MULTI-CONNECTABLE PRINTED CIRCUIT BOARD

• US 20010001747A1
• Filed: 08/31/1999
• Published: 05/24/2001
• Est. Priority Date: 08/31/1999
• Status: Active Grant

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: TRUBLOWSKI, JOHN, BAKER, JAY DEAVIS, LI, DELIN, ACHARI, ACHYUTA, NATION, BRENDA JOYCE
• Granted Patent: US 6,270,354 B2
• Time in Patent Office: Days
• US Class Current: 439/55
• CPC Class Codes: H05K 1/0292 having a modifiable lay-out, i.e. adapted for engineering changes or repair H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44/55, wherein at least the first edge region 44 is defined along the first edge 22; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55, wherein the second array 88 is substantially a duplication or a mirror image of the first array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88.

Claims

1. A multi-connectable printed circuit assembly, comprising:

(a) a printed circuit substrate having a first edge and first and second edge regions, wherein at least said first edge region is defined along said first edge;

(b) a first array of electrical connection features disposed on or within said substrate proximate said first edge region;

(c) a second array of electrical connection features disposed on or within said substrate proximate said second edge region, wherein said second array is substantially a duplication or a mirror image of said first array; and

(d) a plurality of circuit traces disposed on or within said substrate such that each electrical connection feature of said first array is connected by one of said circuit traces to a corresponding electrical connection feature of said second array.

2. A multi-connectable printed circuit assembly according to

claim 1

, wherein said first and second edge regions are defined along said first edge.

3. A multi-connectable printed circuit assembly according to

claim 1

, wherein said second edge region is defined along a second edge of said substrate.

4. A multi-connectable printed circuit assembly according to

claim 3

, wherein said first and second edges are defined on respective opposite ends of said substrate.

5. A multi-connectable printed circuit assembly according to

claim 3

, wherein said first and second edges are adjacent one another.

6. A multi-connectable printed circuit assembly according to

claim 1

, wherein each of said electrical connection features is a plated through hole, a plated blind via, or a mounting pad.

7. A multi-connectable printed circuit assembly according to

claim 1

, wherein said printed circuit substrate is made of a substantially rigid ceramic material.

8. A multi-connectable printed circuit assembly according to

claim 1

, wherein said printed circuit substrate is made of a substantially rigid polymeric material.

9. A multi-connectable printed circuit assembly according to

claim 1

, wherein said printed circuit substrate is made of a substantially flexible polymeric material.

10. A multi-connectable printed circuit assembly, comprising:

a printed circuit substrate having a first edge and first and second edge regions, wherein at least said first edge region is defined along said first edge;

a first array of electrical connection features disposed on or within said substrate proximate said first edge region;

a second array of electrical connection features disposed on or within said substrate proximate said second edge region, wherein said second array is substantially a duplication or a mirror image of said first array; and

a plurality of circuit traces disposed on or within said substrate such that each electrical connection feature of said first array is connected by one of said circuit traces to a corresponding electrical connection feature of said second array;

wherein each of said electrical connection features is a plated through hole, a plated blind via, or a mounting pad; and

wherein said printed circuit substrate is made of a substantially rigid ceramic material, a substantially rigid polymeric material, or a substantially flexible polymeric material.

11. A multi-connectable printed circuit assembly according to

claim 10

, wherein said first and second edge regions are defined along said first edge.

12. A multi-connectable printed circuit assembly according to

claim 10

, wherein said second edge region is defined along a second edge of said substrate.

13. A multi-connectable printed circuit assembly according to

claim 12

, wherein said first and second edges are defined on respective opposite ends of said substrate.

14. A multi-connectable printed circuit assembly according to

claim 12

, wherein said first and second edges are adjacent one another.

15. A multi-connectable printed circuit assembly, comprising:

a printed circuit substrate having a first edge and first and second edge regions, wherein at least said first edge region is defined along said first edge;

a first array of electrical connection features disposed on or within said substrate proximate said first edge region;

a second array of electrical connection features substantially similar to said first array disposed on or within said substrate proximate said second edge region; and

a plurality of circuit traces disposed on or within said substrate such that each electrical connection feature of said first array is connected by one of said circuit traces to a corresponding electrical connection feature of said second array.

16. A multi-connectable printed circuit assembly according to

claim 15

, wherein said first and second edge regions are defined along said first edge.

17. A multi-connectable printed circuit assembly according to

claim 15

, wherein said second edge region is defined along a second edge of said substrate.

18. A multi-connectable printed circuit assembly according to

claim 17

, wherein said first and second edges are defined on respective opposite or adjacent ends of said substrate.

19. A multi-connectable printed circuit assembly according to

claim 15

, wherein each of said electrical connection features is a plated through hole, a plated blind via, or a mounting pad.

20. A multi-connectable printed circuit assembly according to

claim 15

, wherein said printed circuit substrate is made of a substantially rigid ceramic material, a substantially rigid polymeric material, or a substantially flexible polymeric material.