Optical image stabilization (OIS) unit of a camera module

• US 10,725,314 B2
• Filed: 03/19/2019
• Issued: 07/28/2020
• Est. Priority Date: 10/31/2011
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Oh, Sangyun
• Primary Examiner(s): Selby, Gevell V
• Application Number:
  US16/357,801
• Publication Number:
  US 20190212575A1
• Time in Patent Office: 497 Days
• CPC Class Codes: G02B 27/646 compensating for small deviations, e.g. due to vibration or shake movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68
• CPC Class Codes: G02B 7/09 adapted for automatic focusing or varying magnification
• CPC Class Codes: G03B 13/36 Autofocus systems
• CPC Class Codes: G03B 2205/0007 Movement of one or more optical elements for control of motion blur
• CPC Class Codes: G03B 2205/0069 using electromagnetic actuators, e.g. voice coils
• CPC Class Codes: G03B 5/00 Adjustment of optical system relative to image or object surface other than for focusing
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/67 Focus control based on electronic image sensor signals
• CPC Class Codes: H04N 23/685 performed by mechanical compensation

Abstract

An Optical Image Stabilization unit including a wire connecting a housing to a holder module, a bobbin disposed inside the outer blade, a spring member disposed at the outer blade to support a movement of the bobbin in a direction along an optical axis, a first coil disposed at a periphery of the bobbin, a magnet moving the bobbin relative to the holder module by interacting with the first coil, a second coil moving the holder module relative to the housing by interacting with the magnet, a first solder portion disposed at a distal end of the wire to couple the wire to the housing, a second solder portion disposed at the other distal end of the wire to couple the wire to the holder module, and a buffer portion disposed at a part of the wire by being distanced from at least one of the first solder portion and the second solder portion to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module.

Claims

1. An OIS (Optical Image Stabilization) unit, comprising:

a housing comprising a base and a first substrate;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis;

a wire connecting the housing and the holder module;

a first coil disposed on a periphery of the bobbin;

a magnet configured to move the bobbin relative to the holder module by interacting with the first coil;

a second coil configured to move the holder module relative to the housing by interacting with the magnet;

a solder coupled to the wire to connect the wire to at least one of the housing and the holder module; and

a buffer portion disposed on the wire and encompassing the solder,

wherein the buffer portion comprises an adhesive material.

2. The OIS unit of claim 1, wherein the buffer portion is disposed along a peripheral surface of the solder.

3. The OIS unit of claim 1, wherein a length of the buffer portion in a longitudinal direction of the wire is greater than a length of the solder in the longitudinal direction of the wire.

4. The OIS unit of claim 1, wherein a width of the buffer portion in a direction perpendicular to a longitudinal direction of the wire is greater than a width of the solder in the direction perpendicular to the longitudinal direction of the wire.

5. The OIS unit of claim 1, wherein the solder comprises a first solder disposed at a distal end of the wire to couple the wire to the housing, and a second solder disposed at the other distal end of the wire to couple the wire to the holder module.

6. The OIS unit of claim 5, wherein the buffer portion comprises a first portion disposed between the first solder and the second solder, and a second portion extending from the first portion and disposed opposite to the first portion about the solder.

7. The OIS unit of claim 5, wherein at least a part of the buffer portion is disposed between the first solder and the spring member.

8. The OIS unit of claim 1, wherein the buffer portion wraps an outer periphery of the solder.

9. The OIS unit of claim 1, wherein the buffer portion comprises an insulation material, and

wherein the wire is formed with a metal material and having a thickness of 1 to 100 μ

m.

10. The OIS unit of claim 5, wherein a current is supplied to the first coil through the first solder and the second solder.

11. The OIS unit of claim 5, wherein the buffer portion is distanced from at least one of the first solder and the second solder to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module.

12. The OIS unit of claim 5, wherein the wire and the spring member are electrically connected through the second solder.

13. A camera module, comprising:

a PCB (printed circuit board);

an image sensor disposed on the PCB;

the OIS unit of claim 1 disposed on the PCB; and

a lens coupled to the bobbin of the OIS unit and being spaced apart from the image sensor.

14. A mobile phone, comprising the camera module of claim 13.

15. An OIS (Optical Image Stabilization) unit, comprising:

a base;

a first substrate comprising a first portion disposed above the base and a second portion downwardly extending from the first portion;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis;

a wire electrically connecting the first substrate and the spring member;

a first coil disposed on a periphery of the bobbin;

a magnet configured to move the bobbin relative to the holder module by interacting with the first coil;

a second coil configured to move the holder module relative to the housing by interacting with the magnet;

a first solder disposed at a distal end of the wire to couple the wire to the housing;

a second solder disposed at the other distal end of the wire to couple the wire to the holder module; and

a buffer portion disposed at a part of the wire and configured to wrap an outer periphery of at least one of the first solder and the second solder,

wherein the buffer portion comprises an adhesive material.

16. The OIS unit of claim 15, wherein a current is supplied to the first coil through the first solder and the second solder.

17. The OIS unit of claim 15, wherein the buffer portion is distanced from at least one of the first solder and the second solder to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module.

18. The OIS unit of claim 15, wherein the wire and the spring member are electrically connected through the second solder.

19. An OIS (Optical Image Stabilization) unit, comprising:

a housing comprising a base and a first substrate;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis;

a wire connecting the housing and the holder module;

a first coil disposed on a periphery of the bobbin;

a magnet configured to move the bobbin relative to the holder module by interacting with the first coil;

a second coil configured to move the holder module relative to the housing by interacting with the magnet;

a solder coupled to the wire to connect the wire to at least one of the housing and the holder module; and

a buffer portion disposed on the wire and encompassing the solder,

wherein a width of the buffer portion in a direction perpendicular to a longitudinal direction of the wire is greater than a width of the solder in the direction perpendicular to the longitudinal direction of the wire.

20. An OIS (Optical Image Stabilization) unit, comprising:

a housing comprising a base and a first substrate;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis;

a wire connecting the housing and the holder module;

a first coil disposed on a periphery of the bobbin;

a magnet configured to move the bobbin relative to the holder module by interacting with the first coil;

a second coil configured to move the holder module relative to the housing by interacting with the magnet;

a solder coupled to the wire to connect the wire to at least one of the housing and the holder module; and

a buffer portion disposed on the wire and encompassing the solder,

wherein the solder comprises a first solder disposed at a distal end of the wire to couple the wire to the housing, and a second solder disposed at the other distal end of the wire to couple the wire to the holder module, and

wherein the buffer portion comprises a first portion disposed between the first solder and the second solder, and a second portion extending from the first portion and disposed opposite to the first portion about the solder.

21. An OIS (Optical Image Stabilization) unit, comprising:

a housing comprising a base and a first substrate;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin to support a movement of the bobbin in a direction along an optical axis;

a wire connecting the housing and the holder module;

a first coil disposed on a periphery of the bobbin;

a magnet configured to move the bobbin relative to the holder module by interacting with the first coil;

a second coil configured to move the holder module relative to the housing by interacting with the magnet;

a solder coupled to the wire to connect the wire to at least one of the housing and the holder module; and

a buffer portion disposed on the wire and encompassing the solder,

wherein the buffer portion comprises an insulation material.