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Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners

  • US 20010001215A1
  • Filed: 12/28/2000
  • Published: 05/17/2001
  • Est. Priority Date: 10/29/1996
  • Status: Active Grant
First Claim
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1. A method for obtaining one or more chips from a semiconductor wafer, the method comprising:

  • forming one or more openings in a first surface of the semiconductor wafer along a boundary of the one or more chips, wherein the one or more openings do not go through the wafer; and

    placing the wafer into a non-contact wafer holder and thinning the wafer with a dry etch to remove material from a second side of the wafer at least until the openings become exposed on the second side.

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