Methods and apparatus for magnetic sensor having an externally accessible coil

• US 10,725,100 B2
• Filed: 03/15/2013
• Issued: 07/28/2020
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Milano, Shaun D., Doogue, Michael C., Taylor, William P.
• Primary Examiner(s): Rodak, Lee E
• Application Number:
  US13/837,982
• Publication Number:
  US 20140266181A1
• Time in Patent Office: 2,692 Days
• Field of Search: 324117 H, 32420711, 3242072-20726, 324244-263
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 33/0017 Means for compensating offset magnetic fields or the magnetic flux to be measured; Means for generating calibration magnetic fields
• CPC Class Codes: G01R 33/0035 Calibration of single magnetic sensors, e.g. integrated calibration
• CPC Class Codes: G01R 33/02 Measuring direction or magnitude of magnetic fields or magnetic flux G01R33/20 takes precedence
• CPC Class Codes: G01R 33/07 Hall effect devices

Abstract

Methods and apparatus for magnetic field sensor having a sensing element, an analog circuit path coupled to the sensing element for generating an output voltage in response to a magnetic field applied to the sensing element, and a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor.

Claims

1. A magnetic field sensor IC package, comprising:

a semiconductor die having an active surface;

a sensing element formed in the active surface of the semiconductor die;

an analog circuit path including analog circuitry in the active surface of the semiconductor die coupled to the sensing element for generating an output voltage proportional to a magnetic field applied to the sensing element;

a diagnostic IO pin coupled to a diagnostic module, which is coupled to a voltage IO pin, wherein the diagnostic module is coupled to a threshold module that provides a normal operation threshold corresponding to normal operation and a diagnostic threshold corresponding to diagnostic testing, wherein a switch controls the voltage IO pin;

a coil in proximity to the sensing element and coupled to the diagnostic module, the coil having a first terminal that is accessible external to the magnetic field sensor IC package, wherein the coil is formed on the semiconductor die, wherein the coil is disposed proximate the sensing element on the semiconductor die, wherein a signal applied to the coil forces the magnetic field sensor IC package into a failure mode by a level of current of the signal applied to the coil during the diagnostic testing for verifying detection of the failure mode that was forced by the current level of the coil,

wherein during the normal operation the output voltage from the sensing element is compared with the normal operation threshold and an output of the normal operation comparison is provided to the voltage IO pin, and wherein during the diagnostic testing the output voltage from the sensing element is compared to the diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin.

2. The magnetic field sensor according to claim 1, wherein the sensing element comprises a magnetic sensing element.

3. The magnetic field sensor according to claim 2, wherein the magnetic sensing element comprises a Hall element.

4. The magnetic field sensor according to claim 2, wherein the magnetic sensing element comprises a magnetoresistance element.

5. The magnetic field sensor according to claim 1, wherein the magnetic field sensor comprises a linear current sensor.

6. The magnetic field sensor according to claim 1, wherein the magnetic field sensor comprises a closed loop magnetic sensor.

7. The magnetic field sensor according to claim 1, wherein the coil is wound at least in part around the sensing element, and wherein the sensing element comprises a Hall element.

8. The magnetic field sensor according to claim 1, wherein the magnetic field sensor has a linear output that starts at Vcc/2.

9. A magnetic field sensor IC package, comprising:

a semiconductor die;

a sensing element formed in the semiconductor die;

an analog circuit path including analog circuitry in an active surface of the semiconductor die coupled to the sensing element for generating an output voltage proportional to a magnetic field applied to the sensing element; and

a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor IC package,

wherein the coil is located on an opposite side of a lead frame from the semiconductor die and enclosed in an over molded package, wherein the coil is configured to carry a current to generate a magnetic field having an intensity corresponding to the level of current, wherein the current and the generated magnetic field can vary, wherein a signal applied to the coil forces the magnetic field sensor IC package into a failure mode by a level of current applied to the coil for verifying detection of the failure mode that was forced by the current level of the coil,

wherein during a normal operation the output voltage from the sensing element is compared with a normal operation threshold and an output of the normal operation comparison is provided to a voltage IO pin, and wherein during a diagnostic testing the output voltage from the sensing element is compared to a diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin, wherein the diagnostic mode includes the failure mode.

10. The magnetic field sensor of claim 9, wherein the coil is coupled externally to the IC package of the magnetic field sensor to provide a closed loop current sensor.

11. A magnetic field sensor IC package comprising:

a lead frame having a first surface and a second opposing surface;

a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame, wherein the first surface is an active surface of the semiconductor die;

a non-conductive mold material enclosing the die and at least a portion of the lead frame; and

a conductive coil secured to the non-conductive mold material, wherein the coil has at least one terminal to provide a connection external to the magnetic field sensor, wherein the coil is configured to carry a current to generate a magnetic field having an intensity corresponding to the level of current, wherein the current and the magnetic field can vary, wherein a signal applied to the coil forces the magnetic field sensor IC package into a failure mode by a level of current applied to the coil for verifying detection of the failure mode that was forced by the current level of the coil,

wherein during a normal operation an output voltage from the sensing element is compared with a normal operation threshold and an output of the normal operation comparison is provided to a voltage IO pin, and wherein during a diagnostic testing the output voltage from the sensing element is compared to a diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin, wherein the diagnostic mode includes the failure mode.

