Paste providing method, soldering method and apparatus and system therefor

• US 20010000906A1
• Filed: 12/11/2000
• Published: 05/10/2001
• Est. Priority Date: 07/23/1997
• Status: Active Grant

• Current Assignee: Fumio Yoshikawa, Hideaki Sasaki, Hideyuki Fukasawa, Kenichi Hamamura, Mitsugu Shirai, Toshitaka Murakawa
• Original Assignee: Fumio Yoshikawa, Hideaki Sasaki, Hideyuki Fukasawa, Kenichi Hamamura, Mitsugu Shirai, Toshitaka Murakawa
• Inventors: Hamamura, Kenichi, Sasaki, Hideaki, Yoshikawa, Fumio, Fukasawa, Hideyuki, Murakawa, Toshitaka, Shirai, Mitsugu
• Granted Patent: US 6,533,162 B2
• Time in Patent Office: Days
• US Class Current: 228/248.1
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/0638 for viscous material feeding, e.g. solder paste feeding B23K3/0623 takes precedence
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/1233 Methods or means for supplying the conductive material and for forcing it through the screen or stencil
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections

Abstract

An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste. Parts are loaded on the through holes and lands of the printed circuit board loaded with solder paste and reflowing is carried out on the printed circuit board and paste receiving plate at the same time, so that the lead provided parts and surface mounting parts are soldered to the printed circuit board at the same time.

Claims

1. A paste providing method for supplying paste-like substance to predetermined places on a board for mounting electrical parts, comprising the steps of:

setting a printing mask, which has predetermined openings corresponding to the predetermined places on the board, on the board;

providing the paste-like substance on the printing mask;

dragging a roller along the surface of the printing mask and forcing the roller independent of dragging so as to supply the paste-like substance to the openings; and

removing the printing mask from the board.

2. A paste providing method according to

claim 1

, wherein the roller is forced to rotate so that the speed of peripheral velocity of the roller rotation is different than the speed of dragging.

3. A paste providing method according to

claim 2

, wherein the roller is forced to rotate so that the speed of peripheral velocity of the roller rotation is faster than the speed of dragging.

4. A paste providing method according to

claim 3

, wherein the speed of peripheral velocity of the roller rotation is at least approximately 4 times faster than the speed of dragging.

5. A paste providing method according to

claim 1

, further comprising the step of:

dragging a squeegee along the surface of the printing mask after the step of dragging the roller.

6. A paste providing method according to

claim 5

, wherein an attack angle of the squeegee is approximately 60°

against a surface of the printing mask.

7. A paste providing method according to

claim 5

, wherein an attack angle of the squeegee is approximately between 30°

and 45°

against a surface of the printing mask.

8. A paste providing method according to

claim 5

, wherein said dragging step includes supplying power to the roller for rotating movement.

9. A paste providing method according to

claim 8

, wherein speed of peripheral velocity of the roller rotation is different than the speed of dragging.

10. A paste providing method according to

claim 9

, wherein the speed of peripheral velocity of the roller rotation is faster than the speed of dragging.

11. A paste providing method according to

claim 10

, wherein the speed of peripheral velocity of the roller rotation is at least approximately 4 times faster than the speed of dragging.

12. A soldering method for soldering parts on a circuit board having through holes and surface mounting part lands, comprising the steps of:

setting a printing mask having predetermined openings for said through holes and surface mounting part lands on the circuit board;

providing a solder paste on the printing mask;

dragging a roller along the surface of the printing mask and forcing the roller to rotate independent of the dragging so as to supply the solder paste to the through holes and the surface mounting part lands;

removing the printing mask from the board;

loading parts on said surface mounting part lands of said circuit board and inserting leads of the parts into the through holes; and

heating and melting the solder paste on the circuit board so as to fix the parts to the circuit board.

13. A soldering method according to

claim 12

, wherein the speed of peripheral velocity of the roller rotation is different with speed of dragging.

14. A soldering method according to

claim 15

, wherein the speed of peripheral velocity of the roller rotation is faster than the speed of dragging.

15. A soldering method according to

claim 12

, the method further comprising the step of:

dragging a squeegee along the surface of the printing mask between the dragging roller step and removing the printed mask step.

16. A circuit board mounted electric parts thereon, the circuit board being formed by the steps of:

setting a printing mask having predetermined openings for said through holes and surface mounting part lands on the circuit board;

providing a solder paste on the printing mask;

dragging a roller along the surface of the printing mask and forcing to rotate independent of the dragging so as to supply the solder paste to the through holes and the surface mounting part lands;

removing the printing mask from the board;

loading parts on said surface mounting part lands of said circuit board and inserting leads of the parts into the through holes; and

heating and melting the solder paste on the circuit board so as to fix the parts to the circuit board.

17. A paste filling method for supplying paste-like substance to through holes formed in an article, comprising the steps of:

matching a printing mask having predetermined openings for the through holes; and

sweeping the paste-like substance provided on the printing mask by a roller being supplied with power for rotating movement independent of the sweeping so as to provide the paste-like substance to the through holes.