Electronic display with cooling

• US 10,721,836 B2
• Filed: 12/09/2019
• Issued: 07/21/2020
• Est. Priority Date: 03/03/2008
• Status: Active Grant

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Dunn, William, Hubbard, Tim
• Primary Examiner(s): Gandhi, Jayprakash N
• Assistant Examiner(s): Matey, Michael A
• Application Number:
  US16/708,260
• Publication Number:
  US 20200154597A1
• Time in Patent Office: 225 Days
• CPC Class Codes: F28D 9/00 Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall F28F3/083, F28F3/086 take precedence
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: G02F 1/133385 with cooling means, e.g. fans
• CPC Class Codes: H05K 7/20136 Forced ventilation, e.g. by fans H05K7/202 takes precedence
• CPC Class Codes: H05K 7/20163 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
• CPC Class Codes: H05K 7/202 Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

An electronic image assembly cooling system includes an enclosure having an electronic image assembly mounting space located therein. A closed loop gas circulation path and an open loop air flow path are provided to effectuate cooling. A common heat exchanger is located in gaseous communication with both the closed loop gas circulation path and the open loop air flow path. The closed loop gas circulation path encircles the electronic image assembly mounting space within the enclosure, while the open loop ambient air flow path facilitates removal of heat from gas circulating within the closed loop gas circulation path. A second open loop air flow path may pass through the enclosure and through a gap located rearward of the electronic image assembly mounting space to assist with heat removal when an electronic image assembly is mounted in the enclosure.

Claims

1. A cooling system for an electronic image assembly, the cooling system comprising:

an enclosure for receiving the electronic image assembly;

an electronic image assembly mounting space within the enclosure;

a transparent display surface forming a front of the enclosure, the transparent display surface located forward of and at some distance from the electronic image assembly mounting space;

an open loop air flow path passing through the enclosure rearward of the electronic image assembly mounting space;

a closed loop gas circulation path contained within the enclosure and encircling the electronic image assembly mounting space;

a common heat exchanger within the enclosure, the heat exchanger located rearward of and spaced apart from the electronic image assembly mounting space and in the pathway of both the closed loop gas circulation path and the open loop air flow path;

a gas circulation device positioned to force circulating gas around the closed loop gas circulation path and through the common heat exchanger; and

an air circulation device positioned to force ambient air through the open loop air flow path and through the common heat exchanger.

2. The cooling system of claim 1, further comprising:

a substantially planar surface within the enclosure, the substantially planar surface located rearward of and at some distance from the electronic image assembly mounting space;

a gap defined between the electronic image assembly mounting space and the substantially planar surface;

an air inlet and an air outlet passing through the enclosure and in gaseous communication with the gap; and

the air circulation device positioned to force ambient air through the gap;

wherein the gap forms a second open loop air flow path through the enclosure.

3. The cooling system of claim 2, wherein the substantially planar surface is a plate.

4. The cooling system of claim 2, wherein the substantially planar surface is a portion of the heat exchanger.

5. The cooling system of claim 1, wherein a front channel of the closed loop gas circulation path resides between the transparent display surface and the electronic image assembly mounting space.

6. The cooling system of claim 5, wherein a front portion of the electronic image assembly acts as a rear surface of the front channel when the electronic image assembly is installed in the electronic image assembly mounting space.

7. The cooling system of claim 1, wherein the gas circulation device and the air circulation device are fan assemblies.

8. The cooling system of claim 1, wherein the open loop air flow path and the closed loop gas circulation path pass through the heat exchanger in opposite directions.

9. The cooling system of claim 1, wherein:

the common heat exchanger includes first and second gas pathways, the first and second gas pathways being isolated from each other;

where the first gas pathways are in gaseous communication with the open loop air flow path; and

where the second gas pathways are in gaseous communication with the closed loop gas circulation path.

10. A cooling system for an electronic image assembly, the cooling system comprising:

an enclosure for receiving the electronic image assembly;

an electronic image assembly mounting space within the enclosure;

a transparent display surface forming a front of the enclosure, the transparent display surface located forward of and at some distance from the electronic image assembly mounting space;

a closed loop gas circulation path contained within the enclosure and encircling the electronic image assembly mounting space;

a first open loop air flow path passing through the enclosure rearward of the electronic image assembly mounting space;

a common heat exchanger within the enclosure, the common heat exchanger located rearward of and spaced apart from the electronic image assembly mounting space and in the pathway of both the closed loop gas circulation path and the first open loop air flow path;

a substantially planar surface within the enclosure, the substantially planar surface located rearward of and at some distance from the electronic image assembly mounting space so as to define a gap between the electronic image assembly mounting space and the substantially planar surface;

a second open loop air flow path passing through the enclosure and through the gap;

at least one fan positioned to force circulating gas around the closed loop gas circulation path and through the common heat exchanger;

at least one fan positioned to force ambient air through the first open loop air flow path and through the common heat exchanger; and

at least one fan positioned to force ambient air through the second open loop air flow path.

11. The cooling system of claim 10, wherein the substantially planar surface is a plate.

12. The cooling system of claim 10, wherein the substantially planar surface is a portion of the common heat exchanger.

13. The cooling system of claim 10, wherein a front channel of the closed loop gas circulation path resides between the transparent display surface and the electronic image assembly mounting space.

14. The cooling system of claim 13, wherein a front portion of the electronic image assembly acts as a rear surface of the front channel when the electronic image assembly is installed in the electronic image assembly mounting space.

15. The cooling system of claim 10, wherein:

the common heat exchanger includes first and second gas pathways, the first and second gas pathways being isolated from each other;

where the first gas pathways are in gaseous communication with the open loop air flow path; and

where the second gas pathways are in gaseous communication with the closed loop gas circulation path.

16. The cooling system of claim 10, wherein the enclosure further includes:

a removable rear cover;

side walls; and

at least one open loop air inlet and at least one open loop air outlet.

17. A cooling system for an electronic image assembly, the cooling system comprising:

an enclosure for receiving the electronic image assembly;

an electronic image assembly mounting space within the enclosure;

a transparent display surface forming a front of the enclosure, the display surface located forward of and at some distance from the electronic image assembly mounting space;

a closed loop gas circulation path contained within the enclosure and encircling the electronic image assembly mounting space, a front channel of the closed loop gas circulation path residing between the transparent display surface and the electronic image assembly mounting space;

a first open loop air flow path passing through the enclosure rearward of the electronic image assembly mounting space;

a common heat exchanger within the enclosure, the heat exchanger located rearward of and spaced apart from the electronic image assembly mounting space and in the pathway of both the closed loop gas circulation path and the first open loop air flow path;

a plate located within the enclosure rearward of and at some distance from the electronic image assembly mounting space so as to define a gap between the electronic image assembly mounting space and the plate;

a second open loop air flow path passing through the enclosure and through the gap;

at least one fan positioned to force circulating gas around the closed loop gas circulation path and through the common heat exchanger;

at least one fan positioned to force ambient air through the first open loop air flow path and through the common heat exchanger; and

at least one fan positioned to force ambient air through the second open loop air flow path.

18. The cooling system of claim 17, wherein the plate is a front wall of the heat exchanger.

19. The cooling system of claim 17, wherein a front portion of the electronic image assembly acts as a rear surface of the front channel when the electronic image assembly is installed in the electronic image assembly mounting space.

20. The cooling system of claim 17, wherein:

the common heat exchanger includes first and second gas pathways, the first and second gas pathways being isolated from each other;

where the first gas pathways are in gaseous communication with the open loop air flow path; and

where the second gas pathways are in gaseous communication with the closed loop gas circulation path.