Connector with capacitive crosstalk compensation

• US 10,734,765 B2
• Filed: 10/30/2017
• Issued: 08/04/2020
• Est. Priority Date: 10/31/2016
• Status: Active Grant

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Inventors: Hammond, Jr., Bernard Harold
• Primary Examiner(s): Le, Thanh Tam T
• Application Number:
  US16/346,454
• Publication Number:
  US 20190305483A1
• Time in Patent Office: 1,009 Days
• Field of Search: 439 761, 439676, 439941, 174261, 361777
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6474 by variation of conductive properties, e.g. by dimension variations
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H05K 1/0213 Electrical arrangements not otherwise provided for
• CPC Class Codes: H05K 2201/10189 Non-printed connector

Abstract

A telecommunications connector includes a housing defining a port for receiving a plug. A circuit board has a first conductive layer and a second conductive layer, with a dielectric layer situated between the first and second conductive layers. A plurality of conductive vias extend through the circuit board, and receive a plurality of electrical connection members and a plurality of wire termination contacts. A plurality of conductive tracks electrically interconnect selected ones of the plurality of conductive vias so as to electrically connect the plurality of electrical connection members and the plurality of wire termination contacts. A crosstalk compensation arrangement provides crosstalk compensation between selected conductive tracks of the circuit board. The crosstalk compensation arrangement includes a first capacitive coupling having a first conductive plate on the first conductive layer and a second conductive plate on the second conductive layer, and a first one of the conductive vias is at least partially surrounded by the first conductive plate. The first conductive plate on the first conductive layer may further form a second capacitive coupling with third conductive plate on the second conductive layer.

Claims

1. A telecommunications connector comprising:

a plurality of electrical conductors arranged in differential pairs;

a circuit board having a first conductive layer and a second conductive layer, and a first dielectric layer situated between the first and second conductive layers,

a cross-talk compensation arrangement for applying capacitance between at least some of the electrical conductors, the cross-talk compensation arrangement including a first capacitive coupling formed by a first conductive plate on the first conductive layer and a second conductive plate on the second conductive layer, and a second capacitive coupling formed by the first conductive plate and a third conductive plate on the second conductive layer.

2. The telecommunications connector of claim 1, wherein the first conductive plate overlaps the second and third conductive plates.

3. The telecommunications connector of claim 1, wherein the cross-talk compensation arrangement includes a third capacitive coupling having inter-digitated capacitor fingers.

4. The telecommunications connector of claim 3, further comprising:

a plurality of conductive vias extending through the circuit board;

a plurality of electrical connection members received by respective ones of the plurality of conductive vias;

a plurality of wire termination contacts received by respective ones of the plurality of conductive vias; and

a plurality of conductive tracks electrically connecting selected ones of the plurality of conductive vias so as to electrically connect the plurality of electrical connection members and the plurality of wire termination contacts;

wherein a first one of the conductive vias is at least partially surrounded by the first conductive plate.

5. The telecommunications connector of claim 4, wherein the conductive tracks each define a first width, and the first conductive plate defines a second width that is at least two-times greater than the first width.

6. The telecommunications connector of claim 4, wherein the conductive tracks each define a first width, and the inter-digitated capacitor fingers each define a second width that is less than the first width.

7. The telecommunications connector of claim 1, wherein the first and second capacitive couplings connect between different wires of a first one of the differential pairs and a second one of the differential pairs.

8. The telecommunications connector of claim 7, wherein the first wire pair is a 3-6 wire pair and the second wire pair is a 4-5 wire pair.

9. The telecommunications connector of claim 1, wherein the circuit board further includes third and fourth conductive layers, wherein the first conductive layer is a bottom layer.

10. The telecommunications connector of claim 1, wherein the wire termination contacts are insulation displacement connectors.

11. The telecommunications connector of claim 1, wherein the first conductive plate defines a first area, the second conductive plate defines a second area, and the third conductive plate defines a third area, wherein the second area is less than the first area.