12. The magnetic field sensor of claim 11, wherein the non-conductive mold material encloses the coil.

13. The magnetic field sensor of claim 11, further comprising a second mold material secured to the non-conductive mold material.

14. The magnetic field sensor of claim 13, wherein the second mold material is ferromagnetic.

15. The magnetic field sensor of claim 11 wherein a housing encloses said coil.

16. A magnetic field sensor IC package, comprising:

a sensing element formed in an active surface of a semiconductor die;

an analog circuit path including analog circuitry in the active surface of the semiconductor die coupled to the sensing element for generating an output voltage proportional to a magnetic field applied to the sensing element; and

a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor, wherein the coil is formed on the semiconductor die,

wherein the IC package has exactly four pins, wherein a first one of the four pins is Vcc, a second one of the pins is ground and is electrically coupled to one end of the coil, a third one of the pins is voltage IO, and a fourth one of the pins is connected to the other end of the coil, wherein the coil is disposed proximate the sensing element on the semiconductor die, wherein a signal applied to the coil forces the magnetic field sensor IC package into a failure mode by a level of current applied to the coil for verifying detection of the failure mode that was forced by the current level of the coil,

wherein during a normal operation the output voltage from the sensing element is compared with a normal operation threshold and an output of the normal operation comparison is provided to the voltage IO pin, and wherein during a diagnostic testing the output voltage from the sensing element is compared to a diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin, wherein the diagnostic mode includes the failure mode.

17. A magnetic field sensor IC package, comprising:

a leadframe having opposing first and second sides;

a sensing element integrated in an active surface of a die that is disposed on the first side of the leadframe;

an analog circuit path including analog circuitry in the active surface of the semiconductor die coupled to the sensing element for generating an output voltage proportional to a magnetic field applied to the sensing element; and

a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor, wherein the coil is disposed on the second side of the leadframe, wherein the coil is configured to carry a current to generate a magnetic field having an intensity corresponding to the level of current, wherein the current and the magnetic field can vary, wherein a signal applied to the coil forces the magnetic field sensor IC package into a failure mode by a level of current applied to the coil for verifying detection of the failure mode that was forced by the current level of the coil,

wherein during a normal operation the output voltage from the sensing element is compared with a normal operation threshold and an output of the normal operation comparison is provided to a voltage IO pin, and wherein during diagnostic testing the output voltage from the sensing element is compared to a diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin, wherein the diagnostic mode includes the failure mode.

18. The IC package according to claim 17, wherein the die is contained in a first mold material and the coil is contained in a second mold material.

19. The IC package according to claim 18, wherein the second mold material is ferromagnetic.

20. A method, comprising:

providing a magnetic field sensor IC package, comprising;

a semiconductor die;

a sensing element formed in an active surface of the semiconductor die;

an analog circuit path including analog circuitry in the active surface of the semiconductor die coupled to the sensing element for generating an output voltage proportional to a magnetic field applied to the sensing element, the analog circuit path including analog circuitry formed at least in part on the active surface of the semiconductor die; and

a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor IC package, wherein the coil is formed on the semiconductor die, wherein the coil is disposed proximate the sensing element on the semiconductor die;

controlling a signal applied to the coil to analyze a programmed sensitivity of the analog circuit path; and

applying a signal to the coil to force the magnetic field sensor IC package into a failure mode by a level of current applied to the coil for verifying detection of the failure mode that was forced by the current level of the coil,

wherein during a normal operation the output voltage from the sensing element is compared with a normal operation threshold and an output of the normal operation comparison is provided to an voltage IO pin, and wherein during a diagnostic testing the output voltage from the sensing element is compared to a diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin, wherein the diagnostic mode includes the failure mode.

21. The method according to claim 20, further including controlling the signal applied to the coil to test offset cancellation.

22. The method according to claim 20, further including canceling an effect of the magnetic field generated by the coil in an output of the magnetic field sensor IC package.

23. The method according to claim 20, further including testing for drift in a gain of the analog circuit path on the output voltage.

24. The method according to claim 20, further including testing for drift in a zero field output signal.

25. A magnetic field sensor IC package, comprising:

a semiconductor die having an active surface;

a leadframe on which the die is disposed;

a sensing element formed in the active surface of the semiconductor die;

an analog circuit path including analog circuitry in the active surface of the semiconductor die coupled to the sensing element for generating an output voltage proportional to a magnetic field applied to the sensing element; and

a multi-turn coil in proximity to the sensing element, wherein the coil is located on an opposite side of the leadframe as the die, the coil having a first terminal that is accessible external to the magnetic field sensor IC package, wherein a signal applied to coil forces the magnetic field sensor IC package into a failure mode by a level of current applied to the coil to verify detection of the failure mode,

wherein during a normal operation the output voltage from the sensing element is compared with a normal operation threshold and an output of the normal operation comparison is provided to an voltage IO pin, and wherein during diagnostic testing the output voltage from the sensing element is compared to a diagnostic threshold and an output of the diagnostic testing comparison is provided to the voltage IO pin, wherein the diagnostic mode includes the failure mode.