structure continuously covers the plurality of optoelectronic units and the plurality of conductive elements without directly contacting the top surfaces of the plurality of conductive elements;

a first terminal electrically connected to and located adjacent to a first of the plurality of optoelectronic units in the sequence configuration without overlapping with each other; and

a second terminal electrically connected to and located adjacent to a last of the plurality of optoelectronic units in the sequence configuration; and

a cover covering the filament.

2. The light bulb of claim 1, further comprising a wavelength converting material arranged within the transparent structure.

3. The light bulb of claim 2, wherein the wavelength converting material directly covers the one of the plurality of optoelectronic units.

4. The light bulb of claim 2, wherein the one of the plurality of optoelectronic units comprises a bottom side opposite to the top side, and the wavelength converting material is arranged under the bottom side, and covers the side surface.

5. The light bulb of claim 2, wherein each of the plurality of conductive elements comprises an outer side surface which is not covered by the transparent structure.

6. The light bulb of claim 5, further comprising another wavelength converting material arranged on the top side of the one of the plurality of optoelectronic units.

7. The light bulb of claim 6, wherein each outer side surface of the the plurality of conductive elements is not covered by the another wavelength converting material.

8. The light bulb of claim 1, further comprising a second filament coupled to the base, and wherein the first filament and the second filament are not parallel with each other.

9. The light bulb of claim 8, wherein at least one of the first filament and the second filament is tilted relative to the base.

10. The light bulb of claim 1, wherein the first filament and the second filament is not directly connected to the base.

11. The light bulb of claim 1, wherein each of the plurality of conductive elements has a length larger than a corresponding one of the plurality of optoelectronic units.

12. The light bulb of claim 8, wherein the first filament and the second filament face different directions.

13. The light bulb of claim 1, wherein the transparent structure is formed in a stripe shape.

14. The light bulb of claim 1, wherein the transparent structure has a curved shape.

15. The light bulb of claim 1, wherein the transparent structure has a melting point higher than an operation temperature of the plurality of optoelectronic units.

16. The light bulb of claim 1, wherein the transparent structure directly contacts the side surface of each of the plurality of optoelectronic units.

17. The light bulb of claim 1, wherein the first filament is flexible.

18. The light bulb of claim 1, wherein the plurality of optoelectronic units is embedded in the transparent structure.

19. The light bulb of claim 1, wherein the plurality of optoelectronic units is connected in series.

20. The light bulb of claim 1, wherein the plurality of optoelectronic units is connected in parallel.