12. The telecommunications connector of claim 10, wherein the third area is less than the first area.

13. The telecommunications connector of claim 1, wherein the first conductive plate is electrically connected to a first electrical conductor of a first differential pair, the second conductive plate is electrically connected to a second electrical conductor of a second differential pair, and the third conductive plate is electrically connected to a third electrical conductor of a third differential pair.

14. A telecommunications connector comprising:

a housing defining a port for receiving a plug;

a circuit board having a first conductive layer and a second conductive layer, and a dielectric layer situated between the first and second conductive layers,

a plurality of conductive vi as extending through the circuit board;

a plurality of electrical connection members received by respective ones of the plurality of conductive vias;

a plurality of wire termination contacts received by respective ones of the plurality of conductive vias;

a plurality of conductive tracks electrically connecting selected ones of the plurality of conductive vias to electrically connect the plurality of electrical connection members and the plurality of wire termination contacts;

a crosstalk compensation arrangement that provides crosstalk compensation between selected conductive tracks of the circuit board, the crosstalk compensation arrangement including a first capacitive coupling having a first conductive plate on the first conductive layer and a second conductive plate on the second conductive layer, wherein a first one of the conductive vias is at least partially surrounded by the first conductive plate.

15. The telecommunications connector of claim 14, wherein the first one of the conductive vias is completely surrounded by the first conductive plate.

16. The telecommunications connector of claim 14, further comprising a second capacitive coupling having a third conductive plate on the second conductive layer, wherein the first conductive plate overlaps the second and third conductive plates.

17. The telecommunications connector of claim 14, wherein the electrical connection members extend from the first layer.

18. The telecommunications connector of claim 14, wherein:

the circuit board further includes third and fourth conductive layers;

the first conductive layer is a bottom layer;

fourth conductive layer is a top layer;

the second and third conductive layers are middle layers positioned between the top and bottom layers;

the electrical connection members extend from the bottom layer; and

the wire termination contacts extend from the top layer.

19. The telecommunications connector of claim 15, wherein:

the plurality of conductive vias include a plurality of first conductive vias receiving the respective ones of the plurality of the electrical connection members, and a plurality of second conductive vias receiving the respective ones of the plurality of wire termination contacts; and

the plurality of conductive tracks electrically connect the plurality of first conductive vias to respective ones of the second conductive vias.

20. The telecommunications connector of claim 15, wherein the first via is inwardly offset from a perimeter edge of the first conductive plate by a distance equal to or greater than a diameter of the first via.

21. The telecommunications connector of claim 15, wherein the first conductive plate is rectangular, and wherein the first via is inwardly offset from a width perimeter edge of the first conductive plate by a distance equal to or greater than 1.0 percent of a length of the first conductive plate.

22. A telecommunications connector comprising:

a housing defining a port for receiving a plug;

a circuit board having a bottom layer, a bottom-middle layer, a top-middle layer and a top conductive layer, wherein the bottom-middle layer is between the bottom layer and the top-middle layer, and the top middle layer is between the top layer and the bottom middle layer;

a dielectric layer between the bottom and the bottom-middle layers,

a plurality of first conductive vias extending through the circuit board;

a plurality of second conductive vias extending through the circuit board;

a plurality of electrical connection members received by respective ones of the plurality, of first conductive vias and extending from the bottom layer;

a plurality of wire termination contacts received by respective ones of the plurality of second conductive vias and extending from the top layer;

a plurality of conductive tracks on the top and bottom layers electrically connecting the plurality of first conductive vias to respective ones of the plurality of second conductive vias;

a crosstalk compensation arrangement that provides crosstalk compensation between selected ones of the plurality of conductive tracks, the crosstalk compensation arrangement including a first capacitive coupling formed by a first conductive plate on the bottom layer and a second conductive plate on the bottom-middle layer, and a second capacitive coupling formed by the first conductive plate and a third conductive plate on the bottom-middle layer, wherein the first conductive plate overlaps the second and third conductive plates.

23. The telecommunications connector of claim 22, wherein a first one of the first conductive vias is at least partially surrounded by the first conductive plate.

24. The telecommunications connector of claim 23, wherein the first, second and third conductive plates are all electrically connected to different ones of the first and second conductive vias.