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High density pixelated-LED chips and chip array devices

  • US 10,734,363 B2
  • Filed: 10/30/2018
  • Issued: 08/04/2020
  • Est. Priority Date: 08/03/2017
  • Status: Active Grant
First Claim
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1. A pixelated-LED chip comprising:

  • an active layer comprising a plurality of active layer portions;

    a plurality of substrate portions supporting the plurality of active layer portions, wherein each substrate portion comprises a light-transmissive material, a light injection surface, and a light extraction surface, wherein the light injection surface is arranged between the active layer and the light extraction surface; and

    a plurality of anode-cathode pairs associated with the plurality of active layer portions;

    wherein each active layer portion of the plurality of active layer portions comprises a different anode-cathode pair of the plurality of anode-cathode pairs and is configured to illuminate a different substrate portion of the plurality of substrate portions and transmit light through the light extraction surface of the substrate portion, such that the plurality of active layer portions and the plurality of substrate portions form a plurality of pixels;

    wherein the light extraction surface of each substrate portion comprises a plurality of protruding features and a plurality of light extraction surface recesses, and each protruding feature of the plurality of protruding features is separated from at least one other protruding feature by a light extraction surface recess of the plurality of light extraction surface recesses; and

    wherein lateral borders between different pixels of the plurality of pixels are aligned with selected light extraction surface recesses of the plurality of light extraction surface recesses.

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